Plating apparatus and sensing device using same

Abstract

A plating apparatus ( 1 ) includes: a holding member ( 2 ) that holds a plated object (W); a spacer ( 4 ) that is stacked on the holding member ( 2 ) via a first seal member ( 3 ) in an annular shape surrounding the plated object (W), and has a through portion ( 45 ) from which the plated object (W) is exposed and which stores a plating solution; and an anode member ( 6 ) that is stacked on the spacer ( 4 ) via a second seal member ( 3 ) in an annular shape surrounding the through portion ( 45 ), and has an anode layer ( 62 ) arranged to face the plated object (W) which is exposed from the through portion ( 45 ).

1 . A plating apparatus comprising:
 a holding member that holds a plated object specified as a cathode;   a spacer that is stacked on the holding member via a first seal member in an annular shape surrounding the plated object, and has a through portion from which the plated object is exposed and which stores a plating solution; and   an anode member that is stacked on the spacer via a second seal member in an annular shape surrounding the through portion, and has an anode layer arranged to face the plated object which is exposed from the through portion.   
     
     
         2 . The plating apparatus according to  claim 1 , wherein the spacer includes a spacer body made of an insulator and an anode-side conductive layer arranged on a face, which faces the anode member, of the spacer body,
 the anode member includes an anode member body made of an insulator and an anode layer specified as the anode arranged on a face, which faces the spacer, of the anode member body,   the anode-side conductive layer is connected inside the second seal member to the anode layer, and   the anode-side conductive layer is connected outside the second seal member to a power supply.   
     
     
         3 . The plating apparatus according to  claim 2 , wherein the anode member body includes a light transmissive window for observing the plated object exposed from the through portion, and
 the anode layer is formed around the window.   
     
     
         4 . The plating apparatus according to  claim 3 , wherein the window has a thickness smaller than that of other portions of the anode member body. 
     
     
         5 . The plating apparatus according to  claim 3 , wherein a thickness t 1  of the window is in a range of 0.05 mm≦t1≦2 mm. 
     
     
         6 . The plating apparatus according to  claim 3 , wherein the anode member body has a tapered portion around the window which declines toward the window. 
     
     
         7 . The plating apparatus according to  claim 1 , wherein a thickness t 2  of the spacer is in a range of 0.05 mm≦t2≦1 mm. 
     
     
         8 . The plating apparatus according to  claim 2 , wherein the spacer includes a cathode-side conductive layer arranged on a face, which faces the holding member, of the spacer body,
 the cathode-side conductive layer is connected inside the first seal member to the plated object, and   the cathode-side conductive layer is connected outside the first seal member to the power supply.   
     
     
         9 . The plating apparatus according to  claim 2 , wherein the spacer includes a reference electrode conductive layer insulated from the anode-side conductive layer on a face, which faces the anode member, of the spacer body,
 the anode member includes a reference electrode layer insulated from the anode layer on a face, which faces the spacer, of the anode member body,   the reference electrode conductive layer is connected inside the second seal member to the reference electrode layer, and   the reference electrode conductive layer is connected outside the second seal member to the measuring device.   
     
     
         10 . The plating apparatus according to  claim 1 , wherein the holding member or the anode member includes a plating solution supply passage through which a plating solution is supplied to the through portion, and
 the holding member or the anode member includes a plating solution discharge passage through which the plating solution is discharged from the through portion.   
     
     
         11 . The plating apparatus according to  claim 8 , wherein the plating solution is an electroless plating solution, and a measuring device instead of the power supply is connected to measure the electric potential across the anode and the cathode. 
     
     
         12 . A sensing device having the plating apparatus according to  claim 2 , wherein the anode-side conductive layer is constituted with a plurality of anode-side conductive layers insulated from one another,
 the anode layer is constituted with the same number of anode layers insulated from one another as the anode-side conductive layers, and   portions of anode layer, which is exposed from the through portion are respectively modified with reaction groups different from one another.