Thermal conducting structure applied to network control automation system

Abstract

The present disclosure provides a thermal conducting structure applied to a network control automation system and including a circuit module and a heat dissipation structure. The circuit module defines bare copper regions disposed at two opposite side ends thereof, and copper foil layers are disposed on the bare copper regions. The heat dissipation structure disposed at two opposite lateral sides thereof, and each of the side panels defines a track member formed between the outer shell member and the two side panels thereof. The copper foil layers can be mounted along the sliding edges, and the outer shell member is then pushed to the circuit board, so that the circuit board is positioned in a chamber. Heat generated by the heat source can be conducted through the copper foil layers, to increase entire heat dissipation area and further improve the heat dissipation efficiency of overall thermal conducting structure.

What the invention claimed is: 
     
         1 . A thermal conducting structure applied to a network control automation system, comprising a circuit module and a heat dissipation structure,
 said circuit module comprising a circuit board and at least one heat source disposed on said circuit board, and said circuit board defining bare copper regions disposed at two opposite side ends thereof, and copper foil layers disposed on said bare copper regions and configured for conducting heat generated during operation of said at least one heat source;   said heat dissipation structure comprising an outer shell member which has opposite side panels respectively disposed at two opposite lateral sides thereof, and each of said side panels defining a track member which has a sliding edge to cover said copper foil layer for forming thermal conducting path, an accommodation open chamber formed between said outer shell member and side panels thereof to receive and position said circuit board therein.   
     
     
         2 . The thermal conducting structure as claimed in  claim 1 , wherein said heat generated during operation of said at least one heat source of said circuit module is conducted to said copper foil layers via said circuit board through said thermal conducting path, and said at least one heat source can be a FPGA chip, a CPU, a chip set or an image processor. 
     
     
         3 . The thermal conducting structure as claimed in  claim 1 , wherein said circuit board of said circuit module comprises a plurality of ports and a panel disposed at a front part thereof, said panel defines a plurality of hollow parts cut therethrough to mount and expose said plurality of ports, and each of said ports can be a power connector or network connector, so that said circuit module can be a network interface card matching with Ethernet-network-based fieldbus technology. 
     
     
         4 . The thermal conducting structure as claimed in  claim 1 , wherein said circuit board of said circuit module comprises a plurality of fastening parts located thereon and around said heat source, and said fastening parts are combined with a heat conducting module which comprises a base plate configured to respectively contact said heat source and said outer shell member of said heat dissipation structure for forming thermal conducting paths. 
     
     
         5 . The thermal conducting structure as claimed in  claim 4 , wherein each of said fastening parts of said circuit board has a bolt, and said base plate of said heat conducting module defines a plurality of first punches cut therethrough and corresponding to said fastening parts, and positioning elements are respectively inserted into said first punches for screwing into said bolts, so as to combine said circuit board and said heat conducting module integrally. 
     
     
         6 . The thermal conducting structure as claimed in  claim 4 , wherein a side end of said base plate of said heat conducting module is bent and extended towards said circuit board to form at least one smooth-shaped first contact plate which is used to abut with a surface of said heat source, and said first contact plate is then bent and outwardly extended to form a bent part, and said bent part is then bent and reversely extended in parallel with said first contact plate to form a smooth-shaped second contact plate which is used to abut with said outer shell member of said heat dissipation structure. 
     
     
         7 . The thermal conducting structure as claimed in  claim 6 , wherein a thermal medium is disposed on said first contact plate of said base plate of said heat conducting module and configured to elastically attach with a surface of said heat source. 
     
     
         8 . The thermal conducting structure as claimed in  claim 6 , wherein a thermal medium is disposed on said second contact plate of said base plate of said heat conducting module and configured to elastically attach with a surface of said heat source. 
     
     
         9 . The thermal conducting structure as claimed in  claim 1 , wherein said track member of said heat dissipation structure comprises a sliding edge which is formed by being outwardly extended first and then bent inwardly, and said sliding edge defines a sliding slot extended along a horizontal direction, and said copper foil layers of said circuit module are slidably mounted into and abutted with said sliding slot. 
     
     
         10 . The thermal conducting structure as claimed in  claim 9 , wherein said copper foil layers of said circuit module define a plurality of mounting holes cut therethrough and respectively located at corners of said circuit board, each of said sliding edges of said track members of said heat dissipation structure defines lugs located at said openings of front and rear ends of said sliding slot respectively and outwardly extended, each of said lugs has a second punch, and fixing elements are respectively penetrated through said mounting holes and said second punches respectively, so as to combine said circuit module and said heat dissipation structure integrally.