Radiation curable etch resistant inkjet ink printing

Abstract

An inkjet printing radiation curable inkjet ink for forming a protective layer during an etching process includes at least 70 percent by weight of a polymerizable composition based on the total weight of radiation curable inkjet ink, wherein the polymerizable composition has an oxygen fraction OFR>0.250 and a weighted polymerizable functionality WPF≧0.0050, and the polymerizable composition contains no polymerizable compound with an ethylenic double bond and including a phosphoester group or a carboxylic acid group in the molecule thereof.

1 . (canceled) 
     
     
         2 . A radiation curable inkjet ink for etch resist comprising:
 at least 70 percent by weight of a polymerizable composition based on a total weight of the radiation curable inkjet ink; wherein   the polymerizable composition has an oxygen fraction OFR>0.250 and a weighted polymerizable functionality WPF≧0.0050;   
       
         
           
             
               OFR 
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                         15.9994 
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                     WPF 
                   
                 
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         n=a number of polymerizable compounds in the polymerizable composition having a different chemical structural formula from each other; 
         N O,i =a number of oxygen atoms in polymerizable compound i;N P,i =a number of polymerizable groups in the polymerizable compound i; 
         MW i =a molecular weight of the polymerizable compound i; % wt i =a weight percentage of the polymerizable compound i based on the total weight of the radiation curable inkjet ink; 
         % wt P =a weight percentage of the polymerizable composition based on the total weight of the radiation curable inkjet ink; and 
         the polymerizable composition contains no polymerizable compound with an ethylenic double bond including a phosphoester group and contains no polymerizable compound with an ethylenic double bond and a carboxylic acid group. 
       
     
     
         3 . The radiation curable inkjet ink for etch resist according to  claim 2 , wherein the polymerizable composition contains at least one polymerizable compound selected from the group consisting of 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, 2-(2′-vinyloxyethoxy)ethyl acrylate, triethyleneglycol diacrylate, triethyleneglycol dimethacrylate, propoxylated neopentylglycol diacrylate, propoxylated glycerine triacrylate, trimethylolpropane trimethylacrylate, tripropylene glycol diacrylate, diethylene glycol diacrylate, dipropylene glycol diacrylate, ethoxylated trimethylolpropane triacrylate, and propoxylated trimethylolpropane triacrylate. 
     
     
         4 . The radiation curable inkjet ink for etch resist according to  claim 2 , wherein the n polymerizable compounds all have a viscosity of less than 40 mPa·s at 25° C. 
     
     
         5 . An etched metal or alloy printed with a polymerized radiation curable inkjet ink for etch resist according to  claim 2 . 
     
     
         6 . The etched metal or alloy according to  claim 5 , wherein the etched metal or alloy contains copper. 
     
     
         7 . The etched metal or alloy according to  claim 5 , further comprising a radiation curable inkjet legend ink, wherein the radiation curable inkjet legend ink includes a polymerizable composition having an oxygen fraction OFR≦0.250 and a weighted polymerizable functionality WPF≦0.0055.