Winding apparatus for waveguide prototype mould and waveguide manufacturing method

Abstract

A wiring apparatus includes a substrate, two winding modules, and an axial wire dividing module. The two winding modules are disposed on the substrate. Each winding module includes a clamping mechanism with a chuck, a rotary mechanism having a rotation driving unit driving the chuck; and a reciprocating mechanism with a rail-slider assembly, the rotation driving unit connected to the slider. The axial wire dividing module is disposed on the substrate and located between the two winding modules with a wire supply channel provided with a wire inlet and a wire outlet. The wire outlet is provided with a cutter aligned with the center of the wire supply channel, and a cutting edge of the cutter faces the wire inlet; a waveguide prototype mould is formed by dividing a wire in real time and winding wires in grooves of a waveguide prototype.

What is claimed is: 
     
         1 . A winding apparatus for a waveguide prototype mould, comprising:
 a substrate;   a pair of winding modules, comprising winding modules that are disposed on the substrate at an interval, wherein each winding module comprises a clamping mechanism, a rotary mechanism, and a reciprocating mechanism; the clamping mechanism has a chuck used for placing a waveguide prototype; the rotary mechanism has a rotation driving unit capable of controlling an actuation speed, and the rotation driving unit drives the chuck by means of a linkage; the reciprocating mechanism comprises a rail-slider assembly comprising a slide rail and a slider, and the rotation driving unit is connected to the slider; and   an axial wire dividing module, disposed on the substrate and located between the pair of winding modules, wherein the axial wire dividing module has a wire supply channel, the wire supply channel has a wire inlet and a wire outlet, a cutter is disposed at the wire outlet, the cutter is aligned with the center of the wire supply channel, and a cutting edge of the cutter faces the wire inlet.   
     
     
         2 . The winding apparatus according to  claim 1 , wherein a fixed plate is disposed at an end portion of the slide rail of each winding module, and the fixed plate has a screw hole; the rotation driving unit comprises a DC motor and a screw connected to a torque output shaft of the DC motor; the screw is screwed into a screw hole of the fixed plate; the chuck is axially disposed at an end portion of the screw; the DC motor is disposed on the slider, so that when the rotation driving unit is actuated, the reciprocating mechanism is also capable of moving linearly. 
     
     
         3 . The winding apparatus according to  claim 1 , wherein the reciprocating mechanism and the rotary mechanism are electrically connected to a movement control module, so as to control an actuation speed of the reciprocating mechanism and the rotary mechanism. 
     
     
         4 . The winding apparatus according to  claim 2 , wherein the reciprocating mechanism and the rotary mechanism are electrically connected to a movement control module, so as to control an actuation speed of the reciprocating mechanism and the rotary mechanism. 
     
     
         5 . The winding apparatus according to  claim 1 , further comprising a diameter conversion ring sleeved at the wire outlet, and the diameter conversion ring has an inner diameter. 
     
     
         6 . The winding apparatus according to  claim 1 , wherein the axial wire dividing module has an equal distance to each winding module. 
     
     
         7 . A waveguide manufacturing method, comprising the following steps:
 providing the waveguide prototype mould formed by using the apparatus according to  claim 1 , wherein the waveguide prototype mould comprises a rod body, a surface of the rod body is provided with convex teeth that are annularly arranged along an axial direction, two adjacent convex teeth and the surface of the rod body form a groove, and a sub-wire is wound on a bottom surface of the groove;   anodizing the waveguide prototype mould, so as to form a non-conductive oxide layer on surfaces of the convex teeth of the waveguide prototype mould;   removing the sub-wires in the grooves, to expose the conductive bottom surfaces of the grooves;   performing a copper electrotyping procedure, so that a deposit copper electrotyped layer grows evenly from the bottom surfaces of the grooves until the copper electrotyped layer covers the convex teeth;   performing a wet etching procedure to remove the waveguide prototype, so as to obtain a formed waveguide piece; and   electroplating gold on a surface of the formed waveguide piece, to obtain a finished waveguide.   
     
     
         8 . The manufacturing method according to  claim 7 , wherein the waveguide prototype mould is made of an alloy material with a low melting point. 
     
     
         9 . The manufacturing method according to  claim 8 , wherein the waveguide prototype is made of an aluminum alloy. 
     
     
         10 . The manufacturing method according to  claim 8 , wherein precision of the waveguide prototype is that the tolerance is less than minus or plus 1 μm. 
     
     
         11 . The manufacturing method according to  claim 10 , wherein the sub-wire has a diameter of 0.25 to 0.142 mm. 
     
     
         12 . The manufacturing method according to  claim 11 , wherein the convex tooth and the groove has a depth-to-width ratio of 3.5:1 μm. 
     
     
         13 . A waveguide manufacturing method, comprising the following steps:
 providing the waveguide prototype mould formed by using the apparatus according to  claim 2 , wherein the waveguide prototype mould comprises a rod body, a surface of the rod body is provided with convex teeth that are annularly arranged along an axial direction, two adjacent convex teeth and the surface of the rod body form a groove, and a sub-wire is wound on a bottom surface of the groove;   anodizing the waveguide prototype mould, so as to form a non-conductive oxide layer on surfaces of the convex teeth of the waveguide prototype mould;   removing the sub-wires in the grooves, to expose the conductive bottom surfaces of the grooves;   performing a copper electrotyping procedure, so that a deposit copper electrotyped layer grows evenly from the bottom surfaces of the grooves until the copper electrotyped layer covers the convex teeth;   performing a wet etching procedure to remove the waveguide prototype, so as to obtain a formed waveguide piece; and   electroplating gold on a surface of the formed waveguide piece, to obtain a finished waveguide.   
     
     
         14 . The manufacturing method according to  claim 13 , wherein the waveguide prototype mould is made of an alloy material with a low melting point. 
     
     
         15 . The manufacturing method according to  claim 14 , wherein the waveguide prototype is made of an aluminum alloy. 
     
     
         16 . The manufacturing method according to  claim 14 , wherein precision of the waveguide prototype is that the tolerance is less than minus or plus 1 μm. 
     
     
         17 . The manufacturing method according to  claim 16 , wherein the sub-wire has a diameter of 0.25 to 0.142 mm 
     
     
         18 . The manufacturing method according to  claim 17 , wherein the convex tooth and the groove has a depth-to-width ratio of 3.5:1 μm.