Isothermal Cooking Plate Apparatus, System, and Method of Manufacture and Use

Abstract

An isothermal cooking plate assembly is formed from a first plate of high thermal conductivity material having a back surface and an oppositely disposed top cooking surface. One or more heater circuit assemblies are disposed on the first plate back surface for forming a composite having a back surface. A controller is in electrical connection with the heater circuit assemblies for controlling temperature of the first plate of high thermal conductivity material. The first plate can be substantially pure one or more aluminum, substantially pure copper, or aluminum nitride. The first plate can be a laminate formed from a clad bottom metal layer and clad top cooking surface metal layer, where the clad layers formed from the same material and having about the same thickness. The clad material can be austenitic stainless steel. A second plate of low thermal conductivity material can be attached to the composite back surface.

1 - 9 . (canceled) 
     
     
         10 . A method of manufacturing the isothermal cooking plate assembly of claim  1 , which comprises the steps of:
 (a) providing a first plate of a high thermal conductivity material having a top cooking surface and an oppositely disposed back surface;   (b1) affixing heating circuits on said first plate back surface by:
 (i) depositing a first electrically insulative layer on the first plate if the first plate is metallic; 
 (ii) depositing a second electrically resistive heating element layer on the first plate back surface or on the first electrically insulative layer; and 
 (iii) depositing a third electrically conductive lead and contact pad layer in electrical communication with the electrically resistive heating element; or 
   (b2) affixing heating circuits on said first plate back surface by:
 depositing first electrically resistive heating element layer on first plate if first plate is electrically insulative; and 
 (ii) depositing second electrically conductive lead and contact pad layer in electrical communication with electrically resistive heating element; or 
   (b3) affixing heating circuits on said first plate back surface by:
 (i) affixing heating circuits on the plate back surface using high-temperature, electrically resistive, thermally conductive adhesive, said heating circuit comprising a flexible substrate heater circuit assembly. 
   
     
     
         11 - 31 . (canceled)