Physical contact layer for body-worn leadware using selective disposition

Abstract

A printed electrical circuit and methods for additively printing electrical circuits. Patterned layers of conductive, insulating, semi-conductive materials, and other materials are print deposited on a flexible or rigid substrate to form electrical circuits. A buffering layer is selectively deposited to cover or encapsulate these materials to comprise a comfort layer that provides a soft and comfortable interface to the skin of a wearer. The comfort layer can be selectively deposited on the same press that the conductive, insulating, semi-conductive materials, and other materials are deposited. Further, the comfort layer is selectively deposited only where it is desired and exactly where it is desired.

What is claimed is: 
     
         1 . A method of printing a flexible electronic, the method comprising:
 providing a substrate;   depositing at least a conductive material on a first side of the substrate to provide electronic circuitry; and   selectively depositing a comfort layer which encompasses at least a portion of the electronic circuitry.   
     
     
         2 . The method as defined in  claim 1 , wherein the substrate is not configured to be separated from the electronic circuitry. 
     
     
         3 . The method as defined in  claim 1 , wherein the comfort layer is selectively deposited by printing, spray coating, or through a patterned or prepared mask. 
     
     
         4 . The method as defined in  claim 3 , wherein the comfort layer is deposited by a printing technique comprising gravure, waterless offset, direct image waterless offset, lithographic, intaglio, embossing, engraving, screen, rotary screen, silkscreen, letterpress, flatbed, digital printing, ink jet, drop on demand, xerographic, flexographic, aerosol, pad, dip-pen, or combinations thereof. 
     
     
         5 . The method as defined in  claim 1 , wherein the comfort layer comprises a cured ink. 
     
     
         6 . The method as defined in  claim 5 , wherein the cured ink is a plastisol ink having a puff additive. 
     
     
         7 . The method as defined in  claim 5 , wherein the comfort layer is formed of an electronic ink. 
     
     
         8 . The method as defined in  claim 1 , wherein the comfort layer exhibits electrically insulative properties such that the comfort layer provides electrical isolation for the encapsulated portions of the circuitry. 
     
     
         9 . The method as defined in  claim 1 , wherein the comfort layer provides mechanical protection to the encapsulated circuitry. 
     
     
         10 . The method as defined in  claim 1 , wherein the comfort layer is waterproof or water resistant such that the comfort layer protects the encapsulated circuitry from water moisture. 
     
     
         11 . The method as defined in  claim 1 , wherein the comfort layer is solvent-proof or solvent-resistant such that the comfort layer protects the encapsulated circuitry from chemical intrusion. 
     
     
         12 . The method as defined in  claim 1 , wherein the conductive material is formed from a material selected from the group consisting of silver, platinum, palladium, copper, nickel, gold, aluminum, or conductive polymer. 
     
     
         13 . The method as defined in  claim 1 , further comprising the step of selectively depositing a dielectric material between at least a portion of the conductive material and the comfort layer, where the selectively deposited dielectric material forms part of the electronic circuitry. 
     
     
         14 . The method as defined in  claim 13 , wherein the dielectric material comprises a vinyl or urethane resin. 
     
     
         15 . The method as defined in  claim 1 , wherein the substrate is flexible, and wherein the substrate, electronic circuitry and comfort layer are substantially free from memory folds upon flexure of the substrate. 
     
     
         16 . The method as defined in  claim 1 , further comprising the step of selectively depositing a second comfort layer over at least a portion of a second side of the substrate. 
     
     
         17 . The method as defined in  claim 1 , wherein the electronic circuitry is adapted and/or designed for monitoring nervous system signals, respiratory system signals, circulatory system signals, for providing electrical stimulation, electronic display, or any combination thereof. 
     
     
         18 . The method as defined in  claim 1 , wherein the assembly is incorporated into wearable smart clothes, hospital gowns, blankets, sheets, tents, mattress covers, towels, bibs, or pillow covers. 
     
     
         19 . A method of printing a flexible electronic configured to be worn on a body of a wearer, the method comprising the steps of:
 providing a conductive layer which allows for the flow of electricity therethrough; and   covering or encapsulating at least a portion of the conductive layer with a comfort layer, wherein the comfort layer is a cured ink, and wherein the comfort layer is configured to be positioned against the body of the wearer.   
     
     
         20 . The method as defined in  claim 19 , wherein the cured ink is a plastisol ink having a puff additive. 
     
     
         21 . The method as defined in  claim 19 , wherein the conductive layer is a base layer of the flexible printed electronic. 
     
     
         22 . The method as defined in  claim 19 , wherein the conductive layer is formed of an electronic ink. 
     
     
         23 . The method as defined in  claim 19 , further comprising the steps of:
 providing a base layer; and   covering or encapsulating at least a portion of the base layer with the conductive layer.   
     
     
         24 . The method as defined in  claim 23 , wherein the base layer is fabric. 
     
     
         25 . The method as defined in  claim 24 , wherein the fabric is provided in a piece of clothing. 
     
     
         26 . The method as defined in  claim 23 , wherein the base layer is a substrate. 
     
     
         27 . The method as defined in  claim 26 , wherein the flexible printed electronic is configured to be coupled to fabric provided in a piece of clothing. 
     
     
         28 . A method of printing a flexible electronic configured to be worn on a body of a wearer, the method comprising the steps of:
 providing a conductive layer which allows for the flow of electricity therethrough;   covering or encapsulating at least a portion of the conductive layer with a dielectric layer; and   covering or encapsulating at least a portion of the dielectric layer with a comfort layer, wherein the comfort layer is a cured ink, and wherein the comfort layer is configured to be positioned against the body of the wearer.   
     
     
         29 . The method as defined in  claim 28 , wherein the cured ink is a plastisol ink having a puff additive. 
     
     
         30 . The method as defined in  claim 28 , wherein the conductive layer is a base layer of the flexible printed electronic. 
     
     
         31 . The method as defined in  claim 28 , wherein the conductive layer is formed of an electronic ink. 
     
     
         32 . The method as defined in  claim 28 , further comprising the steps of:
 providing a base layer; and   covering or encapsulating at least a portion of the base layer with the conductive layer.   
     
     
         33 . The method as defined in  claim 32 , wherein the base layer is fabric. 
     
     
         34 . The method as defined in  claim 33 , wherein the fabric is provided in a piece of clothing. 
     
     
         35 . The method as defined in  claim 32 , wherein the base layer is a substrate. 
     
     
         36 . The method as defined in  claim 35 , wherein the flexible printed electronic is configured to be coupled to fabric provided in a piece of clothing.