US2017040242A1PendingUtilityA1
Thermal management system and method
Est. expiryOct 26, 2030(~4.2 yrs left)· nominal 20-yr term from priority
Inventors:Mehmet ArikWilliam Dwight GerstlerRi LiPradeep Chandra Babu SalapakkamBryan Patrick Whalen
H10W 40/475H10W 40/037H10W 40/43B23P 15/26Y10T29/4935H05K 7/20172B23P 2700/10H01L 21/4882H01L 23/467
46
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Claims
Abstract
A thermal management system is provided. The thermal management system includes at least one heat sink including one or more respective fins, wherein the one or more fins include one or more respective cavities. The thermal management system also includes a synthetic jet stack including at least one synthetic jet mounted within each of the respective cavities employing at least one engaging structure to provide a rigid positioning of the synthetic jet stack within the fins, wherein the synthetic jet includes at least one orifice through which a fluid is ejected.
Claims
exact text as granted — not AI-modifiedWhat is claimed as new and desired to be protected by Letters Patent of the United States is:
1 . A thermal management system comprising:
at least one heat sink comprising one or more fins; at least one synthetic jet mounted within one or more respective cavities of the one or more fins, the at least one synthetic jet comprising at least one orifice through which a fluid is ejected; and at least one structure that engages the at least one synthetic jet within the one or more respective cavities.
2 . The thermal management system of claim 1 wherein the at least one synthetic jet comprises an elastomeric wall positioned between a pair of piezo disks.
3 . The thermal management system of claim 1 wherein the at least one synthetic jet comprises a synthetic jet having a plurality of orifices through which fluid is ejected.
4 . The thermal management system of claim 1 wherein the at least one structure comprises a gasket positioned between an outer surface of the at least one synthetic jet and an inner surface of the one or more fins.
5 . The thermal management system of claim 1 wherein the at least one structure comprises a plurality of mating dimples and bumps formed on an outer surface of the at least one synthetic jet and an inner surface of the at least one fin.
6 . The thermal management system of claim 1 wherein the at least one structure comprises a plurality of wires.
7 . The thermal management system of claim 1 wherein the at least one structure comprises a plurality of locator pins.
8 . The thermal management system of claim 7 wherein the plurality of locator pins are coupled to the at least one synthetic jet and are received within a plurality of openings formed in the heat sink.
9 . The thermal management system of claim 1 wherein the at least one structure electrically separates the at least one synthetic jet from the heat sink.
10 . The thermal management system of claim 1 further comprising one of a layer of silicone and a fin cap that encloses an opening in a top surface of the one or more fins.
11 . The thermal management system of claim 1 wherein the at least one synthetic jet is retained between a slot formed in the heat sink and a fin cap.
12 . The thermal management system of claim 1 wherein the one or more fins are c-shaped.
13 . A method for manufacturing a thermal management system, the method comprising:
providing a heat sink comprising at least one fin having a cavity formed therein; and mounting at least one synthetic jet inside the cavity via an engaging structure positioned between the at least one synthetic jet and the heat sink, the at least one synthetic jet comprising at least one orifice through which a fluid is ejected.
14 . The method of claim 13 further comprising disposing a gasket between the at least one synthetic jet and an inner surface of the at least one fin.
15 . The method of claim 13 further comprising inserting locator pins coupled to the at least one synthetic jet within openings formed in the heat sink.
16 . The method of claim 13 further comprising electrically separating the at least one synthetic jet from the heat sink.
17 . The method of claim 13 further comprising positioning the at least one synthetic jet within a slot formed in the base of the heat sink.
18 . The method of claim 13 further comprising sealing a top surface of the at least one fin with one of a layer of silicone and a fin cap.
19 . A thermal management system comprising:
a synthetic jet comprising a pair of piezo disks and at least one orifice through which a fluid is ejected; and a heat sink fin comprising a cavity that surrounds opposing outward facing surfaces of the pair of piezo disks.
20 . The thermal management system of claim 19 wherein the synthetic jet further comprises an elastomeric wall positioned between the pair of piezo disks; and
wherein the at least one orifice is formed in the elastomeric wall.
21 . The thermal management system of claim 19 wherein the heat sink fin is c-shaped.
22 . The thermal management system of claim 19 further comprising a structure that engages the synthetic jet within the cavity of the heat sink fin.
23 . The thermal management system of claim 22 wherein the structure electrically separates the synthetic jet from the heat sink fin.
24 . A thermal management system comprising a synthetic jet positioned within an internal cavity of a c-shaped heat sink fin.
25 . The thermal management system of claim 24 wherein the synthetic jet comprises at least one orifice positioned to expel fluid in an outward direction relative to the internal cavity.
26 . The thermal management system of claim 25 wherein the synthetic jet further comprises an elastomeric wall positioned between a pair of piezo disks, the elastomeric wall having the at least one orifice therein.
27 . The thermal management system of claim 24 further comprising an engaging structure coupling the synthetic jet to the c-shaped heat sink fin.
28 . The thermal management system of claim 27 wherein the engaging structure electrically separates the synthetic jet from the c-shaped heat sink fin.Join the waitlist — get patent alerts
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