Circuit assemblies and related methods

Abstract

In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

What is claimed is: 
     
         1 . An assembly suitable for use in an electronic device, the assembly comprising:
 a board level shield (BLS) having an outer surface;   dielectric material along at least a portion of the outer surface of the BLS; and   electrically conductive material along at least a portion of the dielectric material such that the dielectric material is between the electrically conductive material and the outer surface of the BLS, whereby the electrically conductive material is configured to define at least a portion of a circuit assembly for connection with one or more components of the electronic device.   
     
     
         2 . The assembly of  claim 1 , wherein the dielectric material is thermally conductive. 
     
     
         3 . The assembly of  claim 1 , wherein the dielectric material comprises one or more of a printed dielectric surface, a sprayed dielectric surface, and/or a painted dielectric surface. 
     
     
         4 . The assembly of  claim 1 , wherein:
 the electrically conductive material comprises one or more of a flexible circuit, a pattern of electrically conductive material, and/or one or more routing connections; and   the electrically conductive material is connected or connectible between two or more electrical components.   
     
     
         5 . The assembly of  claim 1 , wherein the electrically conductive material comprises a flexible circuit including one or more of a polyimide film, an adhesive, and/or a metal foil. 
     
     
         6 . The assembly of  claim 1 , wherein:
 the BLS is configured for installation to a substrate for providing electromagnetic interference (EMI) shielding for one or more components on the substrate; and   the electrically conductive material is configured for electrical connection with one or more other components on the same substrate that are not under the BLS when the BLS is installed to the substrate;   whereby the BLS is multifunctional having a first functionality of providing EMI shielding and a second functionality of supporting the circuit assembly.   
     
     
         7 . The assembly of  claim 1 , wherein:
 the BLS comprises a cover and one or more sidewalls depending from the cover;   the dielectric material is along at least a portion of an outer surface of the cover; and   the electrically conductive material defines at least a portion of the circuit assembly along the cover of the BLS.   
     
     
         8 . The assembly of  claim 7 , wherein:
 the dielectric material is along at least a portion of an outer surface of at least one sidewall of the one or more sidewalls; and   the electrically conductive material defines at least a portion of the circuit assembly along the at least one sidewall.   
     
     
         9 . The assembly of  claim 8 , wherein:
 the BLS is configured for installation to a first printed circuit board (PCB);   the assembly further comprises a second printed circuit board (PCB) on the outer surface of the cover or on the dielectric material along the outer surface of the cover; and   the electrically conductive material extends from the second PCB along the cover and the at least one side wall of the BLS to the first PCB for electrically connecting one or more components of the first PCB with one or more components of the second PCB.   
     
     
         10 . The assembly of  claim 7 , wherein:
 the dielectric material is along at least a portion of an outer surface of at least two opposing sidewalls of the one or more sidewalls; and   the electrically conductive material defines one or more routing connections between the two opposing sidewalls across the cover of the BLS.   
     
     
         11 . The assembly of  claim 1 , wherein:
 the dielectric material is directly on the at least a portion of the outer surface of the BLS; and   the electrically conductive material is directly on the at least a portion of the dielectric material.   
     
     
         12 . An electronic device comprising the assembly of  claim 1 , a printed circuit board (PCB), one or more first components on the PCB, and one or more second components on the PCB, wherein the BLS is installed on the PCB for providing electromagnetic interference (EMI) shielding for the one or more first components on the PCB, and wherein the electrically conductive material is electrically connected with the one or more second components on the PCB. 
     
     
         13 . An assembly suitable for use in an electronic device, the assembly comprising:
 an electrically conductive structure configured for a first functionality in the electronic device;   an electrically nonconductive layer on at least part of the electrically conductive structure; and   one or more first electrical components at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device;   whereby the electrically conductive structure is configured for a second functionality in addition to the first functionality in the electronic device.   
     
     
         14 . The assembly of  claim 13 , wherein the electrically conductive structure comprises one or more of a board level shield (BLS), a mid-plate, and/or a bracket. 
     
     
         15 . The assembly of  claim 13 , wherein the dielectric material is thermally conductive. 
     
     
         16 . The assembly of  claim 13 , wherein the electrically conductive structure comprises a board level shield (BLS) configured for installation to a substrate for providing electromagnetic interference (EMI) shielding for one or more components on the substrate, whereby the first functionality of the BLS is EMI shielding and the second functionality of the BLS is supporting the circuit assembly. 
     
     
         17 . The assembly of  claim 13 , wherein:
 the electrically nonconductive layer comprises one or more of a printed dielectric surface, a sprayed dielectric surface, and/or a painted dielectric surface; and/or   the one or more first electrical components comprise one or more of a flexible circuit, a pattern of electrically conductive material, and/or one or more routing connections; and   the one or more first electrical components are connected or connectable between two or more electrical components.   
     
     
         18 . An electronic device comprising the assembly of  claim 13 , a printed circuit board (PCB), wherein the one or more second electrical components are on the PCB, and wherein the one or more first electrical components are electrical connected with the one or more second electrical components on the PCB. 
     
     
         19 . A method of making a circuit assembly suitable for use in an electronic device, the method comprising:
 applying an electrically nonconductive layer on at least part of an electrically conductive structure, the electrically conductive structure configured to have a first functionality in the electronic device;   providing one or more first electrical components at least partly on the electrically nonconductive layer; and   configuring the one or more first electrical components for electrical connection with one or more second electrical components of the electronic device;   whereby the electrically conductive structure is configured to have a second functionality in addition to the first functionality.   
     
     
         20 . The method of  claim 19 , wherein:
 applying the electrically nonconductive layer comprises one or more of printing at least part of the electrically nonconductive layer; and/or spraying at least part of the electrically nonconductive layer; and/or painting at least part of the electrically nonconductive layer; and/or   providing the one or more first electrical components comprises one or more of installing a flexible circuit on the electrically nonconductive layer; and/or patterning a top surface of the electrically nonconductive layer with electrically conductive paint; and/or   the electrically conductive structure comprises a board level shield (BLS) configured for installation to a substrate for providing electromagnetic interference (EMI) shielding for one or more components on the substrate, whereby the first functionality of the BLS is EMI shielding and the second functionality of the BLS is supporting the circuit assembly; and/or   configuring the one or more first electrical components for electrical connection comprises configuring the one or more first electrical components as routing connectors.