Assembly structure and electronic device having the same

Abstract

The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; and a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

What is claimed is: 
     
         1 . An assembly structure, comprising:
 a circuit board, configured to provide a first electrical energy;   a chip; and   a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip,   wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure.   
     
     
         2 . The assembly structure according to  claim 1 , wherein the first power converting module is located between the chip and the circuit board. 
     
     
         3 . The assembly structure according to  claim 2 , wherein the first power converting module has a first electrical connecting surface, the chip has a second electrical connecting surface, and the first electrical connecting surface and the second electrical connecting surface contact and electrically connect each other. 
     
     
         4 . The assembly structure according to  claim 3 , wherein the first power converting module has at least one power output terminal, and the at least one power output terminal is provided on the first electrical connecting surface and electrically connected with the second electrical connecting surface, and wherein the chip has at least one electrical energy input terminal, the at least one electrical energy input terminal is provided on the second electrical connecting surface, and projection of the at least one of electrical energy input terminal of the chip and projection of the at least one of power output terminal of the first power converting module in a direction perpendicular to the circuit board are at least partly overlapped. 
     
     
         5 . The assembly structure according to  claim 1 , further comprising:
 a socket, configured to electrically connect the chip.   
     
     
         6 . The assembly structure according to  claim 5 , wherein the first power converting module is at least partly buried in the socket, and wherein the first power converting module is electrically connected to the socket, and the first power converting module supplies the second electrical energy to the chip at least partly through the socket. 
     
     
         7 . The assembly structure according to  claim 1 , wherein the chip and the first power converting module are located at two opposite sides of the circuit board respectively. 
     
     
         8 . The assembly structure according to  claim 7 , further comprising:
 a back plate, wherein the first power converting module is at least partly buried in the back plate.   
     
     
         9 . The assembly structure according to  claim 7 , wherein the first power converting module has a first electrical connecting surface, the circuit board has a third electrical connecting surface, and the first electrical connecting surface and the third electrical connecting surface contact and electrically connect each other. 
     
     
         10 . The assembly structure according to  claim 9 , wherein the first power converting module has at least one power input terminal and at least one power output terminal, and wherein the at least one power input terminal and the at least one power output terminal are provided on the first electrical connecting surface and electrically connected with the third electrical connecting surface. 
     
     
         11 . The assembly structure according to  claim 7 , further comprising:
 a connector, configured to electrically connect the circuit board and the first power converting module; and   a heat sink, configured to contact the connector.   
     
     
         12 . The assembly structure according to  claim 1 , wherein the first power converting module penetrates through the circuit board. 
     
     
         13 . The assembly structure according to  claim 1 , further comprising:
 a shielding layer, configured to be at least partly provided between the first power converting module and the chip, to shield electromagnetic interference between the first power converting module and the chip.   
     
     
         14 . The assembly structure according to  claim 1 , further comprising:
 a heat sink, configured to connect the first power converting module to dissipate heat from the first power converting module.   
     
     
         15 . The assembly structure according to  claim 1 , further comprising:
 a second power converting module, wherein the first power converting module and the second power converting module are located on two opposite sides of the circuit board, or the first power converting module and the second power converting module are located on a side of the circuit board.   
     
     
         16 . The assembly structure according to  claim 15 , wherein a connection relationship of the first power converting module and the second power converting module is cascading, or in parallel, or in series, or inputs in series and outputs in parallel, or inputs in parallel and outputs in series. 
     
     
         17 . The assembly structure according to  claim 1 , wherein the first power converting module comprises a control circuit module and a main circuit module, wherein the chip, the control circuit module, the main circuit module, and the circuit board are stacked to form the assembly structure. 
     
     
         18 . The assembly structure according to  claim 1 , wherein the first power converting module is at least partly buried in the circuit board. 
     
     
         19 . The assembly structure according to  claim 1 , wherein the chip has at least one electrical energy input terminal, the first power converting module has at least one power output terminal, and projections of the at least one of electrical energy input terminal of the chip and projections of the at least one of power output terminal of the first power converting module in a direction perpendicular to the circuit board are at least partly overlapped. 
     
     
         20 . An assembly structure, comprising:
 a circuit board, configured to provide a first DC voltage;   a CPU; and   a DC/DC converter, configured to electrically connect the circuit board and the CPU, convert the first DC voltage to a second DC voltage, and supply the second DC voltage to the CPU,   wherein the circuit board, the CPU and the DC/DC converter form the assembly structure in a stacking sequence, and the stacking sequence is: the CPU on the DC/DC converter, then the DC/DC converter on the circuit board in sequence; or the stacking sequence is: the CPU on the circuit board, then the circuit board on the DC/DC converter in sequence; or the stacking sequence is the CPU on the DC/DC converter in sequence and the DC/DC converter is at least partly buried in the circuit board.