Solid-state drive with passive heat transfer

Abstract

The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

What is claimed is: 
     
         1 . A module, comprising:
 a first circuit board having an integrated circuit disposed on a first surface of the first circuit board; and   a second circuit board separated by a gap from the first circuit board; and   a thermal-coupling material that: is positioned between and thermally coupled to at least a portion of the first circuit board and the second circuit board, wherein the thermal-coupling material provides for thermal conductance between the first circuit board and the second circuit board.   
     
     
         2 . The module of  claim 1 , wherein the first surface faces the second circuit board and the thermal-coupling material is thermally coupled to at least a portion of the first surface. 
     
     
         3 . The module of  claim 2 , wherein the thermal-coupling material is thermally coupled to at least a portion of the integrated circuit. 
     
     
         4 . The module of  claim 1 , wherein the first surface faces the second circuit board and at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit. 
     
     
         5 . The module of  claim 1 , wherein a second surface of the first circuit board faces the second circuit board and the thermal-coupling material is thermally coupled to at least a portion of the second surface. 
     
     
         6 . The module of  claim 5 , wherein the first surface is on an opposite side of the first circuit board from the second surface and the first circuit board is configured to thermally transfer heat from the first surface to the second surface. 
     
     
         7 . The module of  claim 1 , wherein the integrated circuit includes an electromagnetic interference shield. 
     
     
         8 . The module of  claim 1 , wherein the first circuit board includes a second surface on an opposite side of the first circuit board from the first surface; and
 wherein the first circuit board includes components disposed on the first surface and the second surface, the components including the integrated circuit.   
     
     
         9 . A portable electronic device, comprising:
 a first circuit board having an integrated circuit disposed on a first surface of the first circuit board; and   a second circuit board separated by a gap from the first circuit board; and   a thermal-coupling material that: is positioned between and thermally coupled to at least a portion of the first circuit board and the second circuit board, wherein the thermal-coupling material provides for thermal conductance between the first circuit board and the second circuit board.   
     
     
         10 . The portable electronic device of  claim 9 , wherein the first surface faces the second circuit board and the thermal-coupling material is thermally coupled to at least a portion of the first surface. 
     
     
         11 . The portable electronic device of  claim 10 , wherein the thermal-coupling material is thermally coupled to at least a portion of the integrated circuit. 
     
     
         12 . The portable electronic device of  claim 9 , wherein the first surface faces the second circuit board and at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit. 
     
     
         13 . The portable electronic device of  claim 9 , wherein a second surface of the first circuit board faces the second circuit board and the thermal-coupling material is thermally coupled to at least a portion of the second surface. 
     
     
         14 . The portable electronic device of  claim 13 , wherein the first surface is on an opposite side of the first circuit board from the second surface and the first circuit board is configured to thermally transfer heat from the first surface to the second surface. 
     
     
         15 . The portable electronic device of  claim 9 , wherein the integrated circuit includes an electromagnetic interference shield. 
     
     
         16 . The portable electronic device of  claim 9 , wherein the first circuit board includes a second surface on an opposite side of the first circuit board from the first surface; and
 wherein the first circuit board includes components disposed on the first surface and the second surface, the components including the integrated circuit.   
     
     
         17 . A method for transferring heat from an integrated circuit of a first circuit board, the method comprising:
 transferring first heat from the integrated circuit to a first surface of the first circuit board; and   transferring the first heat from the first circuit board to a second circuit board using a thermal-coupling material disposed between and thermally coupled to at least a portion of the first circuit board and the second circuit board.   
     
     
         18 . The method of  claim 17 , wherein the thermal-coupling material is thermally coupled to the first surface. 
     
     
         19 . The method of  claim 17 , wherein at least a portion of the thermal-coupling material is thermally coupled to a second surface of the first circuit board, the second surface on an opposite side of the first circuit board from the first surface; and
 wherein the method further comprises conducting the first heat from the first surface to the second surface.   
     
     
         20 . The method of  claim 17 , wherein the thermal-coupling material is thermally coupled to at least a portion of the integrated circuit; and
 wherein the method further comprises transferring second heat from the integrated circuit to the second circuit board.