US2016330835A1PendingUtilityA1

Wiring board

43
Assignee: TOPPAN FORMS CO LTDPriority: Jan 24, 2014Filed: Jan 23, 2015Published: Nov 10, 2016
Est. expiryJan 24, 2034(~7.5 yrs left)· nominal 20-yr term from priority
H05K 2201/098H05K 2201/09681G06F 2203/04112H05K 1/0274G06F 2203/04103G06F 3/041H05K 3/1275H05K 2201/032H05K 1/0225H05K 1/092
43
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Claims

Abstract

A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

Claims

exact text as granted — not AI-modified
1 . A wiring board comprising:
 thin silver wires formed on a substrate by a printing method,   wherein a width of the thin silver wire in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, and a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and   a volume resistivity of the thin silver wire is 15 μΩ·cm or less.   
     
     
         2 . The wiring board according to  claim 1 ,
 wherein an aspect ratio of the thin silver wire in the cross-section in the direction perpendicular to the wire length direction thereof is 0.1 or less.   
     
     
         3 . The wiring board according to  claim 1 ,
 wherein a difference in light transmittance between the wiring board and the substrate which is not provided with the thin silver wires is 15% or less in terms of light having the same wavelength.   
     
     
         4 . The wiring board according to  claim 1 ,
 wherein a thickness of the substrate is 0.5 μm to 5000 μm.   
     
     
         5 . The wiring board according to  claim 1 ,
 wherein a pitch between the thin silver wires is 50 μm to 320 μm.   
     
     
         6 . The wiring board according to  claim 1 ,
 wherein a pattern in which a plurality of the thin silver wires intersect is provided as a pattern of the thin silver wires.   
     
     
         7 . The wiring board according to  claim 1 ,
 wherein the thin silver wires are formed by using a silver ink composition, and   the silver ink composition is produced by mixing a silver carboxylate, and a nitrogen-containing compound, with either or both of a reducing agent and an alcohol.

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