Systems and Devices for Cerebral Aneurysm Repair

Abstract

An embolization device for treating ischemic stroke is disclosed, having a surface, wherein the body portion is configured to have a radiopaque and electropositive surface under physiological conditions when the device is emplaced, which ionically binds a blood component in an amount effective to promote stability of device in situ to bind to a tissue component in an amount effective to increase adhesion of the device as compared to a device without an electropositive surface. Embolic coils being so delivered are electrolytically detachable in under 10 seconds, according to the disclosed vascular implant systems.

1 . An embolization device, comprising:
 a body portion having a surface, wherein the body portion is configured to have a radiopaque and electropositive surface under physiological conditions when the device is implanted into an artery, aneurysm or vesicle; and   wherein the surface is sufficiently visualized and electropositive such that the surface ionically binds a blood component in an amount effective to promote stability of device in the artery, aneurysm or vesicle, or to bind to a tissue component in an amount effective to increase adhesion of the device as compared to a device without electropositive surface.   
     
     
         2 . The embolization device of  claim 1  wherein the body portion comprises a metal. 
     
     
         3 . The embolization device of  claim 1  wherein the body portion has a laser cut spiral geometry. 
     
     
         4 . The embolization device of  claim 2  wherein the surface comprises a radiopaque and electropositive metal. 
     
     
         5 . The embolization device of  claim 4  wherein the electropositive metal comprises tantalum, and the device is an embolic coil. 
     
     
         6 . A method of forming an embolization device, comprising:
 providing an embolization device having a body portion with a surface;   treating the surface such that the surface is electropositive under physiological conditions when the device is implanted into an aneurysm or vesicle; and,   wherein the surface is sufficiently electropositive such that the surface ionically binds a blood component in an amount effective to promote stability of devices in the artery, aneurysm or vesicle, or to bind a tissue component in an amount effective to increase adhesion of the device as compared to a device without electropositive surface.   
     
     
         7 . The method of  claim 6 , wherein the step of treating the surface comprises coating at least part of the surface with an electropositive metal. 
     
     
         8 . The method of  claim 7  wherein the stop of coating comprises vapor deposition of the metal. 
     
     
         9 . The method of  claim 7  wherein the electropositive metal comprises tantalum. 
     
     
         10 . The embolization device of  claim 1 , wherein the stainless steel wire extends proximally from the electrolytically detachable zone which it comprises to the proximal end of the elongate pushing member. 
     
     
         11 . The embolization device of  claim 1 , wherein a detachment time ranges from at least about 5 to approximately 12 seconds. 
     
     
         12 . The embolization device of  claim 1 , wherein a detachment time ranges from at least about 4 to approximately 11 seconds. 
     
     
         13 . The embolization device of  claim 1 , wherein detachment time is achieved in less than 10 seconds.