US2017106494A1PendingUtilityA1

Polishing device

40
Assignee: TOYO SEIKAN GROUP HOLDINGS LTDPriority: Jul 2, 2014Filed: Dec 30, 2016Published: Apr 20, 2017
Est. expiryJul 2, 2034(~8 yrs left)· nominal 20-yr term from priority
B24B 21/16B24B 37/34B24B 21/14B24B 21/22B24B 37/20B24B 21/006B24B 9/16
40
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Claims

Abstract

An object of the present invention is to provide the diamond polishing device having a function capable of performing polishing even a surface of a semi-closed space such as an inner circumferential surface of a cylinder member or a ring member. The polishing device of the present invention includes a polishing member having a long shape, means for delivering and winding the polishing member, a polishing member support that holds the polishing member to be capable of being wound and displaced, a base to which the polishing member support is attached, and pressing means for pressing the base toward a machining surface of a member to be polished. The base includes an extending section that extends in a direction different from the pressing direction. The polishing member support is disposed at a distal end portion of the extending section.

Claims

exact text as granted — not AI-modified
1 . A polishing device comprising:
 a polishing member having a linear shape or a belt shape;   means for delivering and winding the polishing member;   a polishing member support that holds the polishing member to be capable of being wound and displaced;   a base to which the polishing member support is attached; and   pressing means for pressing the base toward a machining surface of a member to be polished, wherein   the base includes an extending section that extends in a direction different from the pressing direction, and   the polishing member support is disposed at a distal end portion of the extending section.   
     
     
         2 . The polishing device according to  claim 1 , wherein the means for delivering and winding the polishing member is attached on the base. 
     
     
         3 . The polishing device according to  claim 1 , wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal. 
     
     
         4 . The polishing device according to  claim 2 , wherein the direction in which the polishing member is pressed toward the machining surface of the member to be polished is horizontal. 
     
     
         5 . The polishing device according to  claim 1 , wherein the polishing device is used for polishing of diamond or a diamond film. 
     
     
         6 . The polishing device according to  claim 2 , wherein the polishing device is used for polishing of diamond or a diamond film. 
     
     
         7 . The polishing device according to  claim 3 , wherein the polishing device is used for polishing of diamond or a diamond film. 
     
     
         8 . The polishing device according to  claim 5 , wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide. 
     
     
         9 . The polishing device according to  claim 6 , wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide. 
     
     
         10 . The polishing device according to  claim 7 , wherein the polishing member has a surface made of metal easily reactive with carbon, carburizing metal, or metal oxide. 
     
     
         11 . The polishing device according to  claim 8 , further comprising heating means for heating the polishing member and/or the member to be polished. 
     
     
         12 . The polishing device according to  claim 9 , further comprising heating means for heating the polishing member and/or the member to be polished. 
     
     
         13 . The polishing device according to  claim 10 , further comprising heating means for heating the polishing member and/or the member to be polished.

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