Systems and methods for reinforced adhesive bonding

Abstract

A bonding system ( 100 ), which comprises: a first substrate ( 110 ), a second substrate ( 120 ), an adhesive ( 200 ), in contact with a first contact surface ( 115 ) and a second contact surface ( 125 ), and a plurality of solder balls ( 300 ) positioned in the adhesive ( 200 ) in contact with the first contact surface ( 115 ). A bonding method to produce a solder-reinforced adhesive bond joining a first substrate ( 110 ) and a second substrate ( 120 ), which comprises: applying, on a first contact surface ( 115 ) of the first substrate ( 110 ), an adhesive ( 200 ), positioning, at least partially into the adhesive ( 200 ), each of a plurality of solder balls ( 300 ), such that each of the plurality of solder balls ( 300 ) contacts the first contact surface ( 115 ), connecting, to a portion of the adhesive ( 200 ) opposite the first contact surface ( 115 ), a second contact surface ( 125 ) of the second substrate ( 120 ), and applying heat to the first contact surface ( 115 ) such that each of the plurality of solder balls ( 300 ) reaches a solder-ball bonding temperature.

1 . A bonding system, comprising:
 a first substrate;   a second substrate;   an adhesive, in contact with a first contact surface, of the first substrate, and a second contact surface, of the second substrate; and   a plurality of solder balls positioned in the adhesive in contact with the first contact surface.   
     
     
         2 . The system of  claim 1 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the system, the greatest amount of fracture energy. 
     
     
         3 . The system of  claim 1 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls. 
     
     
         4 . The system of  claim 1 , wherein one or more of the plurality of solder balls are further positioned in contact with the second contact surface. 
     
     
         5 . The system of  claim 4 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the system, the greatest amount of fracture energy. 
     
     
         6 . The system of  claim 4 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls. 
     
     
         7 . A method, to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate, comprising:
 applying, on a first contact surface of the first substrate, an adhesive;   positioning, at least partially into the adhesive, each of a plurality of solder balls, such that each of the plurality of solder balls contacts the first contact surface;   connecting, to a portion of the adhesive opposite the first contact surface, a second contact surface of the second substrate; and   applying heat to the first contact surface such that each of the plurality of solder balls reaches a solder-ball bonding temperature.   
     
     
         8 . The method of  claim 7 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the bond, the greatest amount of fracture energy. 
     
     
         9 . The method of  claim 7 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls. 
     
     
         10 . The method of  claim 7 , wherein positioning the plurality of solder balls further comprises positioning the solder balls so that at least one of the solder balls contacts the second contact surface. 
     
     
         11 . The method of  claim 10 , further comprising applying heat to the second contact surface such that the at least one solder ball reaches the solder-ball bonding temperature. 
     
     
         12 . The method of  claim 10 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the bond, the greatest amount of fracture energy. 
     
     
         13 . The method of  claim 10 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls. 
     
     
         14 . A method, to produce a solder-reinforced adhesive bond between a first substrate and second substrate, comprising:
 applying, on a first contact surface of the first substrate, a composite including an adhesive and a plurality of solder balls, such that at least one of the plurality of solder balls is in contact with the first contact surface;   connecting, to a portion of the composite opposite the first contact surface, a second contact surface of the second substrate; and   applying heat to the first contact surface such that each of the plurality of solder balls reaches a solder-ball-bonding temperature.   
     
     
         15 . The method of  claim 14 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the bond, the greatest amount of fracture energy. 
     
     
         16 . The method of  claim 14 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls. 
     
     
         17 . The method of  claim 14 , wherein one or more of the plurality of solder balls are further positioned in contact with the second contact surface. 
     
     
         18 . The method of  claim 17 , further comprising applying heat to the second contact surface such that the at least one solder balls reaches the solder-ball bonding temperature. 
     
     
         19 . The method of  claim 17 , wherein the plurality of solder balls are positioned in a distribution (i) arresting crack propagation or (ii) promoting crack propagation along a path requiring, in at least one section of the bond, the greatest amount of fracture energy. 
     
     
         20 . The method of  claim 17 , wherein at least one of the plurality of solder balls comprises a coating configured to (i) arrest crack propagation in the adhesive or (ii) deflect crack propagation to promote failure in shear mode through the adhesive adjacent at least some of the solder balls.