US2016348292A1PendingUtilityA1

Atmospheric-pressure plasma processing method

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Assignee: APJET INCPriority: Sep 19, 2012Filed: Aug 8, 2016Published: Dec 1, 2016
Est. expirySep 19, 2032(~6.2 yrs left)· nominal 20-yr term from priority
Inventors:Carrie E. CorneliusGregory A. RocheDavid W. Tyner
D06B 1/02D10B 2401/021D06B 19/007H05H 1/46H05H 1/466H05H 2245/40H05H 2240/10B23K 10/003
51
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Claims

Abstract

Methods for atmospheric pressure plasma discharge processing using powered electrodes having elongated planar surfaces; grounded electrodes having elongated planar surfaces parallel to and coextensive with the elongated surfaces of the powered electrodes, and spaced-apart a chosen distance therefrom, forming plasma regions, are described. RF power is provided to the at least one powered electrode, both powered and grounded electrodes may be cooled, and a plasma gas is flowed through the plasma regions at atmospheric pressure; whereby a plasma is formed in the plasma regions. The material to be processed may be moved into close proximity to the exit of the plasma gas from the plasma regions perpendicular to the gas flow, and perpendicular to the elongated electrode dimensions, whereby excited species generated in the plasma exit the plasma regions and impinge unimpeded onto the material.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for atmospheric-pressure plasma processing comprising: flowing a plasma gas between a region defined by at least one first electrically conducting electrode having a chosen height and having at least one first elongated planar surface having a chosen length, and at least one grounded second electrically conducting electrode having at least one second elongated planar surface parallel to and coextensive with the first planar surface, and spaced-apart a chosen distance therefrom, whereby the plasma gas exits the region through a long dimension of the at least one first planar surface and a corresponding long dimension of the at least one second planar surface; applying RF power to the at least one first electrode from an RF power source, whereby at least one plasma is formed; and cooling the at least one first electrode and the at least one second electrode to a chosen temperature. 
     
     
         2 . The method of  claim 1 , wherein each of the at least one first electrode and the at least one second electrode comprises a hollow portion, a fluid inlet to the hollow portion and a fluid outlet therefrom, whereby the coolant is directed into the fluid inlet, through the hollow portion and through the outlet of each the at least one first electrode and the at least one second electrode. 
     
     
         3 . The method of  claim 1 , wherein each of the at least one first electrode and the at least one second electrode comprises a hollow square or rectangular metallic conductor. 
     
     
         4 . The method of  claim 1 , wherein the RF power source comprises RF impedance matching circuitry for providing RF to the at least one RF electrode. 
     
     
         5 . The method of  claim 1 , wherein plasma gas is flowed into the at least one plasma region through a long dimension of the at least one first planar surface and a corresponding long dimension of the at least one second planar surface opposite to the at least one plasma region through the long dimension of the at least one first planar surface and the corresponding long dimension of the at least one second planar surface through which the plasma gas exits the at least one plasma region. 
     
     
         6 . The method of  claim 1 , wherein the chosen height is selected such that power supplied to the plasma by the RF power source is minimized. 
     
     
         7 . The method of  claim 6 , wherein the chosen height is between about 3 mm and about 25 mm. 
     
     
         8 . The method of  claim 1 , wherein the chosen distance is between about 0.2 mm and about 4 mm. 
     
     
         9 . The method of  claim 1 , wherein said step of flowing a plasma gas is achieved using at least one electrically non-conducting, elongated gas block having an elongated chamber therein in fluid communication with a gas manifold, a nozzle in fluid communication with the chamber having a chosen width and a length of the at least one first elongated planar surface and the at least one second elongated planar surface and disposed therebetween. 
     
     
         10 . The method of  claim 9 , wherein the at least one gas block further comprises a porous tube disposed within the elongated chamber of said gas block in fluid communication with the gas manifold for uniformly supplying gas to the nozzle. 
     
     
         11 . The method of  claim 10 , wherein the porous tube comprises a Teflon tube. 
     
     
         12 . The method of  claim 1 , wherein the RF comprises frequencies between about 100 kHz and about 100 MHz. 
     
     
         13 . The method of  claim 1 , wherein the chosen temperature is about 20° C. 
     
     
         14 . The method of  claim 1 , wherein gas exiting the plasma has a temperature <70° C. 
     
     
         15 . A method for atmospheric-pressure plasma discharge processing of a material, comprising: flowing a plasma gas between a region defined by at least one electrically conducting first electrode having at least one first elongated planar surface, and at least one grounded second electrically conducting electrode having at least one second elongated planar surface parallel to and coextensive with the first planar surface, and spaced-apart a first chosen distance therefrom, whereby the plasma gas exits the region through a long dimension of the at least one first planar surface and a corresponding long dimension of the at least one second planar surface; applying RF power to the at least one first electrode from an RF power source, whereby at least one plasma is formed; cooling the at least one first electrode and the at least one second electrode to a chosen temperature; and moving the material perpendicular to the long dimension of the at least one first planar surface and the at least one second planar surface at a second chosen distance therefrom, and perpendicular to the flow of the plasma gas out of the plasma region. 
     
     
         16 . The method of  claim 15 , wherein each of the at least one first electrode and the at least one second electrode comprises a hollow portion, a fluid inlet to the hollow portion and a fluid outlet therefrom, whereby the coolant is directed into the fluid inlet, through the hollow portion and through the outlet of each the at least one first electrode and the at least one second electrode. 
     
     
         17 . The method of  claim 15 , wherein each of the at least one first electrode and the at least one second electrode comprises a hollow square or rectangular metallic conductor. 
     
     
         18 . The method of  claim 15 , wherein the RF power source comprises RF impedance matching circuitry for providing RF to the at least one RF electrode. 
     
     
         19 . The method of  claim 15 , wherein plasma gas is flowed into the at least one plasma region through a long dimension of the at least one first planar surface and a corresponding long dimension of the at least one second planar surface opposite to the at least one plasma region through the long dimension of the at least one first planar surface and the corresponding long dimension of the at least one second planar surface through which the plasma gas exits the at least one plasma region. 
     
     
         20 . The method of  claim 15 , wherein the chosen height is selected such that power supplied to the plasma by the RF power source is minimized. 
     
     
         21 . The method of  claim 20 , wherein the chosen height is between about 3 mm and about 25 mm. 
     
     
         22 . The method of  claim 15 , wherein the first chosen distance is between about 0.2 mm and about 4 mm. 
     
     
         23 . The method of  claim 15 , wherein said step of flowing a plasma gas is achieved using at least one electrically non-conducting, elongated gas block having an elongated chamber therein in fluid communication with a gas manifold, a nozzle in fluid communication with the chamber having a chosen width and a length of the at least one first elongated planar surface and the at least one second elongated planar surface and disposed therebetween. 
     
     
         24 . The method of  claim 23 , wherein the at least one gas block further comprises a porous tube disposed within the elongated chamber of said gas block in fluid communication with the gas manifold for uniformly supplying gas to the nozzle. 
     
     
         25 . The method of  claim 24 , wherein the porous tube comprises a Teflon tube. 
     
     
         26 . The method of  claim 15 , wherein the RF comprises frequencies between about 100 kHz and about 100 MHz. 
     
     
         27 . The method of  claim 15 , wherein the chosen temperature is about 20° C. 
     
     
         28 . The method of  claim 15 , wherein gas exiting the plasma has a temperature <70° C. 
     
     
         29 . The method of  claim 15 , wherein the second chosen distance is between about 0 mm and about 5 mm.

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