Electric discharge machining die sinking device and related method of operation

Abstract

Systems and methods for controlled and precise EDM manufacturing of a component are disclosed. In one embodiment, a system includes: a tank for holding a fluid; a first electrode array in the tank, the first electrode array including a plurality of electrodes configured to shape a workpiece; a workpiece fixture for positioning the workpiece at least partially immersed in the fluid and proximate the first electrode array; a pulse generator for creating an electric discharge between the workpiece and the first electrode array to remove material from the workpiece; a gap sensing circuit communicatively connected to the workpiece and the first electrode array, the gap sensing circuit configured to monitor the electric discharge between the workpiece and the first electrode array; and a computing device communicatively connected to the gap sensing circuit and the workpiece fixture, the computing device manipulating a position of the workpiece in the tank relative the first electrode array based upon data obtained from the gap sensing circuit.

What is claimed is: 
     
         1 . A gap sensing circuit comprising:
 a voltage divider communicatively connected to a first electrode array and configured to monitor an inter-electrode gap between the first electrode array and a workpiece; and   a voltage integrator communicatively connected to the voltage divider and a reference voltage, the voltage integrator configured to compare data obtained from the first electrode array with the reference voltage to determine a feed rate of the workpiece, wherein the feed rate is based on a discharge channel which generates the highest number of pulses with discharge or shorting current.   
     
     
         2 . The gap sensing circuit of  claim 1 , further comprises:
 a plurality of voltage dividers; and   a plurality of voltage integrators,   wherein each voltage divider and voltage integrator communicatively connected to a distinct electrode segment in the first electrode array.   
     
     
         3 . The gap sensing circuit of  claim 1 , further comprises a timing device, the timing device configured to determine when a discharge is occurring between the first electrode array and the workpiece. 
     
     
         4 . The gap sensing circuit of  claim 3 , wherein the voltage divider is configured to monitor the inter-electrode gap only during discharge between the first electrode array and the workpiece. 
     
     
         5 . The gap sensing circuit of  claim 1 , further comprising a reference voltage in communication with the voltage integrator. 
     
     
         6 . The gap sensing circuit of  claim 1 , further comprising a sample and hold circuit positioned between and in communication with the voltage divider and the voltage integrator.