Display structure and manufacturing method of display device

Abstract

The invention provides a display structure and manufacturing method of a display device, and relates to the field of display device technology. By forming a complex encapsulation film with the function of buffering and water-and-oxygen barrier on a display module directly, and attaching the cover on the complex encapsulation film, so as to ensure the sealing effect of the display module, and to efficiently prevent the display screen from breaking caused by the stress concentration generated by impact of external forces, thus the probability of breaking of display screen can be reduced effectively, and the structural strength of the display device as a whole is greatly improved.

What is claimed is: 
     
         1 . A display structure, comprising:
 a rigid substrate, having a driving circuit therein;   a display module disposed on the rigid substrate and connected to the driving circuit to be able to be driven by the driving circuit;   a complex encapsulation film, fully covering the display module on the rigid substrate to seal the display module, wherein the complex encapsulation film comprises a combination of organic and inorganic layers; and   a cover, attached on the complex encapsulation film.   
     
     
         2 . The display structure of  claim 1 , further comprising an optical film disposed between the cover and the complex encapsulation film, such that the cover is attached with a portion of top surface of the complex encapsulation film through the optical film, wherein the portion of top surface of the complex encapsulation film is substantially parallel to the cover or the rigid substrate. 
     
     
         3 . The display structure of  claim 2 , wherein the cover comprises a touch panel and a cover glass, and the touch panel is stacked with the cover glass, and the optical film is attached on the touch panel. 
     
     
         4 . The display structure of  claim 1 , wherein the rigid substrate is a glass based substrate. 
     
     
         5 . The display structure of  claim 1 , wherein,
 the display module has a light emitting surface configured to emit light, and a backlight surface opposite to the light emitting surface; and   the backlight surface of the display module is attached on surface of the rigid substrate, and the complex encapsulation film covers the light emitting surface of the display module.   
     
     
         6 . The display structure of  claim 1 , wherein the combined organic and inorganic layers of the complex encapsulation film are all made of transparent materiel. 
     
     
         7 . The display structure of  claim 6 , wherein in the complex encapsulation film comprises a water-and-oxygen barrier layer and a buffering layer, and the water-and-oxygen barrier layer is stacked with the buffering layer. 
     
     
         8 . The display structure of  claim 7 , wherein the water-and-oxygen barrier layer and/or the buffering layer are/is composite layer film. 
     
     
         9 . The display structure of  claim 7 , wherein the water-and-oxygen barrier layer and/or the buffering layer are/is a single layer film. 
     
     
         10 . A method of manufacturing a display device, comprising:
 providing a rigid substrate with a driving circuit formed therein;   forming a display module on the rigid substrate to electronically connected to the driving circuit;   forming a complex encapsulation film to fully cover the display module to seal the display module on the rigid substrate; and   providing a cover on the complex encapsulation film; wherein   the complex encapsulation film layer comprises at least a water-and-oxygen barrier layer and a buffering layer, and the water-and-oxygen barrier layer is stacked with the buffering layer.   
     
     
         11 . The method of  claim 10 , after the complex encapsulation film forming step further comprising: forming an optical film on a portion of surface of the complex encapsulation film, wherein the portion of surface of the complex encapsulation film is substantially parallel to the rigid substrate. 
     
     
         12 . The method of  claim 11 , wherein the step of providing the cover on the complex encapsulation film comprises: providing the cover to be attached to the optical film, such that the cover is connected to the complex encapsulation film through the optical film. 
     
     
         13 . The method of  claim 10 , wherein the cover comprises a touch panel and a cover glass, and the touch panel is stacked with the cover glass. 
     
     
         14 . The method of  claim 10 , wherein
 the display module has a light emitting surface configured to emit light, and a backlight surface opposite to the light emitting surface; and   the backlight surface of the display module is attached on the surface of the rigid substrate, and the complex encapsulation film covers the light emitting surface of the display module.   
     
     
         15 . The method of  claim 10 , wherein the water-and-oxygen barrier layer and the buffering layer are made of transparent material. 
     
     
         16 . The method of  claim 15 , wherein the water-and-oxygen barrier layer and/or the buffering layer are/is composite layer film. 
     
     
         17 . The method of  claim 10 , wherein the water-and-oxygen barrier layer is an organic layer, an inorganic layer or an organic/inorganic stacking layer.