Printed circuit board precursor

Abstract

A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.

What is claimed is: 
     
         1 . A printed circuit board precursor, comprising:
 a substrate having a top surface and a bottom surface, wherein the substrate is formed of polyimide, and the top and bottom surfaces are conducted under 45 to 55 Celsius degrees with pH 11 to 12 strong base for a duration of 1˜3 minutes and are catalytically treated to respectively form a first palladium catalytic layer and a second palladium catalytic layer;   a first nickel conductive layer and a second nickel conductive layer, wherein the first and second nickel conductive layers are respectively attached to and cover the first and second palladium catalytic layers; and   a first metal layer and a second metal layer, wherein the first and second metal layers are respectively disposed on the first and second nickel conductive layers.   
     
     
         2 . The printed circuit board precursor according to  claim 1 , wherein the substrate has a wall defining a channel, the channel completely penetrating through the substrate from the top surface to the bottom surface, wherein the wall is conducted under 45 to 55 Celsius degrees with pH 11 to 12 strong base for a duration of 1˜3 minutes and is catalytically treated to form a third palladium catalytic layer, and two opposite ends of the third palladium catalytic layer are respectively connected to the first and second palladium catalytic layers. 
     
     
         3 . The printed circuit board precursor according to  claim 2 , further comprising a third nickel conductive layer and a third metal layer, wherein third nickel conductive layer is attached to and covers the third palladium catalytic layer, and two opposite ends of the third nickel conductive layer are respectively connected to the first and second nickel conductive layers, wherein the third metal layer is connected to the third nickel conductive layer and is filled in the channel, and the two opposite ends of the third metal layer are respectively connected to the first and second metal layers. 
     
     
         4 . The printed circuit board precursor according to  claim 1 , wherein each one of the first and second metal layers is an electroplated layer without electrolysis, has a thickness ranging between 50 to 200 nanometers, and each one of the first and second metal layers is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         5 . The printed circuit board precursor according to  claim 1 , wherein each one of the first and second metal layer is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         6 . A printed circuit board precursor, comprising:
 a substrate having a top surface and a bottom surface, wherein the substrate has a wall defining a channel, the channel completely penetrating through the substrate from the top surface to the bottom surface;   a catalytic layer formed on the top surface, the bottom surface, and the wall of the substrate;   a conductive layer attached to and covering the catalytic layer; and   a metal layer disposed on the conductive layer and filled in the channel.   
     
     
         7 . The printed circuit board precursor according to  claim 6 , wherein the substrate is formed of polyimide, wherein the top surface, the bottom surface, and the wall of the substrate each includes a chemical group O═C—N—C═O and a carbon-nitrogen bond of the chemical group is cleaved, forming a carboxyl group O═C—O −  in the substrate, wherein the catalytic layer is chemically bonded with the carboxyl group O═C—O − . 
     
     
         8 . The printed circuit board precursor according to  claim 6 , wherein the metal layer is an electroplated layer without electrolysis, has a thickness ranging between 50 to 200 nanometers, and the metal layer is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         9 . The printed circuit board precursor according to  claim 6 , wherein the metal layer is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         10 . The printed circuit board precursor according to  claim 6 , wherein the catalytic layer is a palladium catalytic layer. 
     
     
         11 . The printed circuit board precursor according to  claim 6 , wherein the conductive layer is a nickel conductive layer. 
     
     
         12 . A printed circuit board precursor, comprising:
 a substrate having a surface, wherein the substrate is formed of polyimide, and the surface is catalytically treated to form a palladium catalytic layer;   a nickel conductive layer attached to and covering the palladium catalytic layer; and   a metal layer disposed on the nickel conductive layer.   
     
     
         13 . The printed circuit board precursor according to  claim 12 , wherein the metal layer is an electroplated layer without electrolysis, has a thickness ranging between 50 to 200 nanometers, and the metal layer is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         14 . The printed circuit board precursor according to  claim 12 , wherein the metal layer is made of a material selected from a group consisting of copper, nickel, chromium, cobalt, nickel alloy, cobalt alloy or the combination thereof. 
     
     
         15 . The printed circuit board precursor according to  claim 12 , wherein the surface of the substrate includes a chemical group O═C—N—C═O and a carbon-nitrogen bond of the chemical group is cleaved, forming a carboxyl group O═C—O −  in the substrate, wherein the palladium catalytic layer is chemically bonded with the carboxyl group O═C—O − .