Apparatus and method for electrostatic spraying or electrostatic coating of a thin film

Abstract

Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device ( 100 ), which forms a resist film ( 108 ) on a substrate by electrostatic spraying, comprises: a nozzle ( 102 ) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film ( 108 ) toward a substrate ( 105 ) having stepped portions ( 105 a ); a driving means ( 111 ) for causing relative movement of the substrate ( 105 ) or the nozzle ( 102 ); and a control means ( 110 ) for controlling such that the resist film ( 108 ) is formed on the substrate ( 105 ) having the stepped portions ( 105 a ) by the liquid particles.

1 . An insulating film forming method for forming an insulating film on a work by electrostatic spraying or electrostatic coating, comprising:
 applying a prescribed voltage to a nozzle;   spraying or applying particles of a liquid agent as ingredients of the insulating film from the nozzle toward or to the work; and   forming the insulating film on the work using the particles of the liquid agent.   
     
     
         2 . An interconnection forming method for forming an interconnection on a work by at least one of electrostatic spraying and electrostatic coating, comprising:
 applying a first voltage between a first nozzle and the work;   forming an insulating film on the work using a first liquid agent as first ingredients of the interconnection by spraying the first liquid agent toward the work according to the first voltage;   applying a second voltage between a second nozzle and the work; and   forming a conductive film on the work using a second liquid agent as second ingredients of the interconnection by coating the work with the second liquid agent according to the second voltage.   
     
     
         3 . A wiring structural body,
 wherein a wiring structure of at least one of bumps and interconnections is formed by at least one of electrostatic spraying and electrostatic coating.