Space-efficient containment devices and method of making same

Abstract

Containment devices and methods of manufacture and assembly are provided. In an embodiment, the device includes at least one microchip element, which includes a containment reservoir that can be electrically activated to open, and a first electronic printed circuit board (PCB) which comprises a biocompatible substrate. The first PCB may have a first side on which one or more electronic components are fixed and an opposed second side on which the microchip element is fixed in electrical connection to the one or more electronic components. The device may further include a second PCB and a housing ring securing the first PCB together with the second PCB. The microchip element may include a plurality of containment reservoirs, which may be microreservoirs, and/or which may contain a drug formulation or a sensor element.

I claim: 
     
         1 . A microchip device element comprising:
 a silicon substrate having a first side, an opposed second side, and at least one aperture extending therethrough, wherein the first side comprises an electrically conductive reservoir cap which closes off the at least one aperture;   a primary substrate which is formed of a polymer or a glass or other ceramic material, wherein the primary substrate has at least one reservoir which is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end; and   reservoir contents positioned within the at least one reservoir,   wherein the second side of the silicon substrate is hermetically bonded to the primary substrate, such that the open end of the reservoir is in fluid communication with the at least one aperture for controlled release or exposure of reservoir contents.   
     
     
         2 . The device of  claim 1 , wherein the primary substrate comprises a metal coating over at least a part of the polymer, glass or other ceramic material of the primary substrate. 
     
     
         3 . The device of  claim 2 , wherein the metal coating coats the at least one sidewall and/or the closed end wall of the at least one reservoir. 
     
     
         4 . The device of  claim 1 , wherein the second side of the silicon substrate comprises at least one ring structure formed thereon. 
     
     
         5 . The device of  claim 4 , wherein the at least one ring structure comprises gold or another metal. 
     
     
         6 . The device of  claim 5 , wherein the primary substrate comprises at least one groove structure, the at least one ring structure and the at least one groove structure together forming a hermetic bond. 
     
     
         7 . The device of  claim 6 , wherein the surface of the primary substrate in and/or adjacent to the at least one groove structure comprises a metal coating. 
     
     
         8 . The device of  claim 7 , wherein the metal coating comprises gold. 
     
     
         9 . The device of  claim 1 , wherein the reservoir contents comprises a drug. 
     
     
         10 . A method of making a microchip device element for use in an implantable medical device, the method comprising:
 providing a silicon substrate having a first side and an opposed second side, wherein the silicon substrate has been microfabricated to have at least one aperture extending through the silicon substrate and an electrically conductive reservoir cap which closes off the at least one aperture on the first side;   providing a primary substrate formed by casting or molding a polymer or a glass or other ceramic material, wherein the primary substrate has at least one reservoir which is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end;   loading reservoir contents into the at least one reservoir of the primary substrate, wherein the reservoir contents comprises a drug; and then   bonding the silicon substrate to the primary substrate such that the open end of the reservoir is in fluid communication with the at least one aperture.   
     
     
         11 . The method of  claim 10 , wherein the second side of the silicon substrate further includes at least one ring structure, the primary substrate comprises at least one groove structure, and the step of bonding comprises compression cold welding the at least one ring structure together with the at least one groove structure. 
     
     
         12 . A method of assembling an implantable drug delivery device, the method comprising:
 providing a first microchip element which comprises a containment reservoir that can be electrically activated to open to release a drug from the containment reservoir;   fixing the first microchip element to a first side of a first electronic printed circuit board (PCB) which comprises a biocompatible ceramic substrate; and   electrically connecting the first microchip element to one or more electronic components which are fixed on a second side of the first PCB.   
     
     
         13 . The method of  claim 12 , wherein the first PCB comprises at least one via electrically connecting at least one of the one or more electronic components to the first microchip element. 
     
     
         14 . The method of  claim 13 , wherein the at least one via is electrically connected to a metallized conductive surface on the second side of the first PCB, and the metallized conductive surface is wirebonded to the first microchip element. 
     
     
         15 . The method of  claim 12 , further comprising:
 providing a second electronic printed circuit board (PCB) which comprises a biocompatible ceramic substrate, wherein the second PCB has a first side on which one or more electronic components are fixed and an opposed second side; and   securing a metal housing ring to the first PCB and to the second PCB with the first side of the first PCB oriented facing toward the first side of the second PCB,   wherein the first and second PCBs and the housing ring together define a hermetically sealed enclosure containing the one or more electronic components of the first and second PCBs.   
     
     
         16 . The method of  claim 15 , wherein the biocompatible ceramic substrate of the first PCB, the second PCB, or both the first and second PCBs comprise alumina. 
     
     
         17 . The method of  claim 15 , wherein the implantable drug delivery device does not have a feedthrough and a metal housing.