Porous Polishing Pad and Preparing Method of the Same

Abstract

The present disclosure relates to a porous polishing pad including pores formed by a reaction between a prepolymer and a saccharide material, and a method of preparing the porous polishing pad.

1 . A method of preparing a porous polishing pad, comprising:
 dispersing a saccharide material in a prepolymer; and   preparing a polishing pad in which pores are formed in the prepolymer by a reaction between the prepolymer and the saccharide material.   
     
     
         2 . The method of preparing a porous polishing pad of  claim 1 ,
 wherein an unreacted saccharide material which does not react with the prepolymer is dispersed on the pores.   
     
     
         3 . The method of preparing a porous polishing pad of  claim 1 ,
 wherein the saccharide material includes a monosaccharide material, a disaccharide material, or a polysaccharide material.   
     
     
         4 . The method of preparing a porous polishing pad of  claim 3 ,
 wherein the polysaccharide material includes a sugar-alcohol.   
     
     
         5 . The method of preparing a porous polishing pad of  claim 1 ,
 wherein the saccharide material includes a member selected from the group consisting of galactose, fructose, glucose, lactose, maltose, dextrin, sucrose, glycerin, xylitol, sorbitol, arabitol, erythritol, ribitol, mannitol, galactitol, maltitol, lactitol, and combinations thereof.   
     
     
         6 . The method of preparing a porous polishing pad of  claim 1 ,
 wherein the saccharide material includes a liquid phase, a solid phase, or a mixed phase thereof.   
     
     
         7 . The method of preparing a porous polishing pad of  claim 6 ,
 wherein the saccharide material in the solid phase has a particle size of from 0.01 μm to 1,000 μm.   
     
     
         8 . The method of preparing a porous polishing pad of  claim 1 ,
 wherein a curing agent is added during the reaction between the prepolymer and the saccharide material.   
     
     
         9 . The method of preparing a porous polishing pad of  claim 8 ,
 wherein the curing agent includes a member selected from the group consisting of 4,4′-methylene-bis(2-chloroaniline), 4,4′-methylene-bis(3-chloro-2,6-diethyl aniline), dimethyl thio toluenediamine, trimethylene glycol di-p-aminobenzoate, polytetramethylene oxide di-p-aminobenzoate, polytetramethylene oxide mono-p-aminobenzoate, polypropylene oxide di-p-aminobenzoate, polypropyleneoxide mono-p-aminobenzoate, 1,2-bis(2-aminophenylthio)ethane, 4,4′-methylene-bis-aniline, diethyltoluenediamine, 5-tert-butyl-2,4-toluenediamine, 3-tert-butyl-2,6-toluenediamine, 5-tert-amyl-2,4-toluenediamine, 3-tert-amyl-2,6-toluenediamine, chlorotoluenediamine, and combinations thereof.   
     
     
         10 . A porous polishing pad including pores which are chemically and physically formed by a saccharide material, which is prepared by the method of  claim 1 .