Workpiece processing apparatus and method

Abstract

The present invention is related to a workpiece processing apparatus and method for processing a warping workpiece. The workpiece processing apparatus comprises a base, a carrier and an adjusting device. The carrier comprises a loading surface and a plurality of suction units, wherein each of the plurality of suction units is disposed inside the carrier. The adjusting device comprises an adjusting surface, and at least one adjusting portion is protruded from the adjusting surface. A first surface of the workpiece partially contacts to the loading surface of the carrier. At least one of the adjusting device and the carrier is movably connected to the base. By generating a relative movement between the adjusting device and the carrier, the first surface contacts the loading surface in a more even condition so as to make the workpiece become an adjusted workpiece.

What is claimed is: 
     
         1 . A workpiece processing apparatus for processing a warped workpiece, the workpiece having a plate shape and having a first surface and a second surface, the workpiece having a recessed portion at the second surface, and a non-working area located at an area near an edge of the workpiece, the workpiece processing apparatus comprising:
 a base;   a carrier having a loading surface and a plurality of suction units, each of the plurality of suction units being disposed inside the carrier; and   an adjusting device having an adjusting surface, and at least one adjusting portion protruded from the adjusting surface;   wherein the first surface of the workpiece is partially contacted with the loading surface of the carrier;   wherein at least one of the adjusting device and the carrier is movably connected with the base, such that the adjusting device and the carrier are movable with respect to each other, so as to make the adjusting surface to face the loading surface and the second surface; and make the at least one adjusting portion to be contacted with the second surface and the non-working area, thereby the first surface is contacted with the loading surface more evenly and the workpiece becomes an adjusted workpiece.   
     
     
         2 . The workpiece processing apparatus according to  claim 1 , further comprising a processing device, wherein a relative movement is formed among the carrier, the adjusting device and the processing device, such that the processing device is contacted with the adjusted workpiece. 
     
     
         3 . The workpiece processing apparatus according to  claim 1 , wherein the adjusting device and the carrier are movable with respect to each other to a first position, a second position and a third position; wherein in the first position, the adjusting surface faces the loading surface and the second surface at a distance; wherein in the second position, the at least one adjusting portion is contacted with the second surface and the non-working area, and a distance from an edge of the first surface to the loading surface defines an unadjusted distance; and wherein in the third position, the at least one adjusting portion is contacted with the second surface and the non-working area, a distance from the edge of the first surface to the loading surface defines an adjusted distance, and the adjusted distance is less than the unadjusted distance, such that the first surface is contacted with the loading surface more evenly and the adjusted workpiece is formed. 
     
     
         4 . The workpiece processing apparatus according to  claim 3 , further comprising a processing device, wherein the carrier, the adjusting device and the processing device are movable with respect to each other, such that the processing device is contacted with the adjusted workpiece. 
     
     
         5 . The workpiece processing apparatus according to  claim 1 , wherein the workpiece is a wafer. 
     
     
         6 . The workpiece processing apparatus according to  claim 5 , wherein the wafer comprises a plurality of chips disposed thereon, and there is no chips at the non-working area. 
     
     
         7 . The workpiece processing apparatus according to  claim 1 , wherein the adjusting portion is an annular protrusion. 
     
     
         8 . A workpiece processing method for processing a warped workpiece, the workpiece having a plate shape and having a first surface and a second surface, the workpiece having a recessed portion at the second surface, and a non-working area located at an area near an edge of the workpiece, the workpiece processing method comprising:
 providing a carrier having a loading surface;   placing the workpiece onto the loading surface of the carrier, such that the first surface of the workpiece is partially contacted with the loading surface of the carrier;   providing an adjusting device having an adjusting surface, and at least one adjusting portion protruded from the adjusting surface; and   generating a relative movement between the carrier and the adjusting device, so as to make the at least one adjusting portion to be contacted with the second surface and the non-working area, thereby the first surface is contacted with the loading surface more evenly and the workpiece becomes an adjusted workpiece.   
     
     
         9 . The workpiece processing method according to  claim 8 , wherein the carrier has a plurality of suction units disposed inside the carrier, and the adjusted workpiece is held on the carrier through a suction force generated by the plurality of suction units. 
     
     
         10 . The workpiece processing method according to  claim 9 , further comprising providing a processing device, wherein a relative movement is formed among the carrier, the adjusting device and the processing device, such that the processing device is contacted with the adjusted workpiece.