Integrated diode assemblies for photovoltaic modules
Abstract
Provided are bypass diode assemblies for use in photovoltaic modules. Also provided are methods of fabricating such assemblies and a method of fabricating photovoltaic modules using such assemblies. A diode assembly may include an insulating strip, at least one lead-diode assembly having a diode and two leads, and at least two interconnecting conductors overlapping with and electrically contacting the leads of the lead-diode assembly. The insulating strip supports the lead-diode assembly and conductors and at least partially insulates these components from photovoltaic cells. Specifically, during module fabrication, the interconnecting conductors make electrical connections to the back sides of the cells through cutouts in the insulating strip. The electrical connections may be made to every cell in a row or a subset of selected cells in that row. In certain embodiments, the same interconnecting conductor is connected to two or more cells positioned in adjacent rows.
Claims
exact text as granted — not AI-modified1 .- 44 . (canceled)
45 . An integrated diode assembly comprising:
an insulating strip comprising a first surface, a second surface, and a first cutout; a first assembly comprising a first diode, wherein first diode is configured to be electrically connected through the first cutout to a first photovoltaic cell disposed adjacent to the first surface.
46 . The integrated diode assembly of claim 45 , wherein the first assembly further comprises a first diode conductor electrically connected to one electrical lead of the first diode, and a second diode conductor electrically connected another electrical lead of the first diode.
47 . The integrated diode assembly of claim 46 , wherein the first diode conductor at least partially overlaps the first cutout such that the first diode is configured to be electrically connected to the first photovoltaic cell through the first diode conductor.
48 . The integrated diode assembly of claim 47 , wherein an electrical connection between the first diode conductor and the first diode comprises an expansion joint configured to reduce stress applied to the first diode.
49 . The integrated diode assembly of claim 46 , further comprising a first interconnecting conductor disposed adjacent to the second surface, the first interconnecting conductor being electrically connected to the first diode conductor.
50 . The integrated diode assembly of claim 49 , wherein the first interconnecting conductor at least partially overlaps the first cutout such that the first diode is configured to be electrically connected to the first photovoltaic cell through the first interconnecting conductor.
51 . The integrated diode assembly of claim 49 , wherein the insulating strip comprises a folding cut portion formed by the first cutout, the folding portion attached to an opposite surface of the interconnecting conductor with respect to the first cutout.
52 . The integrated diode assembly of claim 46 , wherein the insulating strip comprises an adhesive layer provided on the second surface, the adhesive layer configured to provide mechanical support to the first assembly.
53 . The integrated diode assembly of claim 52 , wherein the insulating strip comprises a second adhesive layer provided on the first surface, the first adhesive layer configured to attach to a back side of the first photovoltaic cell.
54 . The integrated diode assembly of claim 52 , wherein the first diode is electrically connected to the first photovoltaic cell.
55 . A photovoltaic module comprising:
a first photovoltaic cell and a second photovoltaic cell connected in series; and an integrated diode assembly comprising: an insulating strip comprising a first cutout aligned with the first photovoltaic cell and a second cutout aligned with the second photovoltaic cell; and a first combined diode-lead assembly provided adjacent to an opposite side of the insulating strip with respect to the first and second photovoltaic cells.
56 . The photovoltaic module of claim 55 , wherein the first diode-lead assembly comprises a first diode, a first diode conductor electrically connected to one electrical lead of the first diode and to a back side of the first photovoltaic cell, and a second diode conductor electrically connected to another electrical lead of the first diode and to a back side of the second photovoltaic cell.
57 . The photovoltaic module of claim 55 , wherein the first photovoltaic cell is adjacent to the second photovoltaic cell.
58 . The photovoltaic module of claim 55 , wherein the first photovoltaic cell is separated from the second photovoltaic cell by at least one other photovoltaic cell.
59 . A method of fabricating an integrated diode assembly for electrical coupling to multiple photovoltaic cells, the method comprising:
providing an insulating strip having a surface; attaching a first combined diode-lead assembly to the surface, the first diode-lead assembly comprising a first diode, a first diode conductor electrically connected to one electrical lead of the first diode, and a second diode conductor electrically connected another electrical lead of the first diode; and attaching a first interconnecting conductor to the surface of the insulating strip such that the first interconnecting conductor at least partially overlaps the first diode conductor and electrically connects to the first diode conductor.
60 . The method of claim 59 , further comprising, prior to attaching the first interconnecting conductor to the insulating sheet, forming one or more cutouts in the insulating strip, wherein at least one of the first interconnecting conductor and the first diode conductor at least partially overlaps the one or more cutouts after attaching the first interconnecting conductor to the insulating sheet.
61 . The method of claim 60 , further comprising folding one or more cut portions over the first interconnecting conductor and attaching the folded one or more cut portions to the first interconnecting conductor, wherein the one or more cut portions are formed during forming the one or more cutouts in the insulating strip.
62 . The method of claim 60 , further comprising attaching one or more cut portions to the first interconnecting conductor comprises heating the first interconnecting conductor.
63 . The method of claim 59 , wherein attaching the first interconnecting conductor comprises forming an electrical connection between the first diode conductor and a third diode conductor of a second combined diode-lead assembly attached to the surface of the insulating strip by overlapping the first interconnecting conductor with the third diode conductor.
64 . The method of claim 59 , wherein attaching the first interconnecting conductor comprises localized heating of a portion of the first interconnecting conductor to modify the surface of the insulated strip.Join the waitlist — get patent alerts
Track US2016133769A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.