Rack level pre-installed interconnect for enabling cableless server/storage/networking deployment

Abstract

Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

What is claimed is: 
     
         1 . A method, comprising:
 operatively coupling a first extremely high frequency (EHF) transceiver chip to a first component in a first chassis;   operatively coupling a second EHF transceiver chip to a second component in a second chassis;   coupling a plastic cable waveguide to at least one of the first chassis, the second chassis, or a rack in which the first and second chassis are installed, the plastic cable waveguide configured to couple millimeter-wave radio frequency (RF) signals output from the first EHF transceiver chip into the plastic cable waveguide and to communicatively couple the millimeter-wave RF signals to the second EHF transceiver chip; and   facilitating communication between the first and second components by transmitting a millimeter-wave RF signal from the first EHF transceiver chip to the second EHF transceiver chip via the plastic cable waveguide.   
     
     
         2 . The method of  claim 1 , wherein the first and second chassis are installed in the same rack. 
     
     
         3 . The method of  claim 1 , wherein the first and second chassis are installed in separate racks. 
     
     
         4 . The method of  claim 1 , wherein the first and second EHF transceiver chips use a 60 GHz carrier frequency. 
     
     
         5 . The method of  claim 1 , wherein the communication between the first and second components has a bandwidth of 6 gigabits per second. 
     
     
         6 . The method of  claim 1 , wherein the millimeter-wave RF signal is transmitted via the plastic cable waveguide by transmitting a millimeter-wave RF signal from an antenna of the first EHF transceiver chip toward a first end of the plastic cable waveguide, wherein the first end comprises the first millimeter-wave radio frequency (RF) coupling means and is configured to couple the millimeter-wave RF signal into the plastic cable waveguide. 
     
     
         7 . The method of  claim 1 , wherein the plastic cable waveguide includes a dielectric manifold that is configured to coupled millimeter-wave RF signals between the plastic cable waveguide and an EHF transceiver chip. 
     
     
         8 . The method of  claim 1 , further comprising facilitating a bi-directional communication link between the first and second component EHF transceiver chips via the plastic cable waveguide. 
     
     
         9 . The method of  claim 1 , wherein the plastic cable waveguide includes a plurality of legs along a portion of its length, the method further comprises:
 coupling millimeter-wave RF signals into each of the plurality of legs transmitted from a respective EHF transceiver chip disposed proximate to that leg; and   coupling millimeter-wave RF signals out of each of the plurality of legs toward the respective EHF transceiver chip disposed proximate to that leg.   
     
     
         10 . An apparatus comprising:
 a first chassis, including a first component contained therein and having a first extremely high frequency (EHF) transceiver chip operatively coupled in communication with the first component;   a second chassis, including a second component contained therein having a second EHF transceiver chip operatively coupled in communication therewith; and   a first plastic waveguide, operatively coupled to the first and second chassis, having a first end proximate to the first EHF transceiver chip and a second end proximate to the second EHF transceiver chip, wherein when the first plastic waveguide is configured to facilitate a bi-directional millimeter-wave communication link between the first and second EFH transceiver chips when the first and second components are operating.   
     
     
         11 . The apparatus of  claim 10 , further wherein the first EHF transceiver chip is located within a chassis frame of the first chassis, and the chassis frame includes a hole proximate to the first EHF transceiver chip that is configured to enable millimeter-wave RF signals transmitted from and received by the first EHF transceiver chip to be passed through the hole. 
     
     
         12 . The apparatus of  claim 10 , wherein the first component comprises a network interface component or network adaptor. 
     
     
         13 . The apparatus of  claim 10 , wherein the first component comprises a server blade or server module to which the first EHF transceiver chip is coupled. 
     
     
         14 . The apparatus of  claim 10 , wherein the first component comprises a backplane to which the first EHF transceiver chip is mounted. 
     
     
         15 . The apparatus of  claim 10 , wherein the first and second EHF transceiver chips use a 60 GHz carrier frequency. 
     
     
         16 . An apparatus, comprising:
 a chassis frame including a metal top plate in which a plurality of holes are formed;   a backplane, mounted to the chassis frame proximate to the metal top plate, having a plurality of extremely high frequency (EHF) transceiver chips mounted thereto, wherein the plurality of EHF transceiver chips are aligned with the plurality of holes formed in the metal top plate; and   at least one plastic waveguide having a plurality of legs, each leg disposed proximate to a respective EHF transceiver chip,   wherein upon operation of the apparatus, millimeter-wave radio frequency (RF) signals transmitted from each EHF transceiver chip is coupled into the plastic waveguide via the leg that is disposed proximate to the EHF transceiver chip.   
     
     
         17 . The apparatus of  claim 16 , wherein the backplane further comprises switching circuitry that is communicatively coupled to the plurality of EHF transceiver chips and a plurality of network connectors commutatively coupled to the switching circuitry. 
     
     
         18 . The apparatus of  claim 16 , wherein at least one of the plurality of the legs extends through a respective hole in the metal top plate. 
     
     
         19 . The apparatus of  claim 16 , wherein the plurality of EHF transceiver chips are configured in a plurality of rows, and the apparatus further comprises a respective plastic waveguide having a plurality of legs for each row, wherein each leg of the respective plastic waveguide is disposed proximate to a respective EHF transceiver chip in the row.