Photoarray system construction

Abstract

Embodiments of a photoarray system are provided. In one embodiment, a photoarray system includes an array of lixels, each lixel comprising at least one electrical component supported on a respective platform, each lixel in the array electrically interconnected with at least one adjacent lixel via one or more flexible wires; and heat sink structure supported on each of the platforms for dissipating heat generated by the at least one electrical component, the heat sink structure incorporating strain resistance structure interfacing with, and imparting strain resistance to, the one or more flexible wires.

What is claimed is: 
     
         1 . A photoarray system comprising:
 an array of lixels, each lixel comprising at least one electrical component supported on a respective platform, each lixel in the array electrically interconnected with at least one adjacent lixel via one or more flexible wires; and   heat sink structure supported on each of the platforms for dissipating heat generated by the at least one electrical component, the heat sink structure incorporating strain resistance structure interfacing with, and imparting strain resistance to, the one or more flexible wires.   
     
     
         2 . The photoarray system of  claim 1 , wherein the strain resistance structure comprises one or more posts against which the one or more flexible wires are positioned to bear when subjected to strain. 
     
     
         3 . The photoarray system of  claim 1 , wherein the strain resistance structure comprises:
 at least one open-ended channel extending along the heat sink and defined by sidewalls; and   each channel having an least one entryway through a respective sidewall;   wherein each channel and entryway is dimensioned to receive at least one of the one or more flexible wires.   
     
     
         4 . The photoarray system of  claim 3 , wherein the strain resistance structure comprises two of the open-ended channels. 
     
     
         5 . The photoarray system of  claim 4 , wherein each of the two open-ended channels has at least two entryways through respective sidewalls. 
     
     
         6 . The photoarray system of  claim 5 , wherein each of the two open-ended channels has three entryways through respective sidewalls. 
     
     
         7 . The photoarray system of  claim 4 , wherein a first of the two open-ended channels has a different number of entryways than the second of the two open-ended channels. 
     
     
         8 . A photoarray system comprising:
 a control system;   a lixel array comprising a plurality of lixels each comprising at least one radiation source that is individually controllable by the control system to emit radiation; and   a sensor array comprising a plurality of sensor modules distributed amongst the plurality of radiation sources, each of the sensor modules configured to communicate respective local readings to the control system,   wherein each of the radiation sources is supported on a respective platform comprising a circuit board, wherein each circuit board is interconnected with at least one adjacent circuit board with a plurality of flexible wires.   
     
     
         9 . The system of  claim 8 , wherein each platform supports only one radiation source. 
     
     
         10 . The system of  claim 8 , wherein each platform supports at least two radiation sources. 
     
     
         11 . The system of  claim 8 , wherein each platform comprises a circuit board. 
     
     
         12 . The system of  claim 11 , wherein the printed circuit board has a shape selected from the group consisting of: a hexagon, a square, a circle and an irregular shape. 
     
     
         13 . The system of  claim 8 , wherein the flexible wires are connected to circuit boards with a respective insulation displacement connector. 
     
     
         14 . The system of  claim 11 , wherein each circuit board is in contact with a heat transfer structure. 
     
     
         15 . The system of  claim 14 , wherein each heat transfer structure comprises a heat sink supported by the circuit board and configured to draw heat away from one or more radiation sources. 
     
     
         16 . The system of  claim 14 , wherein the heat transfer structure comprises one or more tubes incorporating a liquid coolant, each tube being associated with a plurality of the circuit boards to transfer heat away from one or more lixels along the one or more tubes. 
     
     
         17 . The system of  claim 14 , wherein the heat transfer structure comprises a flexible phase change material within a rigid or flexible container. 
     
     
         18 . A lixel array for a photoarray system comprising:
 a plurality of flexibly interconnected lixels each comprising at least one radiation source, each lixel comprising a rigid platform for supporting the at least one respective radiation source, each platform being configured to be moved with respect to an adjacent platform between a position in which an edge of the platform and a facing edge of an adjacent platform are spaced and a position in which the edge of the platform and the facing edge are in contact with each other.   
     
     
         19 . The lixel array of  claim 18 , wherein the lixel array comprises sections of lixels, and each of the lixels in a section of lixels is flexibly interconnected with a plurality of wires. 
     
     
         20 . The lixel array of  claim 19 , wherein the wires have a slack region between adjacent platforms. 
     
     
         21 . The lixel array of  claim 19 , wherein each section of lixels comprises a control strip associated with the lixels for limiting the extent of movement of lixels with respect to each other.