Solid state light fixture with enhanced thermal cooling and color mixing

Abstract

Various system embodiments comprise a substrate of high thermal conductivity, a solid state light emitting device, an electric circuit, and an electric dielectric. The device has a die and a connection point to the die with a low thermal resistance. The connection point is in contact with the substrate. The electric circuit is electrically connected to the light emitting device, and separated from the substrate by the electrical dielectric. Various system embodiments comprise at least four color sources; and a contoller configured to calculate a solution to form a target color using the color sources when the target is outside of a gamut formed by the color sources. The controller is configured to find an equivalent target color with reduced saturation.

1 . A system, comprising:
 a substrate of high thermal conductivity;   a solid state light emitting device, the device having a die and a connection point to the die with a low thermal resistance, wherein the connection point is in contact with the substrate;   an electric circuit electrically connected to the light emitting device; and   an electrical dielectric separating the electric circuit from the substrate,   wherein both the electric circuit and the electrical dielectric have holes through which the connection point is thermally connected to the substrate.   
     
     
         2 . The system of  claim 1 , further comprising a heat pipe in the substrate positioned to pass below the light emitting device, wherein the heat pipe is configured to dissipate heat away from the light emitting device. 
     
     
         3 . The system of  claim 2 , further comprising a cooling system, wherein the heat pipe is configured to dissipate heat away from the substrate proximate to the light emitting device to the cooling system. 
     
     
         4 . The system of  claim 2 , further comprising a cooling system with fluid conduits, wherein fluid in the fluid conduits remove heat away from the substrate proximate to the light emitting device to the cooling system. 
     
     
         5 . The system of  claim 1 , further comprising:
 a plurality of solid state light emitting devices, each of the solid state light emitting devices having a die and a connection point to the die with a low thermal resistance, wherein the connection point is in contact with the substrate;   a mixing chamber, wherein the mixing chamber includes an exit aperture, and wherein the solid state light emitting devices are within the mixing chamber and around the exit aperture; and   an optical system configured to receive light exiting from the mixing chamber through the exit aperture.   
     
     
         6 . The system of  claim 5 , further comprising a plurality of heat pipes arranged to form chords in a shape that circumscribes the exit aperture, wherein the chords are positioned beneath the solid state light emitting devices. 
     
     
         7 . A system, comprising:
 a thermally conductive substrate;   an electric circuit;   an electric dielectric separating the electric circuit from the substrate, the electric circuit and the electric dielectric having an opening to the thermally conductive substrate;   a light emitting diode (LED) package electrically connected to the electric circuit, the LED package being mechanically and thermally connected to the thermally conductive substrate through the opening in the electric circuit and the electric dielectric.   
     
     
         8 . The system of  claim 7 , wherein the LED package includes an LED die, and further includes at least one solder connection point with low thermal resistance to the LED die, the at least one solder connection point being attached to the thermally conductive substrate to provide the mechanical and thermal connection between the LED package and the thermally conductive substrate, the at least one solder connection point providing a thermal conduction path from the LED die to the thermally conductive substrate. 
     
     
         9 . The system of  claim 7 , wherein the system includes a printed circuit board, the printed circuit board (PCB) including the thermally conductive substrate, the electric circuit and the electric dielectric. 
     
     
         10 . The system of  claim 9 , wherein the PCB has a planar construction of the thermally conductive substrate, the electric circuit, and the electric dielectric between the thermally conductive substrate and the electric circuit. 
     
     
         11 . The system of  claim 7 , further comprising:
 at least one other LED package, the LED packages providing colored light with at least two separate wavelengths; and   a mixing chamber having an exit aperture, the mixing chamber configured to combine the colored light and output the combined light through the exit aperture with homogenous chromaticity and intensity.   
     
     
         12 . The system of  claim 11 , further comprising an optical system, wherein the system is configured and arranged for the combined light exiting the exit aperture to be received by the optical system. 
     
     
         13 . The system of  claim 12 , wherein the thermally conductive substrate includes an opening with a periphery through which the combined light passes from the exit aperture of the mixing chamber to the optical system, the LED packages being positioned about the periphery of the opening. 
     
     
         14 . The system of  claim 13 , further comprising heat pipes within the thermally conductive substrate and operably proximate to the LED packages to transfer heat from the LED packages to the heat pipes, wherein the heat pipes circumscribe the periphery of the opening and to form cords that run radially outward from the opening. 
     
     
         15 . The system of  claim 11 , further comprising a heat pipe within the thermally conductive substrate and operably proximate to the LED package to transfer heat from the LED package to the heat pipe. 
     
     
         16 . The system of  claim 7 , wherein the system is configured to move liquid to transfer heat away from the thermally conductive substrate to a heat dissipation body. 
     
     
         17 . A system, comprising:
 a printed circuit board (PCB), including a thermally conductive substrate with a planar surface, an electric dielectric layer in contact with the planar surface of the substrate, and an electric circuit layer in contact with the electric dielectric;   the electric dielectric having an opening to provide an accessible portion of the thermally conductive substrate, and the accessible portion of the thermally conductive substrate having an exit opening through which light may pass;   light emitting diode (LED) packages, the LED packages providing colored light with at least two separate wavelengths, each LED package being electrically connected to the electric circuit, each LED package including and LED die, and further including at least one solder connection point with low thermal resistance to the LED die, the at least one solder connection point being attached to the accessible portion of the thermally conductive substrate to provide the mechanical and thermal connection between the LED package and the thermally conductive substrate, the at least one solder connection point providing a thermal conduction path from the LED die to the thermally conductive substrate; and   a mixing chamber having an exit aperture, the mixing chamber configured to combine the colored light and output the combined light with homogenous chromaticity and intensity through the exit aperture and the exit opening within the accessible portion of the thermally conductive substrate.   
     
     
         18 . The system of  claim 17 , further comprising an optical system configured, wherein the system is configured and arranged for the combined light exiting the exit aperture to be received by the optical system. 
     
     
         19 . The system of  claim 17 , wherein the LED packages being positioned about the periphery of the opening. 
     
     
         20 . The system of  claim 17 , further comprising heat pipes within the thermally conductive substrate and operably proximate to the LED packages to transfer heat from the LED packages to the heat pipes, wherein the heat pipes circumscribe the periphery of the opening and to form cords that run radially outward from the opening.