Parasitic channel mitigation using silicon carbide diffusion barrier regions

Abstract

III-nitride materials are generally described herein, including material structures comprising III-nitride material regions and silicon-containing substrates. Certain embodiments are related to gallium nitride materials and material structures comprising gallium nitride material regions and silicon-containing substrates.

What is claimed is: 
     
         1 . A semiconductor structure, comprising:
 a substrate comprising silicon and comprising at least a layer having a resistivity of greater than 10 2  Ohms-cm;   a diffusion barrier region comprising silicon carbide located over a surface of the substrate; and   a III-nitride material region located over the diffusion barrier region comprising silicon carbide.   
     
     
         2 . The semiconductor structure of  claim 1 , wherein the peak of the sum of the concentrations of Group III species in the substrate is less than about 10 17 /cm 3 . 
     
     
         3 . The semiconductor structure of  claim 1 , wherein the peak of the sum of the concentrations of Al, Ga, and In in the substrate is less than about 10 17 /cm. 
     
     
         4 . The semiconductor structure of  claim 1 , wherein the peak concentration of Al, Ga, and/or In in the substrate is less than about 10 17 /cm 3 . 
     
     
         5 . The semiconductor structure of  claim 1 , wherein the substrate comprises a surface region associated with the surface of the substrate, and the surface region comprises a low-conductivity parasitic channel or the substrate is free of a parasitic channel. 
     
     
         6 . The semiconductor structure of  claim 5 , wherein the low-conductivity parasitic channel has a peak free carrier concentration that is less than about 10 17 /cm 3 . 
     
     
         7 . The semiconductor structure of  claim 5 , wherein the low-conductivity parasitic channel has a total integrated surface region charge of less than about 10 12 /cm 2 . 
     
     
         8 . A method of forming a semiconductor structure, comprising:
 forming a diffusion barrier region comprising silicon carbide over a substrate comprising silicon, the substrate comprising at least a layer having a resistivity of greater than 10 2  Ohms-cm; and   forming a III-nitride material region over the diffusion barrier region comprising silicon carbide.   
     
     
         9 - 15 . (canceled) 
     
     
         16 . The semiconductor structure of  claim 1 , wherein the substrate is a silicon substrate. 
     
     
         17 . The semiconductor structure of  claim 16 , wherein the substrate is a bulk silicon wafer. 
     
     
         18 . The semiconductor structure of  claim 16 , wherein the substrate is a silicon-on-insulator substrate. 
     
     
         19 . The semiconductor structure of  claim 1 , wherein the substrate is a silicon carbide substrate. 
     
     
         20 . The semiconductor structure of  claim 1 , wherein the III-nitride material region comprises GaN. 
     
     
         21 . The semiconductor structure of  claim 1 , wherein the semiconductor structure comprises a transistor located over the substrate. 
     
     
         22 . The semiconductor structure of  claim 1 , wherein the III-nitride material region comprises a III-nitride nucleation layer. 
     
     
         23 . The semiconductor structure of  claim 1 , wherein the III-nitride material region comprises a III-nitride transition layer. 
     
     
         24 . The semiconductor structure of  claim 23 , wherein the III-nitride transition layer is compositionally graded. 
     
     
         25 . The semiconductor structure of  claim 1 , wherein the III-nitride material region comprises a III-nitride buffer layer. 
     
     
         26 . The semiconductor structure of  claim 1 , wherein the III-nitride material region comprises a III-nitride device region. 
     
     
         27 - 29 . (canceled)