US2016330835A1PendingUtilityA1
Wiring board
Est. expiryJan 24, 2034(~7.5 yrs left)· nominal 20-yr term from priority
H05K 2201/098H05K 2201/09681G06F 2203/04112H05K 1/0274G06F 2203/04103G06F 3/041H05K 3/1275H05K 2201/032H05K 1/0225H05K 1/092
43
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Claims
Abstract
A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Claims
exact text as granted — not AI-modified1 . A wiring board comprising:
thin silver wires formed on a substrate by a printing method, wherein a width of the thin silver wire in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, and a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
2 . The wiring board according to claim 1 ,
wherein an aspect ratio of the thin silver wire in the cross-section in the direction perpendicular to the wire length direction thereof is 0.1 or less.
3 . The wiring board according to claim 1 ,
wherein a difference in light transmittance between the wiring board and the substrate which is not provided with the thin silver wires is 15% or less in terms of light having the same wavelength.
4 . The wiring board according to claim 1 ,
wherein a thickness of the substrate is 0.5 μm to 5000 μm.
5 . The wiring board according to claim 1 ,
wherein a pitch between the thin silver wires is 50 μm to 320 μm.
6 . The wiring board according to claim 1 ,
wherein a pattern in which a plurality of the thin silver wires intersect is provided as a pattern of the thin silver wires.
7 . The wiring board according to claim 1 ,
wherein the thin silver wires are formed by using a silver ink composition, and the silver ink composition is produced by mixing a silver carboxylate, and a nitrogen-containing compound, with either or both of a reducing agent and an alcohol.Cited by (0)
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