Cooled electronic system

Abstract

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

1 - 80 . (canceled) 
     
     
         81 . A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
 adapting the container to receive the cooling liquid by at least one of: heating the container to a filling temperature; and reducing the pressure in the interior of the container;   filling the container with the cooling liquid; and   sealing the container to prevent leakage of the cooling liquid.   
     
     
         82 . The method of  claim 81 , further comprising:
 heating the cooling liquid to the filling temperature; and   cooling the sealed container and cooling liquid to an operating temperature.   
     
     
         83 . The method of  claim 81 , wherein the step of filling the container is carried out before the step of adapting the container. 
     
     
         84 . The method of  claim 81 , wherein the step of adapting the container comprises operating the electronic device. 
     
     
         85 . The method of  claim 81 , wherein the filling temperature is selected such that gases dissolved in the cooling liquid are removed from the cooling liquid. 
     
     
         86 . The method of  claim 81 , wherein the filling temperature is selected on the basis of the maximum operating temperature of the electronic device. 
     
     
         87 . The method of  claim 81 , wherein the step of filling the container is carried out such that all air in the container is displaced. 
     
     
         88 . A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
 heating the cooling liquid to a filling temperature;   filling the container with the heating cooling liquid;   sealing the container to prevent leakage of the cooling liquid; and   cooling the sealed container and cooling liquid to an operating temperature.   
     
     
         89 . The method of  claim 88 , wherein the filling temperature is selected such that gases dissolved in the cooling liquid are removed from the cooling liquid. 
     
     
         90 . The method of  claim 88 , wherein the filling temperature is selected on the basis of the maximum operating temperature of the electronic device. 
     
     
         91 . The method of  claim 88 , wherein the step of filling the container is carried out such that all air in the container is displaced.