Aluminum plating solution, method for manufacturing aluminum film, and porous aluminum object

Abstract

Provided is an aluminum plating solution capable of continuously manufacturing an aluminum film, the surface of which is smooth and which has good elongation. The aluminum plating solution capable of electrodepositing aluminum on a surface of a base contains, as components, (A) an aluminum halide, (B) at least one compound selected from the group consisting of alkylimidazolium halides, alkylpyridinium halides, and urea compounds, and (C1) at least one selected from the group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phosphine compounds, and sulfide compounds. The component (C1) has, as at least one side chain, a straight-chain or branched alkyl group having 8 or more and 36 or less carbon atoms. A mixing ratio of the component (A) and the component (B) is in a range of 1:1 to 3:1 in terms of molar ratio. A concentration of the component (C1) is 1.0 g/L or more and 45 g/L or less.

1 . An aluminum plating solution capable of electrodepositing aluminum on a surface of a base,
 the aluminum plating solution comprising, as components:   (A) an aluminum halide;   (B) at least one compound selected from the group consisting of alkylimidazolium halides, alkylpyridinium halides, and urea compounds; and   (C1) at least one selected from the group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phosphine compounds, and sulfide compounds,   wherein the component (C1) has, as at least one side chain, a straight-chain or branched alkyl group having 8 or more and 36 or less carbon atoms,   a mixing ratio of the component (A) and the component (B) is in a range of 1:1 to 3:1 in terms of molar ratio, and   a concentration of the component (C1) is 1.0 g/L or more and 45 g/L or less.   
     
     
         2 . An aluminum plating solution capable of electrodepositing aluminum on a surface of a base,
 the aluminum plating solution comprising, as components:   (A) an aluminum halide;   (B) at least one compound selected from the group consisting of alkylimidazolium halides, alkylpyridinium halides, and urea compounds;   (C2) at least one selected from the group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phosphine compounds, and sulfide compounds; and   (D) at least one selected from the group consisting of alkyl halides, alkynes, alkenes, and alkanes,   wherein the component (C2) has, as at least one side chain, a straight-chain or branched alkyl group having 1 or more and 36 or less carbon atoms,   the component (D) is a straight-chain or branched compound having 3 or more and 36 or less carbon atoms,   a mixing ratio of the component (A) and the component (B) is in a range of 1:1 to 3:1 in terms of molar ratio,   a concentration of the component (C2) is 1.0 g/L or more and 45 g/L or less, and   a concentration of the component (D) is 0.5 g/L or more and 8.5 g/L or less.   
     
     
         3 . The aluminum plating solution according to  claim 1 , wherein the component (A) is aluminum chloride, and the component (B) is 1-ethyl-3-methylimidazolium chloride. 
     
     
         4 . A method for manufacturing an aluminum film, the method comprising electrodepositing aluminum on a surface of a base by using the aluminum plating solution according to  claim 1 . 
     
     
         5 . A porous aluminum object obtained by using the aluminum plating solution according to  claim 1 , the porous aluminum object having a three-dimensional mesh-like structure and an elongation of 1.5% or more. 
     
     
         6 . The porous aluminum object according to  claim 5 , wherein a crystal grain size in a cross section of a skeleton is 1 μm or more and 50 μm or less. 
     
     
         7 . The porous aluminum object according to  claim 5 , wherein a content of aluminum carbide is 0.8% by mass or less.