US2017040645A1PendingUtilityA1

Bendable scoring lines in thin-film solid state batteries

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Assignee: ITN ENERGY SYSTEMS INCPriority: Jul 29, 2013Filed: Oct 17, 2016Published: Feb 9, 2017
Est. expiryJul 29, 2033(~7 yrs left)· nominal 20-yr term from priority
B23K 26/382H01M 6/46H01M 6/40B23K 2201/36H01M 10/36H01M 10/045Y02P70/50B32B 2307/204Y02E60/10B23K 2103/166B23K 2101/42B23K 2101/16B32B 2038/045B32B 2307/202B23K 26/0622B23K 2103/50B32B 2037/246B32B 37/24B23K 2101/36B32B 2038/047H01M 10/0436B32B 2363/00B23K 26/38B32B 38/0004B32B 2457/10
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Claims

Abstract

The technology relates to depositing free-standing electrical devices on a substrate and electrically connecting two or more of the free-standing electrical devices with the aid of a bendable scoring lines. These bendable scoring lines allow the thin-film substrate to be bended, or folded, to form a specific shape. Electrical devices include electrochromic devices or solid state batteries.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A method of fabricated a thin-film electrical device, the method comprising:
 depositing a plurality of free-standing electrical devices on a substrate to form a pattern, the pattern including a first partition and a second partition, the first partition including a first free-standing electrical device and the second partition including a second free-standing electrical device;   forming at least a first perforation in the substrate, wherein the perforation separates the two partitions; and   folding the substrate along the perforation; and   electrically connecting the first free-standing electrical device to the second free-standing electrical device to form a first electrical device stack.   
     
     
         2 . The method of  claim 1 , wherein each of the plurality of free-standing electrical devices is a thin-film battery. 
     
     
         3 . The method of  claim 1 , wherein the electrically connecting step includes electrically connecting a first anode current collector of the first free-standing electrical device to a second anode current collector of the second free-standing electrical device. 
     
     
         4 . The method of  claim 1 , wherein electrically connecting includes boring a hole through the electrical device stack and filling the holes with a conductive material. 
     
     
         5 . The method of  claim 1  wherein the first free-standing electrical device and the second free-standing electrical device are connected in series. 
     
     
         6 . The method of  claim 1 , wherein the first free-standing electrical device and the second free-standing electrical device have the same electrical architecture. 
     
     
         7 . The method of  claim 4 , wherein the conductive material is a conductive epoxy. 
     
     
         8 . The method of  claim 1 , wherein the substrate is polyimide. 
     
     
         9 . The method of  claim 1 , further comprising:
 filling the at least first perforation with a flexible material.   
     
     
         10 . The method of  claim 1 , wherein a laser is used to form the first perforation. 
     
     
         11 . A thin-film battery stack comprising:
 a substrate;   a first solid state battery deposited onto the substrate having a first cathode current collector, a first cathode, a first electrolyte, a first anode, and a first anode current collector;   a second solid state battery deposited onto the substrate having a second cathode current collector, a second cathode, a second electrolyte, a second anode, and a second anode current collector;   the first solid state battery and the second solid state battery separated by a folded perforation on the substrate;   the first solid state battery positioned over the second solid state battery; and   a stack anode current collector and a stack cathode current collector, wherein the stack anode current collector electrically connects the first anode current collector with the second anode current collector, and wherein the stack cathode current collector electrically connects the first cathode current collector with the second cathode current collector.   
     
     
         12 . The thin-film battery stack  claim 11 , wherein the stack cathode current collector is disposed in a bore hole that runs through the first solid state battery and the second solid state battery. 
     
     
         13 . The thin-film battery stack of  claim 11 , wherein the first solid state battery and the second solid state battery have the same electrical architecture. 
     
     
         14 . The thin-film battery stack of  claim 11 , wherein the stack cathode current collector and the stack anode collector are made from a conductive epoxy. 
     
     
         15 . The thin-film battery stack of  claim 11 , wherein the substrate is polyimide. 
     
     
         16 . The thin-film battery stack of  claim 11 , wherein portions of the folded perforation are filled with a flexible material. 
     
     
         17 . A method of forming a thin-film electrical stack, the method comprising:
 depositing a plurality of free-standing electrical devices onto two sides of a thin-film substrate;   testing at least some of the plurality of the free-standing electrical devices;   determining that at least one of the plurality of the free-standing electrical devices is not functioning based on the testing;   removing the at least one of the plurality that is not functioning;   etching the substrate to form perforated lines that separate a first free-standing electrical device from a second free standing electrical device;   cutting the substrate along a path different from the perforation;   folding the substrate to form a dielectric stack.   
     
     
         18 . The thin-film electrical stack of  claim 17  wherein the first free-standing electrical device is located on a first side of the substrate and is substantially aligned with the second free-standing electrical devices that is located on a second side of the substrate. 
     
     
         19 . The thin-film electrical stack of  claim 17 , where in the substrate is polyamide. 
     
     
         20 . The thin-film electrical stack of  claim 17 , wherein etching is performed by a laser.

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