Integrated circuit package mold assembly

Abstract

An integrated circuit (“IC”) package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach side with a plurality of dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the upper substrate faces upwardly. A lower mold platen defines a lower mold cavity for receiving a lower substrate having a die attach side with a plurality dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the lower substrate faces downwardly.

What is claimed is: 
     
         1 . An integrated circuit (“IC”) package mold assembly comprising:
 an upper mold platen defining an upper mold cavity for receiving an upper substrate having a die attach side with a plurality of dies mounted thereon and a non-attach side with no dies mounted thereon, wherein said die attach side is facing upwardly; and 
 a lower mold platen defining a lower mold cavity for receiving a lower substrate having a die attach side with a plurality dies mounted thereon and a non-attach side with no dies mounted thereon, wherein said die attach side of said lower substrate is facing downwardly. 
 
     
     
         2 . The assembly of  claim 1  wherein said upper and lower mold platens comprises at least one pair of aligned projections extending into said mold cavities for engaging said upper and lower substrates therebetween. 
     
     
         3 . The assembly of  claim 1  further comprising a single runner in fluid communication with said upper and lower mold cavities. 
     
     
         4 . An integrated circuit (“IC”) package mold assembly comprising:
 an upper mold platen defining an upper mold cavity; 
 a lower mold platen defining a lower mold cavity; 
 an upper substrate positioned in said upper mold cavity and having a plurality of integrally connected substrate portions, each said upper substrate portion having a die attach side and a non-attach side, IC dies being mounted on said die attach sides of said plurality of upper substrate portions; and 
 a lower substrate positioned in said lower mold cavity and having a plurality of integrally connected lower substrate portions, each lower substrate portion having a die attach side and a non-attach side, IC dies being mounted on said die attach sides of said plurality of lower substrate portions; 
 wherein said upper and lower substrates are positioned with said non-attach sides of said substrate portions thereof positioned in facing relationship. 
 
     
     
         5 . The assembly of  claim 4  wherein said upper and lower substrates comprise upper and lower leadframe substrates and further comprising a liner positioned between said upper and lower leadframe substrates. 
     
     
         6 . The assembly of  claim 4  wherein said upper and lower substrates comprises nFBGA (New Fine Pitch Ball Grid Array) substrates. 
     
     
         7 . The assembly of  claim 4  wherein said upper and lower substrates comprises flex-tape substrates. 
     
     
         8 . The assembly of  claim 4  wherein said upper and lower substrates have aligned holes extending therethrough. 
     
     
         9 . The assembly of  claim 8  further comprising a liner positioned between said upper and lower substrates and having holes therein aligned with said holes in said upper and lower substrates. 
     
     
         10 . The assembly of  claim 9  wherein each of said upper and lower substrates comprise leadframe sheet substrates with leadframe corner connection structures that connect leadframe portions on each corresponding leadframe sheet substrate;
 wherein said leadframe corner connection structures have openings therein that are aligned with corresponding ones of said holes extending through said liner. 
 
     
     
         11 . The assembly of  claim 8 , said upper and lower mold cavities being filled with mold compound that fills said aligned holes extending through said substrates. 
     
     
         12 . A method of making integrated circuit (“IC”) packages comprising:
 placing first and second IC package substrates having a plurality of individual portions associated with individual IC packages in non-attach side facing, mirror image relationship; 
 placing the first and second substrates in a mold having upper and lower cavities with the first substrate positioned in an upper mold platen cavity and the second substrate positioned in a lower mold platen cavity that is in fluid communication with the upper mold platen cavity; and 
 filling the upper and lower mold cavities with molten mold compound. 
 
     
     
         13 . The method of  claim 12  further comprising engaging aligned portions of the first and second IC package substrates with opposite mold platen projections. 
     
     
         14 . The method of  claim 13  further comprising producing a plurality of holes extending through aligned portions of the first and second substrates. 
     
     
         15 . The method of  claim 14  further comprising flowing mold compound into the mold to mold the two substrates including flowing mold compound through the plurality of holes to form connecting structures to hold the two molded substrates together. 
     
     
         16 . The method of  claim 15  further comprising:
 curing the mold compound; and 
 removing connecting structures holding the molded substrates together. 
 
     
     
         17 . The method of  claim 16  further comprising separating the molded substrates. 
     
     
         18 . The method of  claim 17  further comprising dicing the separated molded substrates. 
     
     
         19 . The method of  claim 15  further comprising dicing the connected molded substrates. 
     
     
         20 . The method of  claim 19  further comprising removing the connecting structure during said dicing.