Polymerizable compositions, cured products obtained therewith, and use of these materials
Abstract
[Problem] To provide a polymerizable composition having an excellent transparency in near-infrared wavelength and excellent heat resistance, and a method for producing the same. [Means of Solving the Problem] A polymerizable composition includes: a reactive silicone compound obtained by polycondensing a diaryl silicic acid compound of Formula [1] below with a silane compound, selected under compounds of Formula [2] and Formula [2 b ] below in the presence of an acid or a base; and (b) a compound having at least one polymerizable group selected from the group consisting of alkenyl group and (meth)acryl group, wherein Ar 1 and Ar 2 are independently a phenyl group optionally substituted with a C 1 -C 6 alkyl group, and X is a group which can undergo a hydrolytic condensation reaction, and wherein Ar 3 is naphthyl or anthracyl substituted with at least one group having a polymerizable double bond, or wherein Ar 3 is phenyl substituted with at least one group having a polymerizable double bond other than vinyl, or is phenyl substituted with at least two groups having a polymerizable double bond.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A polymerizable composition comprising:
(a) a reactive silicone compound obtained by polycondensing a diaryl silicic acid compound of Formula [1] below with a silane compound, selected under compounds of Formula [2] and Formula [2b] below in the presence of an acid or a base; and (b) a compound having at least one polymerizable group selected from the group consisting of an alkenyl group and (meth)acryl group,
wherein Ar 1 and Ar 2 are independently a phenyl group optionally substituted with a C 1 -C 6 alkyl group, and X is a group which can undergo a hydrolytic condensation reaction, and wherein Ar 3 is naphthyl or anthracyl substituted with at least one group having a polymerizable double bond, or wherein Ar 3 is phenyl substituted with at least one group having a polymerizable double bond other than vinyl, or is phenyl substituted with at least two groups having a polymerizable double bond.
2 . The composition according to claim 1 , wherein X is an alkoxy group having 1 to 10 carbon atoms.
3 . The composition according to claim 2 , wherein X is methoxy or ethoxy.
4 . The composition according claim 1 , wherein the compound having at least one polymerizable group is a compound of Formula [3]
wherein R 1 is a hydrogen atom or methyl group, L is a single bond, a hydrogen atom, an oxygen atom, a C 1-20 aliphatic hydrocarbon residue having m-valence that is optionally substituted with a phenyl group, a C 1-20 aliphatic hydrocarbon residue having m-valence that optionally contains an ether bond, or a C 1-20 polyvalent alcohol residue optionally containing an ether bond, Ar 4 is an aromatic, monocyclic or bicyclic or tricyclic hydrocarbon residue with n+1 valences, m is an integer of 1 to 3;
with the proviso that when L is a hydrogen atom, m is 1, and when L is a single bond or an oxygen atom, m is 2, and each of n is independently 1 or 2.
5 . The composition of claim 4 , wherein Ar 4 is a phenyl residue.
6 . The composition according to claim 4 , wherein in the formula [3], L is a hydrogen atom, and m is 1.
7 . The composition according to claim 4 , wherein in the formula [3], L is a hydrogen atom, m is 1, and n is 2.
8 . The composition according to claim 5 , wherein in the formula [3], L is a hydrogen atom, and m is 1.
9 . The composition according to claim 8 , wherein in the formula [3], n is 2.
10 . The composition according to claim 4 , further comprising inorganic fine particles.
11 . The composition according to claim 4 , further comprising a solvent.
12 . The composition according to claim 4 , further comprising a polymerization initiator.
13 . A cured product obtained by reacting a polymerizable double bond in the reactive silicone compound with the polymerizable group in the compound having at least one polymerizable group, in the composition according to claim 4 .
14 . Use of a material comprising a composition according to claim 4 , for the preparation of components of optical devices, such as optical adhesives, transparent sealers, or cores or claddings of optical signal transmission devices.
15 . Use of a material according to claim 4 , for the preparation of optical interconnections of printed wiring boards wherein the optical interconnection is preferably a chip-to-chip optical interconnection.
16 . Use of a cured product as claimed in claim 13 as a component of optical devices, preferably an optical adhesive, transparent sealer, or core or cladding of optical signal transmission devices.
17 . Use of a cured product as claimed in claim 13 as a component of an optical interconnection of printed wiring boards wherein the optical interconnection is preferably a chip-to-chip optical interconnection.Cited by (0)
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