Slim-type vapor chamber and capillary structure thereof

Abstract

A slim-type vapor chamber and a capillary structure thereof are provided, including an upper board and a lower board. The upper and lower boards respectively include a metal plate. Trenches are formed on one side surface of the metal plate. The upper board and the lower board overlap each other to make the corresponding side surfaces of the two metal plates contact each other. The trenches of the two metal plates are correspondingly disposed to form passages. The trenches of one of the metal plates are staggered from the trenches of the other metal plate by an offset distance to form staggered passages. Therefore, the capillary force during reverse flow of a working fluid is enhanced, the contact area between the vapor and the passage is increased, and the heat transfer efficiency of the vapor chamber is improved.

What is claimed is: 
     
         1 . A capillary structure of a slim-type vapor chamber, comprising:
 an upper board ( 10 ), the upper board ( 10 ) including a first metal plate ( 11 ), a plurality of first trenches ( 110 ) being formed on one side surface of the first metal plate ( 11 ); and   a lower board ( 20 ), the lower board ( 20 ) including a second metal plate ( 21 ), a plurality of second trenches ( 210 ) being formed on one side surface of the second metal plate ( 21 ), wherein the upper board ( 10 ) and the lower board ( 20 ) overlap each other to make the two corresponding side surfaces of the first metal plate ( 11 ) and the second metal plate ( 21 ) contact each other, and the second trenches ( 210 ) are staggered from the first trenches ( 110 ) by an offset distance (S) to form a plurality of staggered passages ( 100 ′).   
     
     
         2 . The capillary structure of the slim-type vapor chamber of  claim 1 , wherein the first trenches ( 110 ) include a plurality of first vapor trenches ( 12 ) and a plurality of first liquid reverse-flow trenches ( 13 ), the second trenches ( 210 ) include a plurality of second vapor trenches ( 22 ) and a plurality of second liquid reverse-flow trenches ( 23 ), the first vapor trenches ( 12 ) and the second vapor trenches ( 22 ) are correspondingly disposed to form a plurality of vapor passages ( 102 ), and the first liquid reverse-flow trenches ( 13 ) and the second liquid reverse-flow trenches ( 23 ) are correspondingly disposed to form a plurality of liquid reverse-flow passages ( 103 ). 
     
     
         3 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the second vapor trenches ( 22 ) are staggered from the first vapor trenches ( 12 ) by an offset distance (S) to from a plurality of staggered vapor passages ( 102 ′). 
     
     
         4 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the second liquid reverse-flow trenches ( 23 ) are staggered from the first liquid reverse-flow trenches ( 13 ) to form a plurality of staggered liquid reverse-flow passages ( 103 ′). 
     
     
         5 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the first metal plate ( 11 ) is further formed with a plurality of first supplementary liquid reverse-flow trenches ( 14 ) corresponding to the first liquid reverse-flow trenches ( 13 ), the second metal plate ( 21 ) is further formed with a plurality of second supplementary liquid reverse-flow trenches ( 24 ) corresponding to the second liquid reverse-flow trenches ( 23 ), and the first supplementary liquid reverse-flow trenches ( 14 ) and the second supplementary liquid reverse-flow trenches ( 24 ) are correspondingly disposed to form a plurality of supplementary liquid reverse-flow passages ( 104 ). 
     
     
         6 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the first metal plate ( 11 ) is formed with a plurality of first liquid transverse reverse-flow trenches ( 15 ) perpendicular to the first vapor trenches ( 12 ), the second metal plate ( 21 ) is formed with a plurality of second liquid transverse reverse-flow trenches perpendicular to the second vapor trenches ( 22 ), and the first liquid transverse reverse-flow trenches ( 15 ) and the second liquid transverse reverse-flow trenches are correspondingly disposed to form a plurality of liquid transverse reverse-flow passages. 
     
     
         7 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the upper board ( 10 ) and the lower board ( 20 ) respectively have a thickness below 0.5 mm, the first vapor trenches ( 12 ) and the first liquid reverse-flow trenches ( 13 ) are formed on the first metal plate ( 11 ) by an electroforming method or an etching method, and the second vapor trenches ( 22 ) and the second liquid reverse-flow trenches ( 23 ) are formed on the second metal plate ( 21 ) by an electroforming method or an etching method. 
     
     
         8 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein the first liquid reverse-flow trench ( 13 ) and the second liquid reverse-flow trench ( 23 ) respectively have a width of W, and the offset distance (S) is below ¾W. 
     
     
         9 . The capillary structure of the slim-type vapor chamber of  claim 2 , wherein a distal end of the first vapor trenches ( 12 ) of the first metal plate ( 11 ) includes a plurality of first distal-end liquid reverse-flow trenches ( 16 ), a distal end of the second vapor trenches ( 22 ) of the second metal plate ( 21 ) includes a plurality of second distal-end liquid reverse-flow trenches, and the first distal-end liquid reverse-flow trenches ( 16 ) and the second distal-end liquid reverse-flow trenches are correspondingly disposed to form a plurality of distal-end liquid reverse-flow passages. 
     
     
         10 . A slim-type vapor chamber, comprising:
 an upper board ( 10 ), the upper board ( 10 ) including a first metal plate ( 11 ), a plurality of first trenches ( 110 ) being formed on one side surface of the first metal plate ( 11 );   a lower board ( 20 ), the lower board ( 20 ) including a second metal plate ( 21 ), a plurality of second trenches ( 210 ) being formed on one side surface of the second metal plate ( 21 ), wherein the upper board ( 10 ) and the lower board ( 20 ) overlap each other to make two corresponding side surfaces of the first metal plate ( 11 ) and the second metal plate ( 21 ) contact each other, the second trenches ( 210 ) are staggered from the first trenches ( 110 ) by an offset distance (S) to form a plurality of staggered passages ( 100 ′); and   a working fluid filled between the upper board ( 10 ) and the lower board ( 20 ), the thickness of the slim-type vapor chamber is below 1 mm.   
     
     
         11 . The slim-type vapor chamber of  claim 10 , wherein the first trenches ( 110 ) include a plurality of first vapor trenches ( 12 ) and a plurality of first liquid reverse-flow trench ( 13 ), the second trenches ( 210 ) include a plurality of second vapor trenches ( 22 ) and a plurality of second liquid reverse-flow trenches ( 23 ), the first vapor trenches ( 12 ) and the second vapor trenches ( 22 ) are correspondingly disposed to form a plurality of vapor passages ( 102 ), and the first liquid reverse-flow trenches ( 13 ) and the second liquid reverse-flow trenches ( 23 ) are correspondingly disposed to form a plurality of liquid reverse-flow passages ( 103 ). 
     
     
         12 . The slim-type vapor chamber of  claim 11 , wherein the second vapor trenches ( 22 ) are staggered from the first vapor trenches ( 12 ) by the offset distance (S) to form a plurality of staggered vapor passages ( 102 ′). 
     
     
         13 . The slim-type vapor chamber of  claim 11 , wherein the second liquid reverse-flow trenches ( 23 ) are staggered from the first liquid reverse-flow trenches ( 13 ) by the offset distance (S) to form a plurality of staggered liquid reverse-flow passages ( 103 ′). 
     
     
         14 . The slim-type vapor chamber of  claim 11 , wherein the first metal plate ( 11 ) is formed with a plurality of first supplementary liquid reverse-flow trenches ( 14 ) corresponding to the first liquid reverse-flow trenches ( 13 ), the second metal plate ( 21 ) is formed with a plurality of second supplementary liquid reverse-flow trenches ( 24 ) corresponding to the second liquid reverse-flow trenches ( 23 ), and the first supplementary liquid reverse-flow trenches ( 14 ) and the second supplementary liquid reverse-flow trenches ( 24 ) are correspondingly disposed to form a plurality of supplementary liquid reverse-flow passages ( 104 ). 
     
     
         15 . The slim-type vapor chamber of  claim 11 , wherein the first metal plate ( 11 ) is formed with a plurality of first liquid transverse reverse-flow trenches ( 15 ) perpendicular to the first vapor trenches ( 12 ), the second metal plate ( 21 ) is formed with a plurality of second liquid transverse reverse-flow trenches perpendicular to the second vapor trenches ( 22 ), the first liquid transverse reverse-flow trenches ( 15 ) and the second liquid transverse reverse-flow trenches are correspondingly disposed to form a plurality of liquid transverse reverse-flow passages. 
     
     
         16 . The slim-type vapor chamber of  claim 11 , wherein the upper board ( 10 ) and the lower board ( 20 ) respectively have a thickness below 0.5 mm, the first vapor trenches ( 12 ) and the first liquid reverse-flow trenches ( 13 ) are formed on the first metal plate ( 11 ) by an electroforming method or an etching method, and the second vapor trenches ( 22 ) and the second liquid reverse-flow trenches ( 23 ) are formed on the second metal plate ( 21 ) by an electroforming method or an etching method. 
     
     
         17 . The slim-type vapor chamber of  claim 11 , wherein the first liquid reverse-flow trench ( 13 ) and the second liquid reverse-flow trench ( 23 ) respectively have a width of W, and the offset distance (S) is below ¾W. 
     
     
         18 . The slim-type vapor chamber of  claim 11 , wherein a distal end of the first vapor trenches ( 12 ) of the first metal plate ( 11 ) is formed with a plurality of first distal-end liquid reverse-flow trenches ( 16 ), a distal end of the second vapor trenches ( 22 ) of the second metal plate ( 21 ) is formed with a plurality of second distal-end liquid reverse-flow trenches, and the first distal-end liquid reverse-flow trenches ( 16 ) and the second distal-end liquid reverse-flow trenches are correspondingly disposed to form a plurality of distal-end liquid reverse-flow passages.