Optoelectronic device packages

Abstract

An optical proximity sensor comprises a light detector die including a light detector sensor area and at least one bond pad on a portion of the light detector die not including the light detector sensor area. A light source die, including anode and cathode terminals, is attached to a portion of the light detector die not including the light detector sensor area, such that at least one of the terminals of the light source die, on a bottom of the light source die, is attached to at least one of the bond pads on the light detector die. An opaque barrier, formed off-wafer relative to a wafer including the light detector die, is attached to and extends upward from a top surface of the light detector die between the light detector sensor area and the light source die. Electrical connectors are on the bottom of the light detector die.

What is claimed is: 
     
         1 . An optical proximity sensor, comprising:
 a light detector die that includes a light detector sensor area and at least two bond pads on a portion of the light detector die that does not include the light detector sensor area;   a light source die including anode and cathode terminals and attached to a portion of the light detector die that does not include the light detector sensor area, such that at least one of the terminals of the light source die, which is on a bottom of the light source die, is attached to at least one of the bond pads on the light detector die;   an opaque barrier, formed off-wafer relative to a wafer including the light detector die, attached to and extending upward from a top of the light detector die between the light detector sensor area and the light source die so that the entire light source die is on an opposite side of the opaque barrier than the light detector sensor area;   electrical connectors for both the light detector sensor area and the light source die on a bottom of the light detector die; and   vias in the light detector die that electrically connect the light detector sensor area and the anode and cathode terminals of the light source die to respective ones of the electrical connectors that are on the bottom of the light detector die.   
     
     
         2 . The optical proximity sensor of  claim 1 , wherein the opaque barrier is adhered to the top of the light detector die, between the light detector sensor area and the light source die, by an opaque epoxy. 
     
     
         3 . The optical proximity sensor of  claim 1 , wherein the opaque barrier is made from one or more etched sheets of opaque material, and wherein each of the one or more etched sheets of opaque material is selected from the group consisting of a sheet of metal, a sheet of silicon or a sheet of glass treated to be opaque. 
     
     
         4 . The optical proximity sensor of  claim 1 , wherein the opaque barrier is made from an opaque liquid crystal polymer. 
     
     
         5 . The optical proximity sensor of  claim 1 , wherein the opaque barrier is made from polyphthalamide. 
     
     
         6 . The optical proximity sensor of  claim 1 , wherein the opaque barrier is made from a high temperature thermo-plastic material. 
     
     
         7 . The optical proximity sensor of  claim 1 , wherein the anode and cathode terminals of the light source die are both on the bottom of the light source die and are attached to respective ones of the bond pads on the light detector die by an electrically conductive epoxy. 
     
     
         8 . The optical proximity sensor of  claim 7 , wherein the optical proximity sensor does not include any bond wires. 
     
     
         9 . The optical proximity sensor of  claim 8 , further comprising a light transmissive material that encapsulates the light detector sensor region and the light source die. 
     
     
         10 . The optical proximity sensor of  claim 1 , further comprising a light transmissive material that encapsulates the light detector sensor region and the light source die. 
     
     
         11 . The optical proximity sensor of  claim 1 , wherein one of the anode and cathode terminals of the light source die is on the bottom of the light source die and is attached to one of the bond pads on the light detector die by an electrically conductive epoxy, and the other one of the anode and cathode terminals of the light source die is on the top of the light source die and is attached to another one of the bond pads on the light detector die by a bond wire. 
     
     
         12 . The optical proximity sensor of  claim 11 , wherein the bond wire that attaches the one of the anode and cathode terminals of the light source die, which is on the top of the light source die, to one of the bond pads on the light detector die, is the only bond wire of the optical proximity sensor. 
     
     
         13 . The optical proximity sensor of  claim 12 , further comprising a light transmissive material that encapsulates the light detector sensor region, the light source die, and the only bond wire of the optical proximity sensor. 
     
     
         14 . An optical proximity sensor, comprising:
 a light detector die that includes a light detector sensor area and at least two bond pads on a portion of the light detector die that does not include the light detector sensor area;   a light source die including anode and cathode terminals and attached to a portion of the light detector die that does not include the light detector sensor area, such that at least one of the terminals of the light source die, which is on a bottom of the light source die, is attached to at least one of the bond pads on the light detector die;   an opaque barrier, formed off-wafer relative to the light detector die, attached to and extending upward from a top of the light detector die between the light detector sensor area and the light source die so that the entire light source die is on an opposite side of the opaque barrier than the light detector sensor area;   electrical connectors for both the light detector sensor area and the light source die on a bottom of the light detector die; and   vias in the light detector die that electrically connect the light detector sensor area and the anode and cathode terminals of the light source die to respective ones of the electrical connectors that are on the bottom of the light detector die;   wherein the opaque barrier is made from at least two etched sheets of opaque material;   wherein each of the etched sheets of opaque material is selected from the group consisting of a sheet of metal, a sheet of silicon or a sheet of glass treated to be opaque; and   wherein each of the etched sheets of opaque material is adhered to the top of the light detector die, or to another one of the etched sheets of opaque material, by an opaque epoxy.   
     
     
         15 . The optical proximity sensor of  claim 14 , wherein:
 the anode and cathode terminals of the light source die are both on the bottom of the light source die and are attached to respective ones of the bond pads on the light detector die by an electrically conductive epoxy;   the optical proximity sensor does not include any bond wires;   the optical proximity sensor further comprises a light transmissive material that encapsulates the light detector sensor region and the light source die.   
     
     
         16 . The optical proximity sensor of  claim 14 , wherein one of the anode and cathode terminals of the light source die is on the bottom of the light source die and is attached to one of the bond pads on the light detector die by an electrically conductive epoxy, and the other one of the anode and cathode terminals of the light source die is on the top of the light source die and is attached to another one of the bond pads on the light detector die by a bond wire. 
     
     
         17 . The optical proximity sensor of  claim 16 , further comprising a light transmissive material that encapsulates the light detector sensor region, the light source die, and the bond wire. 
     
     
         18 . An optical proximity sensor, comprising:
 a light detector die that includes a light detector sensor area and first and second bond pads on a portion of the light detector die that does not include the light detector sensor area;   a light source die including anode and cathode terminals that are both on a bottom of the light source die and are attached to respective ones of the first and second bond pads on the light detector die without using any bond wires;   an opaque barrier extending upward from the light detector die between the light detector sensor area and the light source die so that the entire light source die is on an opposite side of the opaque barrier than the light detector sensor area;   electrical connectors for both the light detector sensor area and the light source die on a bottom of the light detector die; and   vias in the light detector die that electrically connect the light detector sensor area and the first and second bond pads, and thereby the anode and cathode terminals of the light source die, to respective ones of the electrical connectors that are on the bottom of the light detector die.   
     
     
         19 . The optical proximity sensor of  claim 18 , wherein the anode and cathode terminals of the light source die are attached to respective ones of the first and second bond pads on the light detector die by an electrically conductive epoxy. 
     
     
         20 . The optical proximity sensor of  claim 18 , wherein the optical proximity sensor does not include any bond wires.