Methods For Forming A Transparent Oxide Layer For A Photovoltaic Device

Abstract

A method of manufacturing a transparent oxide layer is provided. The manufacturing method includes disposing a cadmium tin oxide layer on a support, placing the support with the cadmium tin oxide layer within a chamber of a rapid thermal annealing system, and rapidly thermally annealing the cadmium tin oxide layer by exposing the cadmium tin oxide layer to electromagnetic radiation to form the transparent oxide layer, wherein the rapid thermal anneal is performed without first pumping down the chamber.

1 . A method of manufacturing a transparent oxide layer, the manufacturing method comprising:
 disposing a cadmium tin oxide layer on a support;   placing the support with the cadmium tin oxide layer within a chamber of a rapid thermal annealing system; and   rapidly thermally annealing the cadmium tin oxide layer by exposing the cadmium tin oxide layer to electromagnetic radiation to form the transparent oxide layer, wherein the rapid thermal anneal is performed without first pumping down the chamber.   
     
     
         2 . The manufacturing method of  claim 1 , wherein air is disposed within the chamber during the rapid thermal anneal. 
     
     
         3 . The manufacturing method of  claim 1 , further comprising flowing an inert gas or air through the chamber during the rapid thermal anneal. 
     
     
         4 . The manufacturing method of  claim 1 , further comprising disposing a resistive, transparent buffer layer on the cadmium tin oxide layer. 
     
     
         5 . The manufacturing method of  claim 4 , wherein the resistive, transparent buffer layer comprises a material selected from the group consisting of zinc tin oxide, zinc stannate, tin oxide, indium oxide, zinc oxide, gallium oxide, aluminum oxide, cadmium tin oxide, CdO—SnO 2  and combinations thereof and is disposed on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the resistive, transparent buffer layer also undergoes the rapid thermal anneal. 
     
     
         6 . The manufacturing method of  claim 1 , wherein the rapid thermal anneal of the cadmium tin oxide layer is performed in less than fifteen minutes. 
     
     
         7 . The manufacturing method of  claim 6 , wherein the rapid thermal anneal of the cadmium tin oxide layer is performed in less than three minutes. 
     
     
         8 . The manufacturing method of  claim 1 , wherein the rapid thermal anneal of the cadmium tin oxide layer is performed in-line, such that the rapid thermal anneal is completed less than ten minutes after the deposition of the cadmium tin oxide layer has been completed. 
     
     
         9 . The manufacturing method of  claim 1 , wherein the transparent oxide layer has a sheet resistance R sh  less than about 7.5 Ohm/sq. 
     
     
         10 . The manufacturing method of  claim 1 , wherein the transparent oxide layer has an electrical resistivity (ρ) less than about 2×10 −4  Ohm-cm. 
     
     
         11 . The manufacturing method of  claim 10 , wherein the transparent oxide layer has an electrical resistivity (ρ) less than about 1.5×10 −4  Ohm-cm. 
     
     
         12 . The manufacturing method of  claim 1 , further comprising disposing a conductive layer on the cadmium tin oxide layer. 
     
     
         13 . The manufacturing method of  claim 12 , wherein the conductive layer is disposed on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the conductive layer becomes an optically transparent metal oxide layer. 
     
     
         14 . The manufacturing method of  claim 12 , wherein the conductive layer comprises a material selected from the group consisting of tin, aluminum, nickel, tantalum, titanium, indium, vanadium, zirconium, zinc, indium monoxide, tin monoxide, and titanium monoxide, and combinations or alloys thereof. 
     
     
         15 . The manufacturing method of  claim 14 , wherein the conductive layer is less than about thirty nanometers (30 nm) in thickness. 
     
     
         16 . The manufacturing method of  claim 1 , further comprising disposing a barrier layer on the support prior to disposing the cadmium tin oxide layer, such that the barrier layer is disposed between the support and the cadmium tin oxide layer. 
     
     
         17 . The manufacturing method of  claim 16 , further comprising disposing a conductive layer on the cadmium tin oxide layer. 
     
     
         18 . The manufacturing method of  claim 17 , wherein the conductive layer is disposed on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the conductive layer becomes an optically transparent metal oxide layer, the manufacturing method further comprising disposing a resistive, transparent buffer layer on the optically transparent metal oxide layer. 
     
     
         19 . The manufacturing method of  claim 18 , further comprising disposing a semiconductor layer on the resistive, transparent buffer layer. 
     
     
         20 . A method of manufacturing a transparent oxide layer, the manufacturing method comprising:
 disposing a cadmium tin oxide layer on a support;   placing the support with the cadmium tin oxide layer within a chamber of a rapid thermal annealing system; and   rapidly thermally annealing the cadmium tin oxide layer by exposing the cadmium tin oxide layer to electromagnetic radiation to form the transparent oxide layer, wherein air is disposed within the chamber during the rapid thermal anneal at a concentration of at least one percent (1%) by volume.   
     
     
         21 . The manufacturing method of  claim 20 , further comprising flowing an inert gas or air through the chamber during the rapid thermal anneal. 
     
     
         22 . The manufacturing method of  claim 20 , further comprising disposing a resistive, transparent buffer layer on the cadmium tin oxide layer. 
     
     
         23 . The manufacturing method of  claim 22 , wherein the resistive, transparent buffer layer is disposed on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the resistive, transparent buffer layer also undergoes the rapid thermal anneal. 
     
     
         24 . The manufacturing method of  claim 20 , wherein the rapid thermal anneal of the cadmium tin oxide layer is performed is performed in-line, such that the rapid thermal anneal is completed less than ten minutes after the deposition of the cadmium tin oxide layer has been completed. 
     
     
         25 . The manufacturing method of  claim 20 , further comprising disposing a conductive layer on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the conductive layer becomes an optically transparent metal oxide layer, wherein the conductive layer comprises a material selected from the group consisting of tin, aluminum, nickel, tantalum, titanium, indium, vanadium, zirconium, zinc, indium monoxide, tin monoxide, and titanium monoxide, and combinations or alloys thereof, and wherein the conductive layer has a thickness in a range of about 3-30 nm. 
     
     
         26 . The manufacturing method of  claim 20 , further comprising disposing a barrier layer on the support prior to disposing the cadmium tin oxide layer, such that the barrier layer is disposed between the support and the cadmium tin oxide layer. 
     
     
         27 . The manufacturing method of  claim 26 , further comprising disposing a conductive layer on the cadmium tin oxide layer prior to performing the rapid thermal anneal, such that the conductive layer becomes an optically transparent metal oxide layer, wherein the conductive layer comprises a material selected from the group consisting of tin, aluminum, nickel, tantalum, titanium, indium, vanadium, zirconium, zinc, indium monoxide, tin monoxide, and titanium monoxide, and combinations or alloys thereof. 
     
     
         28 . The manufacturing method of  claim 27 , further comprising disposing a resistive, transparent buffer layer on the conductive layer prior to performing the rapid thermal anneal, such that the resistive, transparent buffer layer also undergoes the rapid thermal anneal. 
     
     
         29 . The manufacturing method of  claim 27 , further comprising disposing a resistive, transparent buffer layer on the optically transparent metal oxide layer. 
     
     
         30 . The manufacturing method of  claim 29 , further comprising disposing a semiconductor layer on the resistive, transparent buffer layer.