METHOD FOR FORMING CONDUCTIVE PATTERN BY DIRECT RADIATION OF ELECTROMAGNETIC WAVE, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)

Abstract

Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

1 . A method for forming conductive pattern by direct radiation of an electromagnetic wave, the method comprising:
 forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate;   forming a conductive seed on the polymer resin substrate;   forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and   removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.   
     
     
         2 . The method of  claim 1 , wherein the first region of the polymer resin substrate has surface roughness defined by a center line arithmetic average roughness of the absolute values (Ra) of 500 nm or more, and the second region has a center line arithmetic average roughness of the absolute values (Ra) smaller than that of the first region. 
     
     
         3 . The method of  claim 1 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the first region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 5% or less of an area of the metal layer. 
     
     
         4 . The method of  claim 1 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the second region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 65% or more of an area of the metal layer. 
     
     
         5 . The method of  claim 1 , wherein the polymer resin substrate contains a thermosetting resin or a thermoplastic resin. 
     
     
         6 . The method of  claim 5 , wherein the polymer resin substrate contains at least one kind selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin. 
     
     
         7 . The method of  claim 1 , wherein the radiating of the electromagnetic wave is performed by radiating a laser electromagnetic wave having a wavelength of 248 nm, 308 nm, 355 nm, 532 nm, 585 nm, 755 nm, 1064 nm, 1070 nm, 1550 nm, 2940 nm or 10600 nm. 
     
     
         8 . The method of  claim 1 , wherein the radiating of the electromagnetic wave is performed by radiating a laser electromagnetic wave under radiation condition having 0.1 to 50 W of an average power. 
     
     
         9 . The method of  claim 1 , wherein the radiating of the electromagnetic wave is performed by radiating a laser electromagnetic wave so that an interval between central parts of radiation trace of the electromagnetic wave shown on the polymer resin substrate is 20 to 70 μm. 
     
     
         10 . The method of  claim 1 , wherein the radiating of the electromagnetic wave is performed by radiating a laser electromagnetic wave once or by radiating the laser electromagnetic wave two or more times. 
     
     
         11 . The method of  claim 1 , wherein the conductive seed contains metal nanoparticles, metal ions, or metal complex ions. 
     
     
         12 . The method of  claim 11 , wherein the conductive seed contains at least one kind metal selected from the group consisting of copper (Cu), platinum (Pt), palladium (Pd), silver (Ag), gold (Au), nickel (Ni), tungsten (W), titanium (Ti), chromium (Cr), aluminum (Al), zinc (Zn), tin (Sn), lead (Pb), magnesium (Mg), manganese (Mn) and iron (Fe), ions or complex ions thereof. 
     
     
         13 . The method of  claim 11 , wherein the forming of the conductive seed includes:
 applying a dispersion liquid or solution containing the metal nanoparticles, the metal ions, or the metal complex ions on the polymer resin substrate; and   precipitating and drying the metal nanoparticles or reducing and drying the metal ions or the metal complex ions to form the conductive seed in a particle form.   
     
     
         14 . The method of  claim 13 , wherein the reducing of the metal ions or the metal complex ions is performed in the presence of at least one kind reducing agent selected from the group consisting of an alcohol-based reducing agent, an aldehyde-based reducing agent, a hypophosphite-based reducing agent, a hydrazine-based reducing agent, sodium borohydride and lithium aluminum hydride. 
     
     
         15 . The method of  claim 13 , further comprising: adding a surfactant having surface tension lower than that of the dispersion liquid or the solution in the forming of the conductive seed, or
 surface-treating the polymer resin substrate with a surfactant having surface tension lower than that of the dispersion liquid or solution, between the radiating of the electromagnetic wave and the forming of the conductive seed.   
     
     
         16 . The method of  claim 1 , wherein the forming of the metal layer includes electroless-plating a conductive metal on the polymer resin substrate. 
     
     
         17 . The method of  claim 1 , wherein the removing of the conductive seed and the metal layer from the second region includes applying physical power onto the polymer resin substrate by combination of one or two or more method(s) selected from the group consisting of ultrasonic radiation (sonication), liquid phase washing, liquid phase rinsing, air blowing, taping, brushing, and a method of using a manpower. 
     
     
         18 . A resin structure having conductive pattern comprising:
 a polymer resin substrate including a first region formed to have a predetermined surface roughness and a second region having surface roughness smaller than that of the first region; and   a conductive seed and a metal layer selectively formed on the first region of the polymer resin substrate.   
     
     
         19 . The resin structure of  claim 18 , wherein the first region corresponds to a region radiated by the electromagnetic wave. 
     
     
         20 . The resin structure of  claim 18 , wherein the first region of the polymer resin substrate has surface roughness defined by a center line arithmetic average roughness of the absolute values (Ra) of 500 nm or more, and the second region has a center line arithmetic average roughness of the absolute values (Ra) smaller than that of the first region. 
     
     
         21 . The resin structure of  claim 18 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the first region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 5% or less of an area of the metal layer. 
     
     
         22 . The resin structure of  claim 18 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the second region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 65% or more of an area of the metal layer.