System and method for improved thermal management of a portable computing device with skin temperature sensors

Abstract

Methods and systems for improved thermal management of a portable computing device (“PCD”) with skin temperature sensors are disclosed. In an exemplary embodiment, a plurality of skin sensors are provided in the PCD, the plurality of skin sensors disposed on a flexible printed circuit board (“Flex PCB”) located internal to the PCD proximal to an outer surface of the PCD. It is determined whether to obtain temperature information from one or more of the plurality of skin sensors, and one or more skin sensors from which to obtain temperature information are identified. The temperature information is obtained from the identified one or more skin sensors, and the temperature information is applied to a thermal mitigation policy.

What is claimed is: 
     
         1 . A method for improved thermal management in a portable computing device (“PCD”), the method comprising:
 providing a plurality of skin sensors, the plurality of skin sensors disposed on a flexible printed circuit board (“Flex PCB”) located internal to the PCD proximal to an outer surface of the PCD; 
 determining whether to obtain temperature information from one or more of the plurality of skin sensors; 
 identifying one or more skin sensors from which to obtain temperature information; 
 obtaining temperature information from the identified one or more skin sensors; and 
 applying the obtained temperature information to a thermal mitigation policy. 
 
     
     
         2 . The method of  claim 1 , wherein determining whether to obtain temperature information from one or more of the plurality of skin sensors comprises:
 monitoring a parameter associated with one or more components disposed on a main printed circuit board (“PCB”) of the PCD parallel to the Flex PCB, the parameter indicating that the one or more components of PCD are producing thermal energy; and   determining based on the monitored parameter that the first one of the one or more components of the PCD is producing thermal energy.   
     
     
         3 . The method of  claim 2 , wherein the parameter comprises information about an amount of power provided to the one or more components, information about an operational frequency of the one or more components, information about a clock speed of the one or more components, or information about a workload of the one or more components. 
     
     
         4 . The method of  claim 2 , wherein identifying one or more skin sensors from which to obtain temperature information comprises:
 identifying one or more skin sensors at a location on the Flex PCB that spatially corresponds to a location of the first one of the one or more components producing thermal energy on the main PCB.   
     
     
         5 . The method of  claim 4 , wherein the Flex PCB comprises a printed circuit board for a liquid crystal display (“LCD”) of the PCD. 
     
     
         6 . The method of  claim 4 , wherein the Flex PCB is located adjacent to a back cover of the PCD. 
     
     
         7 . The method of  claim 4 , wherein identifying one or more skin sensors from which to obtain temperature information further comprises:
 identifying a second set of one or more skin sensors at a second location on the Flex PCB that spatially corresponds to a second location of a second one of the one or more components producing thermal energy on the main PCB; and   obtaining temperature information from the identified second set of one or more skin sensors.   
     
     
         8 . A computer system for improved thermal management in a portable computing device (“PCD”), the system comprising:
 a plurality of skin sensors, the plurality of skin sensors disposed on a flexible printed circuit board (“Flex PCB”) located internal to the PCD proximal to an outer surface of the PCD; and 
 a monitor module configured to:
 monitor a parameter associated with one or more components disposed on a main printed circuit board (“PCB”) of the PCD parallel to the Flex PCB, the parameter indicating that a first one of the one or more components of PCD is producing thermal energy, 
 determine based on the monitored parameter whether to obtain temperature information from one or more of the plurality of skin sensors, 
 identify the one or more skin sensors from which to obtain temperature information, 
 obtain temperature information from the identified one or more skin sensors, and 
 
 apply the obtained temperature information to a thermal mitigation policy. 
 
     
     
         9 . The computer system of  claim 8 , wherein the parameter comprises information about an amount of power provided to the one or more components, information about an operational frequency of the one or more components, information about a clock speed of the one or more components, or information about a workload of the one or more components. 
     
     
         10 . The computer system of  claim 8 , wherein the monitor module configured to identify one or more skin sensors from which to obtain temperature information comprises the monitor module configured to:
 identify one or more skin sensors at a location on the Flex PCB that spatially corresponds to a location of the first one of the one or more components producing thermal energy on the main PCB.   
     
     
         11 . The computer system of  claim 10 , wherein the Flex PCB comprises a printed circuit board for a liquid crystal display (“LCD”) of the PCD. 
     
     
         12 . The computer system of  claim 10  wherein the Flex PCB is located adjacent to a back cover of the PCD. 
     
     
         13 . The computer system of  claim 10 , wherein the monitor module is further configured to:
 identify a second set of one or more skin sensors at a second location on the Flex PCB that spatially corresponds to a second location of a second one of the one or more components producing thermal energy on the main PCB, and   obtain temperature information from the identified second set of one or more skin sensors.   
     
     
         14 . The computer system of  claim 13 , wherein the monitor module is further configured to:
 identify a third set of one or more skin sensors at a third location on the Flex PCB that spatially corresponds to a third location of a third one of the one or more components producing thermal energy on the main PCB, and   obtain temperature information from the identified third set of one or more skin sensors.   
     
     
         15 . A computer system for improved thermal management in a portable computing device (“PCD”), the system comprising:
 providing a plurality of skin sensors, the plurality of skin sensors disposed on a flexible printed circuit board (“Flex PCB”) located internal to the PCD proximal to an outer surface of the PCD; 
 means for determining whether to obtain temperature information from one or more of the plurality of skin sensors; 
 means for identifying one or more skin sensors from which to obtain temperature information; 
 means for obtaining temperature information from the identified one or more skin sensors; and 
 means for applying the obtained temperature information to a thermal mitigation policy. 
 
     
     
         16 . The computer system of  claim 15 , wherein the means for determining whether to obtain temperature information from one or more of the plurality of skin sensors comprises:
 means for monitoring a parameter associated with one or more components disposed on a main printed circuit board (“PCB”) of the PCD parallel to the Flex PCB, the parameter indicating that the one or more components of PCD are producing thermal energy; and   means for determining based on the monitored parameter that the first one of the one or more components of the PCD is producing thermal energy.   
     
     
         17 . The computer system of  claim 16 , wherein the parameter comprises information about an amount of power provided to the one or more components, information about an operational frequency of the one or more components, information about a clock speed of the one or more components, or information about a workload of the one or more components. 
     
     
         18 . The computer system of  claim 16 , wherein the means for identifying one or more skin sensors from which to obtain temperature information comprises:
 means for identifying one or more skin sensors at a location on the Flex PCB that spatially corresponds to a location of the first one of the one or more components producing thermal energy on the main PCB.   
     
     
         19 . The computer system of  claim 18 , wherein the Flex PCB comprises a printed circuit board for a liquid crystal display (“LCD”) of the PCD. 
     
     
         20 . The computer system of  claim 18 , wherein the means for identifying one or more skin sensors from which to obtain temperature information further comprises:
 means for identifying a second set of one or more skin sensors at a second location on the Flex PCB that spatially corresponds to a second location of a second one of the one or more components producing thermal energy on the main PCB; and   means for obtaining temperature information from the identified second set of one or more skin sensors.