Customizable Embedded Sensors

Abstract

A method of constructing a sensor includes depositing a first material in a predetermined arrangement to form a structure. The depositing results in at least one void occurring within the structure. The method further includes depositing a second material within the voids. The second material may have electrical properties that vary according to deformation of the second material. The method also includes providing electrical access to the second material to enable observation of the one or more electrical properties. A sensor includes a structure that has one or more voids distributed within the structure. The sensor also includes a material deposited within the one or more voids. The material may be characterized by one or more electrical properties such as piezoresistivity. The sensor includes a first contact electrically coupled to a first location on the material, and a second contact electrically coupled to a second location on the material.

What is claimed is: 
     
         1 . A sensor, comprising:
 a structure, including one or more voids distributed therein;   a material deposited within the one or more voids, wherein the material is characterized by one or more electrical properties;   a first contact electrically coupled to a first location on the material; and,   a second contact electrically coupled to a second location on the material.   
     
     
         2 . The sensor of  claim 1 , wherein the structure includes a plurality of consecutive layers, each of which is a cross-sectional profile of the structure. 
     
     
         3 . The sensor of  claim 2 , wherein the plurality of consecutive layers was produced using an additive manufacturing technique. 
     
     
         4 . The sensor of  claim 1 , wherein the structure is based on a sensor design. 
     
     
         5 . The sensor of  claim 4 , wherein the sensor design describes a torque sensor. 
     
     
         6 . The sensor of  claim 4 , wherein the sensor design describes a force sensor. 
     
     
         7 . The sensor of  claim 4 , wherein the sensor design describes an impact sensor. 
     
     
         8 . The sensor of  claim 4 , wherein the sensor design describes a bend sensor. 
     
     
         9 . The sensor of  claim 4 , wherein the sensor design describes a vibration sensor. 
     
     
         10 . The sensor of  claim 1 , wherein the first location on the material is a first end of the material and the second location on the material is a second end of the material. 
     
     
         11 . The sensor of  claim 1 , wherein the one or more electrical properties includes piezoresistive properties. 
     
     
         12 . The sensor of  claim 1 , wherein the material is deposited within the one or more voids by injecting the material through an opening in the structure. 
     
     
         13 . The sensor of  claim 12 , further including an adapter connecting the opening to an injector, wherein the adapter includes threads to couple to the injector. 
     
     
         14 . The sensor of  claim 13 , wherein the adapter is removably coupled to the opening in the structure, such that the adapter can be detached from the opening after the material is deposited in the void. 
     
     
         15 . The sensor of  claim 1 , wherein the material includes graphite particles in a silicone RTV suspension. 
     
     
         16 . An orthotic device, comprising:
 a structure for providing support to a portion of human anatomy, the structure including one or more voids distributed therein;   a material deposited within the one or more voids, wherein the material is characterized by a piezoresistive property;   a first contact electrically coupled to a first location on the material; and,   a second contact electrically coupled to a second location on the material.   
     
     
         17 . An ankle-foot orthosis, comprising:
 a structure for providing support for one or more of a foot, ankle and lower leg, the structure including one or more voids distributed therein;   a material deposited within the one or more voids, wherein the material is characterized by a piezoresistive property;   a first contact electrically coupled to a first location on the material; and,   a second contact electrically coupled to a second location on the material.   
     
     
         18 . An upper extremity measuring device, comprising:
 a structure having a first surface and a second surface, the structure including at least one void distributed within the structure beneath the first surface and at least one void distributed in the structure beneath the second surface;   a material deposited within the voids, wherein the material is characterized by a piezoresistive property; and,   for each of the voids within the structure:
 (a) a first contact electrically coupled to a first location on the material; and, 
 (b) a second contact electrically coupled to a second location on the material. 
   
     
     
         19 . A device for sensing contact with an object, comprising:
 a structure having an exterior surface, the structure including at a first void and a second void extending into the exterior surface, wherein the structure includes a plurality of consecutive layers, each of which is a cross-sectional profile of the structure;   a material deposited into the voids, wherein the material is characterized by a piezoresistive property and wherein the material deposited into the first void is not in contact with the material deposited into the second void;   an electrical circuit electrically coupled to the material deposited into the first void and to the material deposited into the second void;   wherein the exterior surface contacting the object causes the electrical circuit to form a closed electrical circuit.   
     
     
         20 . The device of  claim 19 , wherein a conductive object causes the electrical circuit to form a closed electrical circuit when the conductive object is electrically coupled to the material in the first void and to the material in the second void. 
     
     
         21 . The device of  claim 19 , wherein the object causes the electrical circuit to form a closed electrical circuit when the object manipulates a cantilevered portion of the material in the first void to be electrically coupled to the material in the second void. 
     
     
         22 . The device of  claim 19 , wherein the plurality of consecutive layers was produced using an additive manufacturing technique. 
     
     
         23 . A device for supporting at least a portion of an electrical circuit, comprising:
 a structure including one or more voids distributed therein, wherein the structure includes a plurality of consecutive layers, each of which is a cross-sectional profile of the structure;   a material deposited into the at least one void, wherein the material is characterized by a piezoresistive property;   wherein the material is electrically coupled to the electrical circuit, such that the material forms at least a portion of a conductor in the electrical circuit.   
     
     
         24 . The device of  claim 19 , wherein the plurality of consecutive layers was produced using an additive manufacturing technique.