US2017106627A1PendingUtilityA1
Metallic Materials with Embedded Luminescent Particles
Est. expiryJun 10, 2030(~3.9 yrs left)· nominal 20-yr term from priority
C25D 15/00B32B 2264/102C25D 3/56C23C 18/1653G07D 5/00C23C 18/1646C25D 3/40B32B 15/01G07D 7/12C23C 18/1662C23C 18/1637C23C 18/36B32B 2307/422C25D 7/005C25D 7/00C25D 5/10C25D 3/12C25D 3/22C25D 3/38G07F 7/0813C23C 18/31C25D 3/58C25D 17/16Y10T428/12493C25D 5/02
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Claims
Abstract
Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for depositing a metal layer having embedded luminescent particles onto a metal substrate, comprising:
mixing the luminescent particles with a metallic material to produce a plating solution; inserting the metal substrate into the plating solution; and performing a plating process to coat the metal substrate with the metal layer, wherein the metal layer contains embedded luminescent particles, wherein the plating process is an electroless plating process.
2 . A method according to claim 1 , wherein the embedded luminescent particles have a composition configured to emit energy comprising a second wavelength when excited by energy comprising a first wavelength.
3 . The method of claim 2 , wherein the plated metal layer is selected from the group consisting of nickel, nickel-phosphorus, copper, brass, gold, silver, and platinum.
4 . The method of claim 3 , wherein the metal substrate is selected from the group consisting of copper, brass, bronze, mild steel, stainless steel, and titanium.
5 . The method of claim 1 , wherein the metal substrate is a negotiable coin.
6 . The method of claim 1 , wherein the luminescent particles have a density of 5.0 g/cm3 or more.
7 . The method of claim 1 , wherein the density of the luminescent particles is greater than 7.4 g/cm3
8 . The method of claim 1 , wherein the luminescent particles comprise rare earth doped yttrium oxide-based phosphors.
9 . The method of claim 1 , wherein the luminescent particles comprise rare earth doped gadolinium oxide-based phosphors.
10 . A metal substrate comprising an electroless plated metal layer on the metal substrate, the electroless plated metal layer containing embedded luminescent particles.
11 . The metal substrate of claim 10 , wherein the embedded luminescent particles have a composition configured to emit energy comprising a second wavelength when excited by energy comprising a first wavelength.
12 . The metal substrate of claim 11 , wherein the electroless plated metal layer is selected from the group consisting of nickel, nickel-phosphorus, copper, brass, gold, silver, and platinum.
13 . The metal substrate of claim 11 , wherein the metal substrate is selected from the group consisting of copper, brass, bronze, mild steel, stainless steel, and titanium.
14 . The metal substrate of claim 10 , wherein the metal substrate is a negotiable coin.
15 . The metal substrate of claim 10 , wherein the luminescent particles have a density of 5.0 g/cm3 or more.
16 . The metal substrate of claim 10 , wherein the density of the luminescent particles is greater than 7.4 g/cm3
17 . The metal substrate of claim 10 , wherein the luminescent particles comprise rare earth doped yttrium oxide-based phosphors.
18 . The metal substrate of claim 10 , wherein the luminescent particles comprise rare earth doped gadolinium oxide-based phosphors.Join the waitlist — get patent alerts
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