Three dimensional woven lattices as novel multi-functional architectures
Abstract
The present invention is directed to devices formed from three-dimensional (3D) structures composed of metallic, ceramic or polymeric wires or bundles and yarns of wires that are either solid or hollow like a tube. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, in some cases using a topology optimization routine that includes the 3D manufacturing constraints. The properties can be optimized in different directions. The 3D structures of the present invention include multiple properties that are optimized for a range of different applications, including heat transfer. The present invention also includes the methods for optimization of the 3D structures as well as methods of use of the 3D structures in heat transfer applications.
Claims
exact text as granted — not AI-modified1 . A device comprising:
wires configured to form a material; and wherein each wire is configured such that a predetermined property of the material is optimized.
2 . The device of claim 1 further comprising the predetermined property being selected from a group consisting of thermal conductivity, electrical conductivity, mechanical strength, material density, wire chemistry, wire-strut geometry, energy absorption, adsorption and release of a gas, and damping properties.
3 . The device of claim 1 wherein the wire comprises one selected from a group consisting of a solid wire and a hollow wire.
4 . The device of claim 1 wherein the wire comprises a yarn.
5 . The device of claim 1 further comprising positioning the wires using one selected from a group consisting of topology optimization, intuition motivated architectures, and mechanical based designs.
6 . The device of claim 1 wherein the wires are formed from a metal.
7 . The device of claim 1 wherein the wires are formed from Cu.
8 . The device of claim 1 wherein the wires are formed from a non-metal.
9 . The device of claim 1 wherein the diameters of wires are the same or different.
10 . The device of claim 1 wherein the wires are woven with a warp and a fill.
11 . The device of claim 1 wherein the wires are woven with a warp, fill, and a Z wire.
12 . The device of claim 1 wherein the nodes of the orthogonal wires are bonded.
13 . The device of claim 1 further comprising the wires being configured by one selected from a group consisting of wire position, wire material chemistry, wire size, wire coating, roughness, wire shape, wire bonding, varying composition of wires in the structure, and wire architecture.
14 . The device of claim 1 further comprising a wire composed of a bonding materials such as a braze or a solder.
15 . The device of claim 5 wherein the optimization is performed so as to design a weave with properties that are optimized in one or more directions.
16 . The device of claim 1 wherein the fluid flow within the weave can be designed so as to also optimize one selected from a group consisting of mechanical stiffness, heat transfer, temperature uniformity during heat transfer, fluidic permeability, adsorption and release of a gas, or pumping power required for fluid flow applications.
17 . A method for collection and release of a substance comprising:
injecting the substance into an optimized three-dimensional structure; capturing the substance in the optimized three-dimensional structure; and releasing the substance from the optimized three-dimensional structure into a means for analysis of the substance.
18 . The method for collection and release of the substance of claim 17 further comprising injecting a substance from a group consisting of a gas, chemical, or multi-phase chemical mixture.
19 . The method for collection and release of the substance of claim 17 further comprising optimizing the three-dimensional structure for minimizing pressure drops, maximizing specific surface area, and varying flow paths for collection versus discharge.
20 . The method for collection and release of the substance of claim 17 further comprising applying heat in order to speed discharge of the substance.
21 . The method for collection and release of the substance of claim 17 further comprising enhancing surface area and collection rates.
22 . The method for collection and release of the substance of claim 21 further comprising applying a CVD coating to a wire forming the lattice.
23 . The method for collection and release of the substance of claim 21 further comprising oxidizing a wire forming the lattice.
24 . The method for collection and release of the substance of claim 17 further comprising releasing the substance into a mass spectrometer.
25 . The method for collection and release of the substance of claim 17 further comprising using a lattice formed from a non-reactive material.Join the waitlist — get patent alerts
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