Composition for radiation shielding

Abstract

A composition and method for spray-applying a two-part, self-setting composition containing a dopant that provides a hazard shielding component and is particularly adapted for delivering the components of the composition at a temperature that promotes their spray application as well as a self-setting reaction. The method includes selecting a self-setting compound that is adapted for curing in place once applied, the self-setting compound including at least one dopant material; and applying the compound to a hazard to be encapsulated such as a radiological, lead, asbestos, or PCB. Alternately, a self-curing compound includes a multi-part compound which, upon a mixing of the parts, chemically reacts and cures, and at least one dopant material dispersed into at least one of the parts, wherein the dopant material is selected for providing radiation shielding upon application of the compound.

What is claimed: 
     
         1 . A composition for encapsulating a hazardous substrate, comprising:
 a two-part epoxy including a resin component and a hardener/activator component;   a dopant material blended into said two-part epoxy, said dopant being suitable for shielding against a hazard to be encapsulated.   
     
     
         2 . The composition of  claim 1 , wherein said dopant is a particulate material selected from the group consisting of: transition metals and post transition metals. 
     
     
         3 . The composition of  claim 1 , wherein said dopant is a particulate material selected from the group consisting of: tungsten, lead, copper, aluminum, iron, nickel, cobalt and zinc. 
     
     
         4 . The composition of  claim 1 , wherein said dopant is a particulate material selected from the group consisting of: boron and lithium. 
     
     
         5 . The composition of  claim 1 , wherein said dopant includes a heavier metal \ to provide for shielding of gamma radiation and a material with a high neutron absorption cross-section for neutron absorption. 
     
     
         6 . The composition of  claim 1 , wherein the activator component is provided at about 170 degrees Fahrenheit to 180 degrees Fahrenheit and the resin component is provided at about 190 degrees Fahrenheit to 220 degrees Fahrenheit. 
     
     
         7 . The composition of  claim 1 , wherein the hazard to be encapsulated is selected from the group consisting of: radiological, lead, asbestos and PCB hazards. 
     
     
         8 . The composition of  claim 1 , wherein said 2 part epoxy is polyethylene resin in a coating thicker than 22 cm.