US2017100736A1PendingUtilityA1

Film formation method and film formation apparatus for thin film

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Assignee: SHINCRON CO LTDPriority: May 23, 2014Filed: Apr 24, 2015Published: Apr 13, 2017
Est. expiryMay 23, 2034(~7.9 yrs left)· nominal 20-yr term from priority
B05B 16/60C03C 2217/76B05D 5/083B05B 9/04B05B 14/20B05B 13/0221B05D 2203/35B05D 1/02C03C 2218/15B05D 3/0493C03C 17/30B05B 17/04B05B 15/0418
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Claims

Abstract

A method for forming a thin film having durability at a low cost is provided. A film formation apparatus 1 is used in the film formation method. The apparatus 1 comprises a vacuum container 11 in which a substrate 100 is placed at a lower part, a vacuum pump 15 for exhaust inside the container 11 , a storage container 23 for storing a coating agent 21 provided outside the container 11 , and a nozzle having an ejection part 19 capable of ejecting the coating agent 21 at its one end. A solution including two or more kinds of materials including a first material (S 1 ) and a second material (S 2 ) having a higher vapor pressure (P 2 ) than a vapor pressure (P 1 ) of the Si is used as the coating agent 21 . The coating agent 21 is ejected to the substrate in an atmosphere with a pressure higher than P 1 and lower than P 2.

Claims

exact text as granted — not AI-modified
1 . A film formation method for forming a thin film (excluding an organic EL film) on a substrate, wherein a solution or suspension composed of two or more kinds of materials including a first material (S 1 ) as a component of a constituting material of the thin film and a second material (S 2 ) as a component for the S 1  to be dissolved or dispersed therein is ejected to the substrate, which is not heated, in an atmosphere with a pressure higher than a vapor pressure (P 1 ) of the S 1  and lower than a vapor pressure (P 2 ) of the S 2 , then, in a time period immediately after the solution or suspension is ejected until after it reaches the substrate, the S 2  in the solution or suspension is evaporated, and the S 1  remained thereby is deposited to form the thin film. 
     
     
         2 . The film formation method according to  claim 1 , wherein film formation is performed by an inline type having a conveying mechanism. 
     
     
         3 . A film formation apparatus used for forming a thin film (excluding an organic EL film) on a substrate comprising:
 a vacuum container wherein a substrate as a film formation subject is placed,   an exhaust means for exhausting inside the vacuum container,   a storage container for storing a solution or suspension composed of two or more kinds of materials including a first material (S 1 ) as a component of a constituting material of the thin film and a second material (S 2 ) as a component for the S 1  to be dissolved or dispersed therein,   a nozzle for ejecting the solution or suspension to the substrate, and   a control means for sending an instruction of ejecting the solution or suspension from the nozzle to the substrate, which is not heated, when a pressure in the vacuum container becomes a pressure higher than the vapor pressure (P 1 ) of the S 1  and lower than the vapor pressure (P 2 ) of the S 2 , then, in a time period immediately after the solution or suspension is ejected until after it reaches the substrate, evaporating the S 2  in the solution or suspension, and depositing the S 1  remained thereby so as to form the thin film.   
     
     
         4 . The film formation apparatus according to  claim 3 , being an inline type provided with a conveying mechanism for conveying a substrate. 
     
     
         5 . The film formation method according to  claim 1 , wherein a pressure in an atmosphere of ejecting a solution or suspension is set to be higher than P 1  by 7 or more digits or higher. 
     
     
         6 . The film formation method according to  claim 1 , wherein a pressure in an atmosphere of ejecting a solution or suspension is set to be higher than P 1  and to be a value of 1/16 of P 2  or larger. 
     
     
         7 . The film formation method according to  claim 5 , wherein film formation is performed by an inline type provided with a conveying mechanism. 
     
     
         8 . The film formation method according to  claim 6 , wherein film formation is performed by an inline type provided with a conveying mechanism. 
     
     
         9 . The film formation method according to  claim 5 , wherein the control means sends an instruction of ejecting a solution or suspension from a nozzle when a pressure in the vacuum container becomes a pressure higher than P 1  by 7 or more digits or higher. 
     
     
         10 . The film formation apparatus according to  claim 5 , wherein the control means sends an instruction of ejecting a solution or suspension from a nozzle when a pressure in the vacuum container becomes higher than P 1  and to be a value of 1/16 of P 2  or larger. 
     
     
         11 . The film formation apparatus according to  claim 9 , being an inline type provided with a conveying mechanism for conveying a substrate. 
     
     
         12 . The film formation apparatus according to  claim 10 , being an inline type provided with a conveying mechanism for conveying a substrate.

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