Isothermal Cooking Plate Apparatus, System, and Method of Manufacture and Use

Abstract

An isothermal cooking plate assembly is formed from a first plate of high thermal conductivity material having a back surface and an oppositely disposed top cooking surface. One or more heater circuit assemblies are disposed on the first plate back surface for forming a composite having a back surface. A controller is in electrical connection with the heater circuit assemblies for controlling temperature of the first plate of high thermal conductivity material. The first plate can be substantially pure one or more aluminum, substantially pure copper, or aluminum nitride. The first plate can be a laminate formed from a clad bottom metal layer and clad top cooking surface metal layer, where the clad layers formed from the same material and having about the same thickness. The clad material can be austenitic stainless steel. A second plate of low thermal conductivity material can be attached to the composite back surface.

1 - 28 . (canceled) 
     
     
         29 . A method of manufacturing the isothermal cooking plate assembly of claim  21 , which comprises the steps of:
 (a) providing a first plate of a high thermal conductivity material having a top cooking surface and an oppositely disposed back surface;   (b) providing one or more flexible substrate heating circuits; and   (c) bonding one or more flexible substrate heating circuits to said first plate back surface:
 (i) using an electrically insulative and thermally conductive adhesive if the heating element is bonded directly to the first plate back surface of said first plate; or 
 (ii) using a thermally conductive adhesive if the electrically insulative; and 
 (iii) attaching a second plate of low thermal conductivity material to the first plate back surface on which the one or more flexible substrate heating circuits heating circuits are affixed. 
   
     
     
         30 - 31 . (canceled)