Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate

Abstract

A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable film on the via-defining substrate; and providing interconnects on the via-defining substrate. Providing interconnects comprises providing a patterned build-up layer on the via-defining substrate comprising exposing the laser activatable film to laser irradiation to selectively activate portions of the film according to a predetermined interconnect pattern; and metallizing the patterned build-up layer according to the predetermined interconnect pattern to yield the interconnects to provide the printed circuit board.

What is claimed: 
     
         1 . A printed circuit board comprising:
 a via-defining substrate comprising a microelectronic substrate defining via openings therein; and   interconnects provided on the via-defining substrate according to a predetermined interconnect pattern, the interconnects comprising a conductive layer having a pattern corresponding to the predetermined interconnect pattern, the conductive layer further being made substantially from a first material, the conductive layer further comprising a second material different from the first material, the second material including a metallic seeding material and being present on the via-defining substrates only at regions corresponding to the interconnects.   
     
     
         2 . The printed circuit board of claim  17 , wherein the second material comprises a palladium seeded organic material. 
     
     
         3 . The printed circuit board of claim  17 , wherein the conductive layer comprises copper. A system comprising:
 a printed circuit board including:
 a via-defining substrate comprising a microelectronic substrate defining via openings therein; and 
 interconnects provided on the via-defining substrate according to a predetermined interconnect pattern, the interconnects comprising a conductive layer having a pattern corresponding to the predetermined interconnect pattern, the conductive layer further being made substantially from a first material, the conductive layer further comprising a second material different from the first material, the second material including a metallic seeding material and being present on the via-defining substrates only at regions corresponding to the interconnects; and 
   a memory device coupled to the printed circuit board.   
     
     
         4 . The printed circuit board of claim  20 , wherein the second material comprises a palladium seeded organic material. 
     
     
         5 . The printed circuit board of claim  20 , wherein the conductive layer comprises copper.