Diode cell modules

Abstract

Diode cell modules for use within photovoltaic systems, including lead frames including first leads extending from the first outlet terminal, second leads spaced from the first leads, second outlet terminals extending from the second leads, and diodes. In some examples, first leads define base portions connected to the first outlet terminal and diode portions extending from the base portions transverse to the first outlet terminal. In some examples, second leads may define a base portion and diode portions extending from the base portion substantially parallel to the diode portion of the first lead. In some examples diodes may be in electrical contact with the diode portion of the first lead and with the diode portion of the second lead. In some examples, the first leads and second leads may be thermally conductive. In some examples, diodes may define die interfaces that are substantially fully engaged with diode portions of leads.

1 . A diode cell module for use within photovoltaic power generation systems including a photovoltaic panel, comprising:
 a lead frame including:
 a thermally conductive and electrically conductive first lead, the first lead defining:
 a base portion; and 
 a diode portion extending from the base portion; 
 
 a thermally conductive and electrically conductive second lead defining:
 a diode portion spaced from the diode portion of the first lead; 
 a connecting portion extending from the second lead diode portion; and 
 a base portion connected to the connecting portion distal the diode surface of the second lead, the base portion vertically aligned with the base portion of the first lead; and 
 
   a diode in electrical contact with the first lead diode portion and the second lead diode portion.   
     
     
         2 . The diode cell module of  claim 1 , wherein the connecting portion is angled to substantially maximize the base portion's surface area. 
     
     
         3 . The diode cell module of  claim 1 , further comprising a thermally conductive path extending from a first end proximate the diode to a second end spaced from the diode, the thermally conductive path configured to dissipate heat through one or more thermally conductive layers. 
     
     
         4 . The diode cell module of  claim 3 , wherein the first lead is engaged with the first end of the thermally conductive path. 
     
     
         5 . The diode cell module of  claim 3 , wherein a layer of the thermally conductive path includes a metallic thermal dissipation member. 
     
     
         6 . The diode cell module of  claim 5 , wherein the metallic thermal dissipation member is engaged with an external dissipating structure. 
     
     
         7 . The diode cell module of  claim 3 , wherein the thermally conductive path includes an electrically insulating and thermally conducting insulation layer. 
     
     
         8 . The diode cell module of  claim 3 , wherein the lead frame includes:
 a third lead spaced from the second lead;   a second diode connected between the second lead and the third lead;   a fourth lead spaced from the third lead; and   a third diode connected between the third lead and the fourth lead; and   wherein the thermally conductive path is engaged with at least a portion of the first lead, at least a portion of the second lead, at least a portion of the third lead, an at least a portion of the fourth lead.   
     
     
         9 . The diode cell module of  claim 3 , wherein:
 the photovoltaic panel defines a thermally conductive surface; and   the thermally conductive path is engaged with the thermally conductive surface of the panel.   
     
     
         10 . The diode cell module of  claim 1 , wherein:
 the diode defines a first diode;   the diode portion of the second lead defines a first diode portion of the second lead; and   the second lead defines a second diode portion extending from the base portion substantially transverse to the first diode portion of the second lead; and   further comprising:
 a thermally conductive and electrically conductive third lead spaced from the second lead, the third lead defining:
 a base portion; and 
 a diode portion extending from the base portion of the third lead substantially parallel to the second diode portion of the second lead; 
 
 a third outlet terminal extending from the base portion of the third lead; and 
 a second diode joined with the diode portion of the third lead and the second diode portion of the second lead. 
   
     
     
         11 . The diode cell module of  claim 10 , wherein the photovoltaic panel includes:
 a first string of photovoltaic cells defining a positive terminal and a negative terminal;   a second string of photovoltaic cells defining a positive terminal and a negative terminal;   a first panel lead electrically connected to the positive terminal of the first string and the first outlet terminal;   a second panel lead electrically connected to the negative terminal of the first string the positive terminal of the second string, and the second outlet terminal; and   a third panel lead electrically connected the negative terminal of tine second string and the third outlet terminal.   
     
     
         12 . The diode cell module of  claim 1 , wherein:
 the diode includes:
 a die defining a bottom die area and a ton the area projection surrounding a top die area; 
 an electrically conductive top die interface substantially fitted within the top die area projection; and 
 an electrically conductive bottom die interface engaged with substantially all of the bottom die area, the electrically conductive bottom die interface defining a bottom surface area distal the die; and 
   wherein one of the diode portion of the first lead or the diode portion of the second lead is joined with a majority of the bottom die interface's bottom surface area.   
     
     
         13 . The diode cell module of  claim 1 , further comprising:
 an encapsulation case, the encapsulation enclosing a circuit space at least partially enclosing the diode, the first lead, and the second lead; and   encapsulant disposed in the circuit space, the encapsulant defining a liquid and electric-resistant thermosetting material molded around an encapsulated portion of the lead frame.   
     
     
         14 . The diode cell module of  claim 13 , wherein the encapsulant is a molding epoxy. 
     
     
         15 . The diode cell module of  claim 13 , wherein the encapsulation case defines:
 an insulation layer abutting the circuit space; and   a dissipating space abutting the insulation layer distal the circuit space.   
     
     
         16 . The diode cell module of  claim 15 , further comprising a thermally conductive thermal dissipating member disposed within the dissipating space. 
     
     
         17 . A diode cell module for use within photovoltaic power generation systems including a photovoltaic panel, comprising:
 a diode including:
 a top die interface; 
 a bottom die interface defining a bottom surface area; and 
 a die defining a bottom die area, wherein a majority of the bottom die area is engaged with the bottom die interface; 
   a lead frame including:
 a first outlet terminal; 
 an electrically conductive first lead in electrical communication with the first outlet terminal, the first lead defining:
 a base portion; and 
 a diode portion extending from the base portion that defines a diode surface with a surface area greater than the bottom surface area; 
 
 an electrically conductive second lead spaced from the first lead, the second lead defining a diode portion electrically connected to the top die interface; and 
 a second outlet terminal electrical communication with the second lead; and 
   wherein the diode is connected between the diode surface of the first lead and the diode surface of the second lead with substantially all of the bottom surface area, engaged with the diode surface of the first lead.   
     
     
         18 . The diode cell module of  claim 17 , wherein:
 the die defines a top die area;   wherein the top die interface:
 is engaged with a majority of the top die area; and 
 defines a top surface area, wherein substantially all of the top surface area is engaged with the second lead. 
   
     
     
         19 . The diode cell module of  claim 17 , wherein the bottom surface area of the bottom die interface is substantially similar to or greater than the bottom die area. 
     
     
         20 . The diode cell module of  claim 17 , wherein the first lead and the second lead are thermally conductive.