Electronic Circuit Production

Abstract

A system for continuous circuit fabrication comprising means for storing and dispensing ( 74 ) the substrate ( 2 ), means for laminating ( 1 ) the substrate ( 2 ), means for printing ( 76 ) the substrate ( 2 ), means for optical inspection ( 4 ) of the substrate ( 2 ), means for photolithography ( 6 ) of the substrate ( 2 ), means for drying ( 78 ) the substrate ( 2 ), means for developing ( 8, 16 ) the substrate ( 2 ), means for washing ( 10, 14 ) the substrate ( 2 ) and means for electroplating ( 82 ) the substrate ( 2 ).

1 . An electrolytic etching and/or deposition system ( 12 ), comprising:
 a. a container ( 46 ) for an electrolyte ( 42 );   b. means ( 55 ) for moving a continuous section of substrate ( 2 ) through the electrolyte ( 42 );   c. a first electrode ( 58 ) arranged to be in electrical contact with the electrolyte ( 42 ), and   d. a second electrode ( 62 ) arranged to be in electrical contact with the substrate ( 2 ), so as to etch or deposit a layer of the substrate ( 2 ) by electrolysis.   
     
     
         2 . The electrolytic etching system ( 12 ) of  claim 1 , wherein the second electrode ( 62 ) is arranged to be in electrical contact with the substrate ( 2 ) via the means ( 55 ) for moving the continuous section of substrate ( 2 ) through the electrolyte ( 42 ). 
     
     
         3 . The electrolytic etching system of  claim 2 , wherein the means ( 55 ) for moving the continuous section of substrate ( 2 ) through the electrolyte ( 42 ) comprises a feed roller. 
     
     
         4 . The electrolytic etching system ( 12 ) of any preceding claim, wherein the polarities of the first electrode ( 58 ) and second electrode ( 62 ) are reversible so as to increase the thickness of the etched layer of the substrate ( 2 ) by electrolysis. 
     
     
         5 . The electrolytic etching system ( 12 ) of any preceding claim, wherein the first electrode ( 58 ) is removable from the container ( 46 ). 
     
     
         6 . The electrolytic etching system ( 12 ) of  claim 5 , wherein the first electrode ( 58 ) is attached to a removable section ( 52 ) of the container ( 46 ). 
     
     
         7 . The electrolytic etching system ( 12 ) of any preceding claim, wherein the container ( 46 ) includes a drain ( 50 ) for draining the electrolyte ( 42 ). 
     
     
         8 . The electrolytic etching system ( 12 ) of any preceding claim, wherein the container ( 46 ) includes a guide ( 40 ) for guiding the continuous section of the substrate ( 2 ). 
     
     
         9 . A system for continuous circuit fabrication, comprising the electrolytic etching and/or deposition system ( 12 ) of any preceding claim, and further comprising one or more of: means for storing and dispensing ( 74 ) the substrate ( 2 ), means for laminating ( 1 ) the substrate ( 2 ), means for printing ( 76 ) the substrate ( 2 ), means for optical inspection ( 4 ) of the substrate ( 2 ), means for photolithography ( 6 ) of the substrate ( 2 ), means for drying ( 78 ) the substrate ( 2 ), means for developing ( 8 ,  16 ) the substrate ( 2 ), means for washing ( 10 ,  14 ) the substrate ( 2 ) and means for electroplating ( 82 ) the substrate ( 2 ). 
     
     
         10 . A method of electrolytic etching, comprising:
 a. introducing a continuous section of substrate ( 2 ) into an electrolyte ( 42 ); and   b. applying a voltage between a first electrode ( 58 ) in electrical contact with the electrolyte ( 42 ) and a second electrode ( 62 ) in electrical contact with the substrate ( 2 ), so as to etch the substrate ( 2 ) by electrolysis.   
     
     
         11 . The method of  claim 10 , wherein the second electrode ( 62 ) is in electrical contact with the substrate ( 2 ) via means ( 55 ) for introducing the continuous section of substrate ( 2 ) through the electrolyte ( 42 ). 
     
     
         12 . The method of  claim 10  or  11 , wherein at a subsequent time the polarities of the first electrode ( 58 ) in electrical contact with the electrolyte ( 42 ) and a second electrode ( 62 ) in electrical contact with the substrate ( 2 ) are reversed so as to increase the thickness of the etched layer of the substrate ( 2 ) by electrolysis. 
     
     
         13 . A method of electrolytic deposition, comprising:
 a. introducing a continuous section of substrate ( 2 ) into an electrolyte ( 42 ), wherein the substrate includes an exposed conductive layer ( 70 ); and   b. applying a voltage between a first electrode ( 58 ) in electrical contact with the electrolyte ( 42 ) and a second electrode ( 62 ) in electrical contact with the exposed conductive layer ( 70 ), so as to increase the thickness of the exposed conductive layer ( 72 ) by electrolysis.