Film-forming structure on work and film-forming method on work

Abstract

A film-forming structure and a film-forming method on a work include closely depositing a thin primary film on a work, the primary film being a suboxide or an oxide including metal and is soft and has insulation properties and corrosion resistance. The primary film is porous film. The work is integrated with the primary film to prevent the primary film from peeling, and thereby improving the workability. The thin secondary film such as a coating is attached to the primary film closely, thereby reducing the amount of paint used. The primary film is integrated with the secondary film to prevent the secondary film from peeling, improving the workability after formation of the secondary film, and thereby forming the primary and secondary films rationally.

1 . A film-forming structure on a work comprising:
 a work having a surface on which a film is formed; and   a thin primary film formed by a suboxide or an oxide comprising metal, deposited on the surface of the work, and wherein the primary film is a porous film.   
     
     
         2 . The film-forming structure on the work according to  claim 1 , further comprising an impregnation layer formed by the primary film on the surface of the work. 
     
     
         3 . The film-forming structure on the work according to  claim 1 , wherein the primary film has a surface having minute irregularities. 
     
     
         4 . The film-forming structure on the work according to  claim 1 , wherein the suboxide is a chromium suboxide, and the oxide is a chromium oxide. 
     
     
         5 . The film-forming structure on the work according to  claim 1 , wherein the primary film is softer than metal chromium and has insulation properties and corrosion resistance. 
     
     
         6 . The film-forming structure on the work according to  claim 3 , further comprising a thin secondary film formed on the surface with the irregularities of the primary film. 
     
     
         7 . The film-forming structure on the work according to  claim 6 , further comprising an impregnation layer formed by the secondary film on a surface layer of the primary film. 
     
     
         8 . The film-forming structure on the work according to  claim 6 , wherein fine particles or crystals of the secondary film are disposed on the irregularities of the primary film independently and with high density. 
     
     
         9 . The film-forming structure on the work according to  claim 6 , wherein the primary film has a thickness of 1 μm or more and the secondary film has a thickness of 5 μm or more. 
     
     
         10 . The film-forming structure on the work according to  claim 6 , wherein the secondary film comprises any one of a polymer material, an inorganic or organic paint coating, a functional material, or ceramics. 
     
     
         11 . The film-forming structure on the work according to  claim 1 , wherein the work is any one of stainless steel, nickel, iron, copper, aluminum, brass, other metals, alloy, synthetic resin, glass, ceramics, paper, fiber, or wood. 
     
     
         12 . A film-forming method on a work for forming a film on a surface of a work comprising:
 placing the work and an anode piece in a bath for receiving a treatment liquid;   applying positive and negative voltages for the work and the anode piece;   adjusting a bath temperature of the treatment liquid to low temperature; and   depositing a thin and porous primary film formed by a suboxide or an oxide containing metal ions in the treatment liquid on the work by electrochemical action, or depositing a thin and porous primary film formed by a suboxide or an oxide containing metal ions in the treatment liquid in an electroless bath on the work by chemical reaction.   
     
     
         13 . The film-forming method on the work according to  claim 12 , wherein the treatment liquid of the electrochemical action comprises chromic anhydride and a reduction inhibitor. 
     
     
         14 . The film-forming method on the work according to  claim 12 , wherein the treatment liquid of the chemical action comprises an agent for supplying metal ions, a reducing agent, and an additive such as ceramics. 
     
     
         15 . The film-forming method on the work according to  claim 12 , wherein a bath temperature of the treatment liquid of the electrochemical action is adjusted to 10° C. or less. 
     
     
         16 . The film-forming method on the work according to  claim 12 , further comprising a thin secondary film, wherein the secondary film is attached to or adsorbed on the primary film, or the secondary film is formed by impregnation or firing. 
     
     
         17 . The film-forming method on the work according to  claim 16 , wherein the secondary film comprises any one of a polymer material, an inorganic or organic paint coating, a functional material, or ceramics, and any one of the polymer material, the inorganic or organic paint coating, the functional material, or the ceramics is applied, sprayed, or baked on the primary film, or the work comprising the primary film is immersed into one of materials above, or applying a voltage or an electric field on the work comprising the paint and the primary film, or the ceramics are fired.