US2017002474A1PendingUtilityA1

Manufacturing method and manufacturing apparatus for aluminum film

Assignee: SUMITOMO ELECTRIC INDUSTRIESPriority: Feb 5, 2014Filed: Jan 26, 2015Published: Jan 5, 2017
Est. expiryFeb 5, 2034(~7.5 yrs left)· nominal 20-yr term from priority
C25D 5/56C25D 21/04C25D 7/0621C25D 3/66C25D 5/003C25D 3/665C25D 1/08C25D 7/0614C25D 17/004
39
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Claims

Abstract

Provided are a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber. A manufacturing method for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a step of transferring the substrate W into a plating chamber 1 through a sealing chamber 4 disposed on the entrance side of the plating chamber; a step of electrodepositing an aluminum film on the surface of the substrate W in the plating chamber 1 ; and a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber 1 through a sealing chamber 5 disposed on the exit side of the plating chamber 1 , in which an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and the inert gas is forcibly discharged from an inert gas exhaust pipe 7 provided on each of the two sealing chambers.

Claims

exact text as granted — not AI-modified
1 . A manufacturing method for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, comprising:
 a step of transferring the substrate into a plating chamber through a sealing chamber disposed on the entrance side of the plating chamber;   a step of electrodepositing an aluminum film on the surface of the substrate in the plating chamber; and   a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber through a sealing chamber disposed on the exit side of the plating chamber,   wherein an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and   the inert gas is forcibly discharged from an inert gas exhaust pipe provided on each of the two sealing chambers.   
     
     
         2 . The manufacturing method for an aluminum film according to  claim 1 , wherein the inert gas exhaust pipe is provided at the substrate entrance side in the sealing chamber disposed on the entrance side, and
 the inert gas exhaust pipe is provided at the substrate exit side in the sealing chamber disposed on the exit side.   
     
     
         3 . The manufacturing method for an aluminum film according to  claim 1 , wherein an inert gas supply pipe that supplies an inert gas is further provided on each of the two sealing chambers. 
     
     
         4 . The manufacturing method for an aluminum film according to  claim 3 , wherein the inert gas supply pipe is provided at the substrate exit side in the sealing chamber disposed on the entrance side, and the inert gas supply pipe is provided at the substrate entrance side in the sealing chamber disposed on the exit side. 
     
     
         5 . The manufacturing method for an aluminum film according to  claim 1 , wherein the substrate entrance and the substrate exit of each of the two sealing chambers are sealed with seal rolls. 
     
     
         6 . A manufacturing apparatus for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, comprising:
 a plating chamber;   a sealing chamber disposed on the substrate entrance side of the plating chamber and a sealing chamber disposed on the substrate exit side of the plating chamber;   an inert gas supply pipe which is provided on the plating chamber and supplies an inert gas into the plating chamber; and   an inert gas exhaust pipe which is provided on each of the two sealing chambers and forcibly discharges the inert gas in the sealing chamber.

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