US2016215441A1PendingUtilityA1

Conductive Composite Materials Containing Multi-Scale High Conductive Particles and Methods

Assignee: FLORIDA STATE UNIV RES FOUND INCPriority: Aug 9, 2013Filed: Aug 11, 2014Published: Jul 28, 2016
Est. expiryAug 9, 2033(~7 yrs left)· nominal 20-yr term from priority
D06M 11/83D06M 2101/40H01B 1/22D06M 15/55B32B 1/00B32B 2262/106C08J 5/06B32B 2307/732B32B 2571/02B32B 2260/046B32B 2307/30B32B 2250/20B32B 2307/72C08J 5/10B32B 5/26D06M 23/08B05D 1/12B32B 2307/54B32B 5/022B32B 2307/302B32B 5/024B32B 2260/023B32B 2264/105B32B 2605/18C08J 5/042
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Claims

Abstract

Composite materials are provided that include a host material, nanoscale high conductive particles, and microscale high conductive particles. The nanoscale high conductive particles and the microscale high conductive particles may increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. Methods for making the composite materials herein also are provided.

Claims

exact text as granted — not AI-modified
We claim: 
     
         1 . A composite material comprising:
 a host material;   nanoscale high conductive particles; and   microscale high conductive particles;   wherein the nanoscale high conductive particles and the microscale high conductive particles are combined with the host material, and are present in a total amount of at least 0.5 volume % of the composite material.   
     
     
         2 . The composite material of  claim 1 , wherein the nanoscale high conductive particles and the microscale high conductive particles increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. 
     
     
         3 . The composite material of  claim 1 , wherein at least a portion of the nanoscale high conductive particles and the microscale high conductive particles substantially impregnate the host material. 
     
     
         4 . The composite material of  claim 1 , wherein the nanoscale high conductive particles are substantially spherical. 
     
     
         5 . The composite material of  claim 1 , wherein the microscale high conductive particles are flake shaped. 
     
     
         6 . The composite material of  claim 1 , wherein the nanoscale high conductive particles have an average diameter of from about 10 nm to about 50 nm. 
     
     
         7 . The composite material of  claim 1 , wherein the microscale high conductive particles have an average diameter of from about 1 micrometer to about 20 micrometers. 
     
     
         8 . The composite material of  claim 1 , wherein the microscale high conductive particles comprise silver, copper, aluminum, or a combination thereof. 
     
     
         9 . The composite material of  claim 1 , wherein the nanoscale high conductive particles comprise silver, copper, aluminum, or a combination thereof. 
     
     
         10 . The composite material of  claim 1 , wherein the host material comprises at least one of a woven or non-woven fabric. 
     
     
         11 . The composite material of  claim 1 , wherein the woven or non-woven fabric comprises a carbon fabric. 
     
     
         12 . The composite material of  claim 1 , wherein the host material comprises two or more layers of at least one of a woven and non-woven fabric. 
     
     
         13 . The composite material of  claim 1 , wherein the composite material comprises at least one resin. 
     
     
         14 . The composite material of  claim 1 , wherein the at least one resin comprises an epoxy resin. 
     
     
         15 . A method for making a composite material comprising:
 providing a host material, and   contacting the host material with microscale high conductive particles and nanoscale high conductive particles to associate the host material with an amount of the microscale high conductive particles and the nanoscale high conductive particles sufficient to impart the composite material with at least a 0.4 volume % of high conductive particles.   
     
     
         16 . The method of  claim 15 , further comprising forming a suspension of at least one of the microscale high conductive particles and nanoscale high conductive particles in a liquid prior to the contacting. 
     
     
         17 . The method of  claim 15 , further comprising mixing the suspension with a resin prior to the contacting. 
     
     
         18 . The method of  claim 15 , wherein the high conductive particles comprise silver, copper, aluminum, or a combination thereof. 
     
     
         19 . A composite material comprising:
 one or more fabric sheets;   a resin reinforcing the one or more fabric sheets;   nanoscale metallic particles and microscale metallic particles distributed through the one or more fabric sheets and the resin in an amount and locations effective to form continuous through-thickness conductive paths through the composite material that increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale metallic particles and microscale metallic particles.   
     
     
         20 . The method of  claim 19 , wherein at least one of the nanoscale metallic particles or microscale metallic particles are sintered.

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