Method for Making an Electrical Circuit

Abstract

A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a second rigid printed circuit board having a plurality of electrical components on at least one surface, and further having two flexible circuits area along one edge; forming electrode pads on the surfaces of the flexible circuits that are alignable respectively with the electrical contacts on the rigid circuit board when the two flexible circuits are spread apart by about 180°; spreading the flexible circuits apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

We claim: 
     
         1 . A method for making an electrical circuit comprising the steps of:
 forming a first rigid printed circuit board having a plurality of electrical contacts on a first surface of said rigid printed circuit board;   forming a second rigid printed circuit board having a first surface and a second surface, with two flexible circuits along one edge of said second rigid printed circuit board, one on each of said first and second surfaces, and having a plurality of electrical components on at least one of said first and second surfaces of said second rigid printed circuit board;   forming electrode pads on selected surfaces of said flexible circuits in such a pattern that each of said electrode pads is alignable respectively with one of each of said electrical contacts on said first rigid circuit board when said two flexible circuits are spread apart from one another to form an angle of about 180°;   spreading apart said two flexible circuits and aligning each of said electrode pads respectively with one of said electrical contacts; and   forming an electrical connection between said electrode pads and said electrical contacts.   
     
     
         2 . The method of  claim 1  wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas. 
     
     
         3 . The method of  claim 1  wherein said rigid printed circuit board is part of a computing device and said multilayer flex circuit comprises a memory module. 
     
     
         4 . The method of  claim 3  wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers. 
     
     
         5 . The method of  claim 1  wherein said step of forming an electrical connection between said electrode pads and said electrical contacts employs a material selected from the group consisting of: isotropic conductive adhesive; anisotropic conductive adhesive; and solder. 
     
     
         6 . A method for making an electrical circuit comprising the steps of:
 forming a first rigid printed circuit board, said first rigid circuit board including a mechanical clamping device functionally connected to said printed circuit;   forming a second rigid printed circuit board having a first and second surface, with two flexible circuits along one edge of said second rigid printed circuit board, one on each of said first and second surfaces, and having a plurality of electrical components on at least one of said first and second surfaces of said second rigid printed circuit board;   forming electrode pads on selected surfaces of said flexible circuits in such a pattern that each of said electrode pads is alignable respectively with one of each of said electrical contacts on said mechanical clamping device when said flexible circuits are spread apart from one another;   spreading apart said flexible circuits and aligning each of said electrode pads respectively with one of said electrical contacts on said clamping device; and   engaging said clamping device to form an electrical connection between said electrode pads and said electrical contacts and secure said second rigid printed circuit board to said first rigid printed circuit board.   
     
     
         7 . The method of  claim 6  wherein said electronic components are selected from the group consisting of: logic devices; memory devices; buffer circuits; timing circuits; analog, digital and mixed-mode circuits; optoelectronic devices; RF devices; resistors; capacitors; inductors; and antennas. 
     
     
         8 . The method of  claim 6  wherein said rigid printed circuit board is part of a computing device and said multilayer flex circuit comprises a memory module. 
     
     
         9 . The method of  claim 8  wherein said computing device is selected from the group consisting of: desktop computers; mobile computers; tablet computers; smart phones; and servers. 
     
     
         10 . The method of  claim 6  wherein said step of forming an electrical connection between said electrode pads and said electrical contacts employs a material selected from the group consisting of: isotropic conductive adhesive; anisotropic conductive adhesive; and solder.